Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XA3S400-4PQG208Q: Automotive-Grade Spartan-3A FPGA for Harsh Environment Applications

Product Details

The XA3S400-4PQG208Q represents AMD’s (formerly Xilinx) commitment to delivering reliable, automotive-qualified field-programmable gate array solutions for mission-critical applications. This FPGA combines the proven Spartan-3A architecture with enhanced temperature tolerance and reliability features, making it an ideal choice for automotive, industrial, and aerospace applications.

Overview: XA3S400-4PQG208Q FPGA Specifications

The XA3S400-4PQG208Q is a member of the XA Spartan-3A automotive FPGA family, specifically engineered to meet the demanding requirements of harsh operating environments. Built on 90nm process technology, this device delivers exceptional performance while maintaining cost-effectiveness for high-volume production.

Key Features of XA3S400-4PQG208Q

  • 400,000 System Gates for complex logic implementation
  • 8,064 Logic Cells providing extensive design flexibility
  • 141 User I/O Pins in 208-pin PQFP package
  • 294,912 bits of distributed RAM
  • 630 MHz maximum internal frequency
  • -40°C to +125°C extended temperature range
  • 1.2V Core Voltage for low power consumption
  • Speed Grade: -4 for optimized performance

XA3S400-4PQG208Q Technical Specifications

Core Architecture and Logic Resources

Specification Value
Device Family XA Spartan-3A Automotive
System Gates 400,000
Configurable Logic Blocks (CLBs) 896
Logic Cells 8,064
Total Block RAM 288 Kbits (16 blocks)
Distributed RAM 294,912 bits
Maximum User I/O 141

Memory Architecture

The XA3S400-4PQG208Q features a dual-port block RAM architecture that enables simultaneous read/write operations. Each 18Kbit block RAM can be configured in various aspect ratios to meet specific application requirements.

Memory Type Capacity Configuration Options
Block RAM (Total) 288 Kbits 16 blocks × 18 Kbits
Distributed RAM 294,912 bits Flexible configuration
RAM Access Modes Dual-port Independent A/B ports

Package and Pinout: 208-Pin PQFP Configuration

XA3S400-4PQG208Q Package Details

Package Parameter Specification
Package Type PQFP (Plastic Quad Flat Pack)
Pin Count 208 pins
Package Code PQG208
Lead Pitch 0.5mm
Body Size 28mm × 28mm
Package Height 3.4mm typical

The 208-pin PQFP package provides an optimal balance between I/O density and PCB routing ease, making the XA3S400-4PQG208Q suitable for space-constrained automotive and industrial designs.

Performance Characteristics

Operating Frequency and Timing

The speed grade -4 designation indicates the XA3S400-4PQG208Q’s performance tier:

  • Internal Clock Frequency: Up to 630 MHz
  • System Clock Performance: Optimized for automotive applications
  • DCM (Digital Clock Manager): Up to 4 independent DCMs
  • Clock Distribution: Dedicated low-skew global clock network

Power Consumption Profile

Operating Condition Typical Current
Core Voltage (VCCINT) 1.2V ± 5%
I/O Voltage (VCCO) 1.2V to 3.3V
Static Power Ultra-low standby current
Dynamic Power Design-dependent, optimized for efficiency

Automotive Qualification and Reliability

Extended Temperature Range Performance

The “XA” prefix designates this device as an automotive-qualified component meeting stringent reliability standards:

  • Operating Temperature: -40°C to +125°C (Junction)
  • Ambient Temperature: -40°C to +105°C
  • Storage Temperature: -65°C to +150°C

Quality and Compliance Standards

Standard Compliance
AEC-Q100 Qualification Grade 2 (-40°C to +125°C)
Production Part Approval Process (PPAP) Level 3 capable
Quality Management ISO/TS 16949 certified
RoHS Compliance RoHS 6/6 compliant

I/O Capabilities and Standards

Supported I/O Standards

The XA3S400-4PQG208Q supports multiple I/O standards for maximum interface flexibility:

I/O Standard Voltage Level
LVCMOS 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
LVTTL 3.3V
HSTL Class I, II, III, IV
SSTL 2, 3
PCI 33MHz, 66MHz
Differential LVDS, mini-LVDS, RSDS

Application Areas for XA3S400-4PQG208Q

Automotive Electronics

The XA3S400-4PQG208Q excels in automotive applications requiring high reliability:

  • Advanced Driver Assistance Systems (ADAS)
  • Engine Control Units (ECU)
  • Body Control Modules
  • Infotainment Systems
  • Dashboard Clusters
  • Safety Systems

Industrial and Aerospace Applications

Beyond automotive, this FPGA serves demanding industrial environments:

  • Industrial Automation Controllers
  • Motor Control Systems
  • Aerospace Avionics
  • Medical Equipment
  • Military Systems
  • Test and Measurement Equipment

Design Tools and Development Support

Compatible Development Software

Designing with the XA3S400-4PQG208Q requires Xilinx ISE Design Suite (legacy) or compatible tools:

Tool Category Recommended Software
Design Entry ISE WebPACK/Foundation/System Edition
Synthesis XST (Xilinx Synthesis Technology)
Implementation ISE Implementation Tools
Simulation ISim, ModelSim
Programming iMPACT, ChipScope Pro

Development Resources

Access comprehensive Xilinx FPGA design resources including reference designs, application notes, and technical documentation to accelerate your development cycle.

Configuration and Programming

Configuration Modes

Mode Description Typical Use Case
Master Serial FPGA controls config PROM Standalone systems
Slave Serial External controller drives config Multi-FPGA systems
Master SelectMAP Parallel configuration Fast boot applications
Slave SelectMAP Processor-driven config Processor-based systems
JTAG Boundary scan/debug Development and testing

Configuration Memory Requirements

  • Bitstream Size: Approximately 1.35 Mbits
  • Recommended PROM: XCF02S or larger
  • Configuration Time: < 100ms typical (Master Serial mode)

Comparison with Related Devices

XA Spartan-3A Family Options

Device System Gates Logic Cells Block RAM User I/O Package
XA3S200-4PQG208Q 200,000 4,320 216 Kbits 141 208-PQFP
XA3S400-4PQG208Q 400,000 8,064 288 Kbits 141 208-PQFP
XA3S1000-4FG456 1,000,000 17,280 432 Kbits 333 456-FBGA

Ordering Information and Part Number Decoder

Understanding XA3S400-4PQG208Q Part Number

Breaking down the complete part number:

  • XA = Automotive-qualified (extended temperature)
  • 3S = Spartan-3A generation
  • 400 = 400K system gates
  • -4 = Speed grade (performance tier)
  • PQG208 = 208-pin Plastic Quad Flat Pack, green/RoHS
  • Q = Qualification code (automotive grade)

Available Variations

Part Number Temperature Speed Grade Package
XA3S400-4PQG208Q -40°C to +125°C -4 208-PQFP
XA3S400-4PQG208I -40°C to +100°C -4 208-PQFP
XA3S400-4FTG256Q -40°C to +125°C -4 256-FBGA

Design Considerations and Best Practices

Thermal Management

Proper thermal design is critical for XA3S400-4PQG208Q reliability:

  • Junction Temperature: Monitor and maintain below maximum rating
  • Thermal Resistance (θJA): Approximately 40°C/W (board-dependent)
  • Heat Sink Recommendations: Consider for high-utilization designs
  • PCB Design: Use thermal vias and ground planes for heat dissipation

Power Supply Design Guidelines

Rail Voltage Tolerance Sequencing
VCCINT 1.2V ±5% First to rise
VCCO 1.2V-3.3V ±5% After VCCINT
VCCAUX 2.5V ±5% With VCCINT

PCB Layout Recommendations

  1. Decoupling Capacitors: Place 0.1µF and 10µF capacitors close to power pins
  2. Ground Planes: Implement solid ground planes for signal integrity
  3. High-Speed Signals: Use controlled impedance traces for critical paths
  4. Clock Distribution: Minimize skew with matched-length routing
  5. JTAG Accessibility: Provide easy access for programming and debug

Reliability and Longevity

Mean Time Between Failures (MTBF)

The XA3S400-4PQG208Q is designed for extended operational life in harsh environments:

  • Estimated MTBF: > 1,000,000 hours at 55°C
  • Configuration Memory Retention: > 20 years
  • Endurance Cycles: Unlimited reconfiguration capability
  • Data Retention: Non-volatile when used with configuration PROM

Environmental Resistance

Environmental Factor Rating
Moisture Sensitivity Level MSL 3
ESD Protection HBM Class 2 (>2000V)
Latch-up Immunity >200mA

Getting Started with XA3S400-4PQG208Q

Development Kit Recommendations

While AMD/Xilinx does not currently produce specific XA3S400 development boards, compatible Spartan-3A evaluation platforms include:

  • Spartan-3A Starter Kit (commercial grade equivalent)
  • Third-party automotive FPGA development boards
  • Custom evaluation boards from design service providers

Programming Interface Requirements

Essential equipment for XA3S400-4PQG208Q development:

  • Xilinx Platform Cable USB II or compatible JTAG programmer
  • Configuration PROM programmer (for standalone operation)
  • ISE Design Suite (version 14.7 final release)

Technical Support and Documentation

Available Resources

Access comprehensive technical documentation:

  1. Product Datasheet: Complete electrical and timing specifications
  2. User Guide: Detailed configuration and implementation guidelines
  3. Application Notes: Design best practices and solutions
  4. PCB Design Guidelines: Layout and routing recommendations
  5. Reliability Reports: Qualification test data and analysis

Conclusion: Why Choose XA3S400-4PQG208Q

The XA3S400-4PQG208Q automotive FPGA delivers a compelling combination of performance, reliability, and cost-effectiveness for harsh environment applications. With its extended temperature range, automotive qualification, and proven Spartan-3A architecture, this device provides engineers with a robust platform for implementing safety-critical and high-reliability systems.

Whether you’re designing advanced automotive electronics, industrial control systems, or aerospace applications, the XA3S400-4PQG208Q offers the flexibility and dependability required for mission-critical implementations. Its comprehensive I/O support, efficient power consumption, and extensive development tool ecosystem make it an excellent choice for modern embedded system designs.

Ready to Start Your Design?

Explore more Xilinx FPGA solutions and discover how the XA3S400-4PQG208Q can power your next automotive or industrial project. With proven reliability, comprehensive design support, and automotive-grade qualification, this FPGA provides the foundation for successful product development.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.