Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XA3S200-4PQG208I: Automotive-Grade FPGA for High-Reliability Applications

Product Details

Overview of XA3S200-4PQG208I Automotive FPGA

The XA3S200-4PQG208I is a high-performance automotive-grade Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx), specifically engineered for demanding automotive and industrial applications. As part of the Spartan-3 XA (Automotive) family, this FPGA delivers exceptional reliability, extended temperature operation, and AEC-Q100 qualification, making it the ideal choice for mission-critical automotive electronics systems.

With 200,000 system gates and 4,320 logic cells, the XA3S200-4PQG208I provides designers with flexible programmable logic capabilities for advanced driver assistance systems (ADAS), infotainment modules, instrument clusters, and automotive gateway systems. This Xilinx FPGA combines cost-effectiveness with automotive-grade reliability to meet the stringent requirements of modern vehicle electronics.


Key Features and Specifications

Logic Resources and Performance

Feature Specification
System Gates 200,000 gates
Logic Cells/Elements 4,320
Configurable Logic Blocks (CLBs) 480
Maximum Operating Frequency 630 MHz
Process Technology 90nm CMOS
Core Voltage 1.2V

Memory and I/O Configuration

Specification Details
Total RAM Bits 221,184 bits (27 KB)
Distributed RAM 27 KB
Input/Output Pins 141 I/O
Total Pins 208-pin PQFP
Package Type Plastic Quad Flat Pack (PQFP)

Temperature and Reliability Ratings

Parameter Value
Temperature Grade Industrial (I-grade)
Operating Temperature Range -40°C to +100°C (Junction Temperature)
AEC-Q100 Qualification Yes – Automotive Grade
Speed Grade -4 (4ns)
Mounting Type Surface Mount Technology (SMT)

Technical Architecture and Capabilities

Advanced FPGA Architecture

The XA3S200-4PQG208I features a sophisticated architecture derived from the proven Virtex-II platform technology. The FPGA incorporates:

  • 480 Configurable Logic Blocks (CLBs) providing flexible logic implementation
  • 221,184 RAM bits for embedded memory functions
  • 141 I/O pins supporting multiple voltage standards and interface protocols
  • Digital Clock Management (DCM) blocks for precise clock control and distribution
  • Dedicated multipliers for high-speed arithmetic operations

Logic Density and Computational Power

With 4,320 logic elements organized into 480 configurable logic blocks, the XA3S200-4PQG208I delivers approximately 200,000 equivalent system gates. This logic density enables complex digital signal processing algorithms, real-time control systems, high-speed data acquisition and processing, protocol conversion and communication interfaces, and state machine implementation for automotive controllers.


Applications in Automotive Electronics

Engine Management and Powertrain Control

The XA3S200-4PQG208I excels in automotive powertrain applications where reliability and real-time processing are critical: engine control unit (ECU) logic implementation, sensor signal conditioning and processing, fuel injection timing control, emissions monitoring systems, and transmission control algorithms.

Advanced Driver Assistance Systems (ADAS)

Modern ADAS implementations leverage the XA3S200-4PQG208I for sensor fusion from radar, LiDAR, and camera inputs, real-time object detection and tracking, lane departure warning systems, adaptive cruise control logic, and collision avoidance algorithms.

Infotainment and Connectivity

In-vehicle infotainment systems benefit from the FPGA’s flexibility in audio/video signal processing, display controller interfaces, CAN, LIN, FlexRay protocol handling, Bluetooth and Wi-Fi connectivity management, and user interface control logic.

Instrument Clusters and HMI

Digital instrument clusters utilize the XA3S200-4PQG208I for high-resolution graphics rendering, multi-display management, animation and effects processing, real-time data visualization, and touchscreen interface control.


Comparison with Related FPGA Models

Spartan-3 XA Family Comparison

Model System Gates Logic Cells CLBs RAM (bits) I/O (208-PQFP)
XA3S50 50,000 1,728 192 73,728 124
XA3S200 200,000 4,320 480 221,184 141
XA3S400 400,000 8,064 896 294,912 141

Frequently Asked Questions (FAQs)

What makes the XA3S200-4PQG208I suitable for automotive applications?

The XA3S200-4PQG208I is specifically qualified to AEC-Q100 automotive standards and features extended temperature operation from -40°C to +100°C. It undergoes rigorous automotive-grade testing including thermal cycling, humidity exposure, and electrical overstress qualification.

What is the difference between I-grade and Q-grade versions?

I-grade devices (like the XA3S200-4PQG208I) operate from -40°C to +100°C junction temperature, while Q-grade versions support -40°C to +125°C for more extreme automotive environments under the hood or near hot components.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.