Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3S400A-4FTG256I: High-Performance Spartan-3A FPGA for Industrial Applications

Product Details

Overview of the XC3S400A-4FTG256I Field Programmable Gate Array

The XC3S400A-4FTG256I is a powerful Field-Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) renowned Spartan-3A family. This industrial-grade FPGA delivers exceptional performance with 400,000 system gates, making it an ideal choice for embedded systems, digital signal processing, and complex logic applications. Built on advanced 90nm technology, this programmable logic device offers engineers and designers the flexibility they need for modern electronic solutions.

Key Technical Specifications

Core FPGA Characteristics

Specification Value
Family Spartan-3A
Logic Cells 8,064 Cells
System Gates 400,000 Gates
Logic Blocks 896 CLBs
Maximum Frequency 667 MHz
Technology Node 90nm
Core Voltage 1.2V (1.14V to 1.26V)
I/O Voltage 3.3V

Memory and Storage Features

Memory Type Capacity
Total RAM Bits 368,640 bits
Block RAM Distributed throughout fabric
User I/O Pins 195 configurable I/Os

Package Information

Package Detail Specification
Package Type 256-pin FTBGA (Fine-Pitch BGA)
Package Code FTG256
Operating Temperature -40°C to +100°C (Industrial)
Moisture Sensitivity Level MSL 3 (168 hours)

Why Choose the XC3S400A-4FTG256I FPGA?

Superior Performance for Industrial Applications

The XC3S400A-4FTG256I stands out in the competitive Xilinx FPGA market with its robust industrial temperature range and reliable performance. This makes it perfect for:

  • Industrial automation and control systems
  • Telecommunications equipment
  • Medical devices and instrumentation
  • Automotive electronics
  • Consumer electronics
  • Embedded computing applications

Advanced Clock Management

This Spartan-3A FPGA features integrated Digital Clock Manager (DCM) technology, providing:

  • Precise frequency synthesis
  • Phase shifting capabilities
  • Clock distribution networks
  • Jitter reduction for stable timing

Flexible I/O Architecture

With 195 user-configurable I/O pins, the XC3S400A-4FTG256I supports:

  • Multiple I/O standards
  • Single-ended and differential signaling
  • LVDS, LVCMOS, and LVTTL interfaces
  • Programmable drive strength

Application Areas and Use Cases

Digital Signal Processing (DSP)

The XC3S400A-4FTG256I excels in DSP applications thanks to its:

  • High-speed data processing capabilities
  • Efficient multiply-accumulate operations
  • Parallel processing architecture
  • Low-latency data paths

Communication Systems

Ideal for telecommunications and networking equipment:

  • Protocol conversion and bridging
  • Data packet processing
  • Interface controllers
  • Baseband processing

Embedded Control Systems

Perfect for complex control applications:

  • Motor control algorithms
  • Real-time data acquisition
  • Sensor fusion and processing
  • Custom peripheral interfaces

Design and Development Support

Compatible Development Tools

Tool Category Software
Design Suite Xilinx ISE Design Suite
Synthesis XST (Xilinx Synthesis Technology)
Simulation ISim, ModelSim
Programming iMPACT, Platform Cable USB
Language Support VHDL, Verilog, Schematic Entry

Development Resources

Engineers working with this FPGA have access to:

  • Comprehensive datasheets and reference manuals
  • Application notes and design guides
  • IP cores and reference designs
  • Active developer community support
  • Evaluation boards and starter kits

Comparison with Alternative FPGAs

Spartan-3A Family Variants

Part Number Logic Cells I/O Pins Package
XC3S400A-4FTG256I 8,064 195 256-FTBGA
XC3S400A-4FG400C 8,064 311 400-FBGA
XC3S400A-4PQ208C 8,064 141 208-PQFP

Power Consumption and Thermal Management

Power Specifications

Power Parameter Typical Value
Core Voltage (VCCINT) 1.2V nominal
I/O Voltage (VCCIO) 3.3V (banks dependent)
Auxiliary Voltage (VCCAUX) 2.5V
Standby Current Low power mode available

Thermal Considerations

The industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh environments. Proper thermal management includes:

  • Heat sink compatibility with FTBGA package
  • Adequate PCB thermal vias
  • Airflow considerations for enclosed systems

Quality and Reliability

Manufacturing Standards

  • RoHS compliant
  • Lead-free package options available
  • Industrial-grade quality assurance
  • Extended temperature testing

Long-Term Availability

As part of AMD’s established Spartan-3A family, the XC3S400A-4FTG256I benefits from:

  • Proven track record in production environments
  • Extensive qualification testing
  • Long product lifecycle support
  • Broad distributor network

Programming and Configuration

Configuration Methods

Configuration Mode Description
Master Serial SPI flash-based configuration
Slave Serial External processor control
JTAG Boundary scan and programming
Master Parallel Fast parallel configuration

Configuration Memory

  • Supports standard SPI flash devices
  • In-system programmable (ISP)
  • Bitstream encryption available
  • Multi-boot configuration support

Purchase Considerations

Ordering Information

When ordering the XC3S400A-4FTG256I, verify:

  • Speed grade: -4 (commercial industrial range)
  • Package: FTG256 (256-pin Fine-pitch BGA)
  • Temperature range: I (Industrial: -40°C to +100°C)

Availability and Distribution

This FPGA is available through:

  • Authorized AMD/Xilinx distributors
  • Major electronics component suppliers
  • Global semiconductor distributors
  • Direct from manufacturer channels

Technical Support and Resources

Documentation Available

  • Product datasheet (DS529)
  • Family overview documentation
  • PCB design guidelines
  • Thermal management guides
  • Application notes

Community and Support

Access comprehensive support through:

  • AMD/Xilinx technical forums
  • FAE (Field Application Engineer) support
  • Online design communities
  • Training webinars and tutorials

Conclusion: The Ideal FPGA for Your Next Project

The XC3S400A-4FTG256I represents an excellent balance of performance, cost-effectiveness, and reliability. Whether you’re designing industrial control systems, telecommunications equipment, or embedded computing solutions, this Spartan-3A FPGA provides the resources and flexibility needed for successful implementation.

With 400K gates, 195 I/O pins, and industrial-grade temperature performance, the XC3S400A-4FTG256I delivers proven technology backed by AMD’s extensive FPGA expertise. Explore the possibilities of programmable logic with this versatile Xilinx FPGA solution and bring your innovative designs to life.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.