Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XA3S50-4VQG100I: High-Performance Automotive-Grade Spartan-3 FPGA for Industrial Applications

Product Details

Overview of XA3S50-4VQG100I FPGA

The XA3S50-4VQG100I is an automotive-grade Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) renowned Spartan-3 family. Engineered specifically for high-reliability automotive and industrial applications, this programmable logic device delivers exceptional performance with 50,000 system gates, advanced 90nm CMOS technology, and industrial temperature range capabilities. As a cost-effective solution for embedded systems, the XA3S50-4VQG100I offers designers the flexibility to implement custom digital logic while maintaining strict automotive quality standards.

Key Technical Specifications

Core FPGA Performance Characteristics

Specification Value
Logic Cells 1,728 cells
System Gates 50,000 gates
Maximum Frequency 630 MHz
Process Technology 90nm CMOS
Supply Voltage 1.2V core
Package Type 100-Pin VTQFP (VQG100)
Speed Grade -4 (industrial)
Temperature Range -40°C to +100°C (Industrial/Automotive)

Advanced Memory and I/O Features

Feature Specification
Configurable Logic Blocks (CLBs) 192 CLBs
Block RAM 72 Kbits distributed
User I/O Pins 79 programmable I/O
Digital Clock Managers (DCMs) 2 DCMs
Global Clock Buffers 8 BUFGMUX
Configuration Memory SRAM-based

Product Features and Benefits

Why Choose XA3S50-4VQG100I FPGA?

Automotive-Grade Reliability The XA3S50-4VQG100I is designed and tested to meet stringent automotive requirements, making it ideal for mission-critical applications in harsh environments. The extended industrial temperature range (-40°C to +100°C) ensures reliable operation in automotive, aerospace, and industrial control systems.

Cost-Effective Programmable Logic Solution As part of the Spartan-3 family, this Xilinx FPGA provides an optimal balance between performance, features, and cost, making it perfect for volume production in consumer electronics, automotive systems, and industrial automation.

Flexible Digital Logic Implementation With 1,728 logic cells and 50K system gates, designers can implement complex digital functions including DSP algorithms, custom processors, communication protocols, and control logic with ease.

Advanced FPGA Capabilities

Enhanced Clock Management

  • Dual Digital Clock Managers (DCMs) for precise clock synthesis
  • Multiply, divide, and phase-shift clock signals
  • Reduce clock distribution delay with DLL technology
  • Support for multiple clock domains

Versatile I/O Architecture

  • 79 user-configurable I/O pins supporting multiple standards
  • LVTTL, LVCMOS, LVDS, and differential signaling support
  • Programmable drive strength and slew rate control
  • Input delay and output setup/hold time optimization

Technical Architecture Details

Spartan-3 FPGA Internal Structure

Component Quantity Description
Slice Count 768 slices Basic logic building blocks (4 per CLB)
LUT Resources 1,536 4-input LUTs Configurable logic functions
Flip-Flops 1,728 registers Sequential logic elements
Block SelectRAM 4 blocks × 18 Kbits Dual-port embedded memory
Multipliers 4 dedicated 18×18 Hardware multiply acceleration
DCM Units 2 clock managers Advanced clock synthesis

Power Consumption Profile

Operating Mode Typical Power
Static Power 0.3W (typical)
Dynamic Power Varies with design utilization
I/O Power Depends on I/O standards used
Recommended Supply 1.2V ±5% core, 3.3V/2.5V I/O

Application Areas

Primary Use Cases for XA3S50-4VQG100I

Automotive Electronics

  • Engine control units (ECU)
  • Advanced driver assistance systems (ADAS)
  • Infotainment system processing
  • Body control modules
  • Sensor data processing

Industrial Control Systems

  • Programmable logic controllers (PLC)
  • Motor control applications
  • Factory automation equipment
  • Process control systems
  • Robotic control interfaces

Communication Equipment

  • Protocol bridging and conversion
  • Custom communication interfaces
  • Data acquisition systems
  • Network processing equipment
  • Signal processing applications

Consumer Electronics

  • Digital video processing
  • Audio processing systems
  • Gaming console components
  • Home automation controllers
  • Smart appliance control

Package and Pin Configuration

VQG100 Package Dimensions

Package Parameter Specification
Package Type VTQFP (Very Thin Quad Flat Pack)
Pin Count 100 pins
Body Size 14mm × 14mm
Pin Pitch 0.5mm
Package Height 1.0mm (max)
Mounting Type Surface mount

Pin Distribution

  • Dedicated Configuration Pins: 8 pins
  • Dedicated Clock Input Pins: 4 pairs
  • User I/O Pins: 79 pins
  • Power and Ground Pins: Multiple for proper decoupling
  • JTAG Boundary Scan: 4 pins (TDI, TDO, TMS, TCK)

Design Tools and Programming Support

Compatible Development Tools

FPGA Design Software

  • ISE Design Suite (Legacy support)
  • Vivado Design Suite (for newer designs migrating from Spartan-3)
  • Third-party synthesis tools support

Programming and Debug

  • JTAG configuration interface
  • Slave serial configuration mode
  • Master serial configuration mode
  • Boundary-scan testing capability
  • ChipScope Pro debugging integration

Configuration Options

Configuration Mode Description
Master Serial FPGA controls external PROM
Slave Serial External controller provides bitstream
Master Parallel Parallel configuration for faster loading
JTAG IEEE 1149.1 boundary scan configuration
Slave Parallel High-speed parallel configuration

Quality and Compliance Standards

Automotive Certifications

The XA3S50-4VQG100I meets rigorous automotive quality standards:

  • AEC-Q100 Qualified: Automotive Electronics Council standard
  • Extended Temperature Range: -40°C to +100°C operation
  • Enhanced Testing: Additional automotive-specific stress tests
  • Long-term Reliability: Designed for automotive product lifecycles
  • RoHS Compliant: Lead-free manufacturing process

Quality Metrics

Quality Parameter Specification
MTBF >1,000,000 hours
ESD Protection Human Body Model (HBM) tested
Latch-up Immunity JEDEC standard compliant
Moisture Sensitivity MSL 3 (Moisture Sensitivity Level)

Performance Benchmarks

Speed and Timing Characteristics

Maximum Toggle Frequencies

  • Internal logic: 630 MHz (speed grade -4)
  • I/O pins: Varies by standard (up to 622 Mbps DDR)
  • Block RAM: 270 MHz minimum
  • DCM output: 350 MHz maximum

Propagation Delays

  • LUT delay: <0.5ns typical
  • Routing delay: Depends on placement
  • I/O delay: 1-3ns depending on standard
  • Clock-to-out: <1ns for registered outputs

Comparison with Related Products

Spartan-3 Family Comparison

Model Logic Cells Gates Block RAM I/O (100-pin) Speed Grade
XA3S50-4VQG100I 1,728 50K 72 Kbits 79 -4
XC3S200 4,320 200K 216 Kbits 141 -4/-5
XC3S400 8,064 400K 288 Kbits N/A -4/-5
XC3S1000 17,280 1M 432 Kbits N/A -4/-5

Advantages Over Standard XC3S50

The “XA” automotive variant offers:

  • Extended temperature range qualification
  • Enhanced screening and testing procedures
  • Automotive-grade quality certification (AEC-Q100)
  • Longer product lifecycle support
  • Traceability and lot control for automotive production

Getting Started with XA3S50-4VQG100I

Development Board Options

While the XA3S50-4VQG100I is typically used in production systems, similar Spartan-3 devices are supported on:

  • Digilent Spartan-3 Starter Board
  • Custom automotive development platforms
  • Industrial evaluation modules
  • Third-party FPGA development kits

Design Resources

Available Documentation

  • Complete datasheet with electrical specifications
  • User guide for Spartan-3 architecture
  • Configuration guide and application notes
  • PCB layout guidelines for VQG100 package
  • Automotive design best practices

Online Support

  • AMD (Xilinx) Forums and community support
  • Application notes library
  • Reference designs for common applications
  • Technical support portal access

Ordering Information and Package Marking

Part Number Breakdown

XA3S50-4VQG100I decoding:

  • XA: Automotive-grade product family
  • 3S: Spartan-3 FPGA series
  • 50: 50K system gates
  • -4: Speed grade (industrial temperature)
  • VQG100: Package type and pin count
  • I: Industrial temperature range

Lead Time and Availability

Due to the specialized automotive nature of this device, lead times may vary. Contact authorized distributors for:

  • Current stock availability
  • Volume pricing information
  • Custom screening options
  • Delivery schedules
  • Long-term supply agreements

Design Considerations and Best Practices

Power Supply Design

Recommended Power Architecture

  1. Core voltage: 1.2V regulated supply with ±5% tolerance
  2. I/O banks: 2.5V or 3.3V depending on interface requirements
  3. Auxiliary supply: 2.5V for VCCAUX
  4. Decoupling: Multiple 0.1µF and 10µF capacitors per power pin

Current Requirements

  • Static current: ~250mA typical
  • Dynamic current: Varies with design (estimate 50-200mA additional)
  • I/O current: Up to 24mA per pin (depending on drive strength)

Thermal Management

Parameter Specification
Junction Temperature 125°C maximum
Theta-JA ~40°C/W (VQG100 package)
Recommended Airflow Natural convection to 2 m/s
Heatsink Optional for high-power designs

PCB Layout Guidelines

Critical Layout Considerations

  • Dedicated power planes for VCCINT (1.2V) and VCCO (I/O voltages)
  • Extensive ground plane coverage for noise immunity
  • Short, controlled-impedance traces for high-speed signals
  • Proper decoupling capacitor placement (<5mm from pins)
  • Thermal vias under package for heat dissipation
  • Adequate spacing from high-noise components

Frequently Asked Questions

Q: What is the difference between XA3S50 and XC3S50? A: The XA prefix indicates automotive-grade qualification with extended temperature range (-40°C to +100°C), enhanced testing, and AEC-Q100 compliance. XC devices are commercial/industrial grade.

Q: Can I use ISE Design Suite for this FPGA? A: Yes, Xilinx ISE Design Suite versions 10.1 through 14.7 fully support Spartan-3 devices including the XA3S50-4VQG100I.

Q: What configuration modes are supported? A: The device supports Master Serial, Slave Serial, Master Parallel, Slave Parallel, and JTAG configuration modes.

Q: Is this suitable for safety-critical automotive applications? A: While AEC-Q100 qualified, specific functional safety certifications (ISO 26262) require additional system-level considerations and may need supplementary documentation.

Q: What is the expected product lifetime? A: Automotive-grade parts typically have 15+ year production commitments, with extended availability through authorized distributors.

Conclusion

The XA3S50-4VQG100I represents an excellent choice for automotive and industrial designers requiring reliable, cost-effective programmable logic. With its robust automotive-grade qualification, comprehensive feature set, and proven Spartan-3 architecture, this Xilinx FPGA delivers the performance and reliability needed for demanding embedded applications. Whether you’re designing advanced automotive control systems, industrial automation equipment, or specialized communication interfaces, the XA3S50-4VQG100I provides the flexibility and dependability your project demands.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.