Overview of XA3S1500-4FGG676I FPGA
The XA3S1500-4FGG676I is an automotive-grade Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-3A family. This industrial-grade programmable logic device delivers exceptional performance and reliability for mission-critical applications requiring extended temperature ranges and enhanced quality standards.
As part of the Spartan-3A series, this Xilinx FPGA combines cost-effectiveness with robust functionality, making it ideal for automotive, industrial control, aerospace, and defense applications where reliability is paramount.
Key Specifications and Features
Core Technical Specifications
| Parameter |
Specification |
| Part Number |
XA3S1500-4FGG676I |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Spartan-3A |
| Grade |
Automotive/Industrial (XA) |
| System Gates |
1.5 Million |
| Logic Cells |
29,952 |
| CLBs (Configurable Logic Blocks) |
3,328 |
| Block RAM |
576 Kbits (72 KB) |
| Maximum User I/O |
487 |
| Package Type |
FBGA (Fine-Pitch Ball Grid Array) |
| Pin Count |
676 pins |
| Package Dimensions |
27mm x 27mm |
| Operating Voltage |
1.2V (Core) |
| Technology Node |
90nm |
| Speed Grade |
-4 (Standard performance) |
| Operating Temperature Range |
-40°C to +125°C |
Advanced FPGA Capabilities
| Feature |
Details |
| DSP Slices |
32 dedicated 18×18 multipliers |
| DCM (Digital Clock Managers) |
4 units for advanced clock management |
| Maximum Clock Frequency |
Up to 667 MHz (internal) |
| I/O Standards Support |
LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V, 1.2V), PCI, SSTL, HSTL |
| Configuration Options |
Master Serial, Slave Serial, JTAG, SPI Flash |
| On-Chip Memory |
Distributed RAM and Block RAM |
| Differential Pairs |
High-speed LVDS support |
Understanding the XA Grade Advantage
What Makes XA3S1500-4FGG676I Special?
The “XA” prefix indicates this is an automotive and industrial grade component, offering significant advantages over standard commercial FPGAs:
| Feature |
XA Grade |
Commercial Grade (XC) |
| Temperature Range |
-40°C to +125°C |
0°C to +85°C |
| Quality Testing |
Enhanced screening and testing |
Standard testing |
| Reliability |
Extended MTBF (Mean Time Between Failures) |
Standard reliability |
| Applications |
Automotive, aerospace, industrial |
Consumer electronics |
| Traceability |
Full lot traceability |
Standard traceability |
| Qualification |
AEC-Q100 compliant (automotive) |
Standard qualification |
Performance Characteristics
Speed Grade Analysis
The -4 speed grade represents a balanced performance option for the XA3S1500:
- Logic Delay: Optimized for standard industrial applications
- Setup/Hold Times: Suitable for synchronous designs up to moderate frequencies
- Power Consumption: Lower than -5 speed grade, ideal for power-sensitive designs
- Thermal Management: Easier thermal design compared to faster speed grades
Clock Management System
The XA3S1500-4FGG676I features sophisticated clock management capabilities:
- 4 Digital Clock Managers (DCMs): Enable precise clock synthesis, phase shifting, and frequency multiplication/division
- Clock Frequency Range: 5 MHz to 667 MHz internal clock support
- Phase Shifting: Fine-grained phase adjustment for timing optimization
- Duty Cycle Correction: Built-in for improved signal integrity
Package Information: 676-Pin FBGA
FBGA Package Benefits
| Aspect |
Advantage |
| Size |
Compact 27mm x 27mm footprint |
| Pitch |
1.0mm ball pitch for reliable assembly |
| Thermal Performance |
Excellent heat dissipation through bottom-side balls |
| Signal Integrity |
Reduced parasitic inductance and capacitance |
| PCB Design |
Suitable for multi-layer boards with controlled impedance |
| Manufacturing |
Compatible with standard SMT assembly processes |
Pin Assignment Overview
- Power Pins: Multiple VCCINT (1.2V core) and VCCAUX (2.5V/3.3V auxiliary) pins
- I/O Banks: Organized into 8 banks for voltage flexibility
- Ground Pins: Distributed for optimal power integrity
- Configuration Pins: Dedicated JTAG, CCLK, and mode pins
- User I/O: Up to 487 programmable I/O pins
Memory Architecture
Dual-Port Block RAM
The XA3S1500-4FGG676I incorporates 32 Block RAMs, each providing:
- Size: 18 Kbits per block
- Total Capacity: 576 Kbits (72 KB)
- Configuration Options: Various width and depth configurations (18K x 1, 16K x 1, 8K x 2, 4K x 4, 2K x 9, 1K x 18, 512 x 36)
- Dual-Port Access: True dual-port operation for simultaneous read/write
- Pipelining: Built-in output registers for improved timing
Distributed RAM
- LUT-based RAM: Each LUT can function as 16×1 RAM
- Flexible Sizing: Configurable as single-port or dual-port
- High-Speed Access: Single-cycle read/write operations
Application Areas
Industrial Automation and Control
The XA3S1500-4FGG676I excels in:
- Motor Control: PWM generation, encoder interfaces, feedback control
- PLC Functions: Programmable logic controller implementations
- Process Control: Real-time monitoring and control systems
- Human-Machine Interfaces: Display controllers and touch interfaces
- Industrial Networking: PROFINET, EtherCAT, Modbus implementations
Automotive Systems
Ideal for automotive electronics requiring high reliability:
- Engine Control Units (ECU): Sensor interfaces and control algorithms
- Advanced Driver Assistance Systems (ADAS): Image processing, sensor fusion
- Infotainment Systems: Audio/video processing, connectivity interfaces
- Body Electronics: Lighting control, climate control, power management
- Battery Management: EV/HEV battery monitoring and control
Aerospace and Defense
Trusted for mission-critical aerospace applications:
- Avionics: Flight control interfaces, navigation systems
- Communication Systems: Software-defined radio, encryption
- Radar Processing: Signal processing, target tracking
- Satellite Systems: Telemetry, command and control
- Test Equipment: Automated test systems, instrumentation
Medical Equipment
Reliable performance for medical device applications:
- Diagnostic Equipment: Ultrasound processing, imaging systems
- Patient Monitoring: ECG, vital signs processing
- Laboratory Instruments: Analyzers, sequencing equipment
- Surgical Equipment: Robotic control, imaging guidance
Design Resources and Development Tools
Software Development Environment
| Tool |
Purpose |
| ISE Design Suite |
Legacy design tool for Spartan-3A (v14.7) |
| iMPACT |
Configuration and programming |
| ChipScope Pro |
On-chip debugging and analysis |
| XPower Analyzer |
Power estimation and optimization |
| CORE Generator |
IP core integration |
IP Core Support
The XA3S1500-4FGG676I supports numerous IP cores:
- Communication Protocols: UART, SPI, I2C, CAN, Ethernet MAC
- Memory Controllers: DDR, DDR2, SDRAM interfaces
- Signal Processing: FIR filters, FFT, DDS
- Video Processing: Video scalers, color space converters
- Processor Cores: MicroBlaze soft processor
Power Consumption and Thermal Considerations
Power Supply Requirements
| Rail |
Voltage |
Typical Current |
Purpose |
| VCCINT |
1.2V ± 5% |
Varies with design |
Core logic power |
| VCCAUX |
2.5V or 3.3V |
100-500mA |
Auxiliary circuits |
| VCCO |
1.2V to 3.3V |
Varies by I/O |
I/O bank power (8 banks) |
Thermal Management
- Junction Temperature: Maximum 125°C (XA grade)
- Thermal Resistance: θJA varies with airflow and PCB design
- Power Dissipation: Dependent on design utilization and switching frequency
- Cooling Solutions: Heat sinks recommended for high-utilization designs
Configuration and Programming
Configuration Methods
The XA3S1500-4FGG676I supports multiple configuration modes:
| Mode |
Description |
Use Case |
| Master Serial |
FPGA controls external SPI Flash |
Standalone systems |
| Slave Serial |
External processor controls configuration |
Processor-based systems |
| JTAG |
IEEE 1149.1 boundary scan |
Development and debugging |
| Master SPI |
Direct SPI Flash control |
Fast boot applications |
Configuration Memory Options
- SPI Flash: Compatible with standard SPI Flash devices (e.g., Micron N25Q series)
- Platform Flash: Xilinx Platform Flash PROM
- External Processor: Microcontroller or CPU-controlled configuration
Quality and Reliability
Automotive Grade Qualification
The XA3S1500-4FGG676I meets stringent automotive standards:
- AEC-Q100 Grade 2: -40°C to +125°C qualification
- Zero Defect Manufacturing: Enhanced quality control
- Lot Traceability: Full manufacturing history tracking
- Extended Qualification Testing: Temperature cycling, HTOL, moisture sensitivity
Reliability Metrics
| Parameter |
Value |
| MTBF |
>1,000,000 hours (at 55°C) |
| Failure Rate |
<10 FIT (Failures in Time) |
| Data Retention |
>20 years |
| Configuration Cycles |
Unlimited (SRAM-based) |
Comparison with Related Parts
XA3S1500 Family Variants
| Part Number |
Speed Grade |
Package |
Temperature |
Application |
| XA3S1500-4FGG676I |
-4 |
676-FBGA |
-40°C to +125°C |
Industrial/Auto standard |
| XA3S1500-5FGG676I |
-5 |
676-FBGA |
-40°C to +125°C |
Higher performance |
| XC3S1500-4FG676C |
-4 |
676-FBGA |
0°C to +85°C |
Commercial grade |
| XC3S1500-5FG676I |
-5 |
676-FBGA |
-40°C to +100°C |
Industrial (commercial) |
Alternative Spartan-3A Devices
- XA3S1400A: 1.4M gates, slightly lower capacity
- XA3S1600E: Enhanced version with more resources
- XA3S700A: Smaller footprint for cost-sensitive applications
PCB Design Considerations
Board Layout Guidelines
Power Distribution:
- Use dedicated power planes for VCCINT, VCCAUX, and VCCO
- Place decoupling capacitors close to power pins (0.1µF and 10µF recommended)
- Implement star ground topology for noise reduction
Signal Integrity:
- Match impedance for high-speed differential pairs (100Ω ±10%)
- Keep clock traces short with controlled impedance (50Ω single-ended)
- Avoid routing sensitive signals near switching power supplies
Thermal Design:
- Provide adequate copper pour for heat dissipation
- Consider thermal vias under the package for improved cooling
- Maintain recommended PCB stack-up for thermal conductivity
Recommended PCB Stack-up
- Top Layer: Signal routing and components
- Layer 2: Ground plane
- Layer 3: Power plane (VCCINT)
- Layer 4: Signal routing
- Layer 5: Power plane (VCCAUX, VCCO)
- Layer 6: Ground plane
- Bottom Layer: Signal routing
Ordering Information and Availability
Part Number Breakdown
XA3S1500-4FGG676I decodes as:
- XA: Automotive/Industrial grade
- 3S: Spartan-3A family
- 1500: 1.5 million system gates
- -4: Speed grade
- FG: Fine-pitch Ball Grid Array package
- G: Green (RoHS-6 compliant)
- 676: 676-pin package
- I: Industrial temperature range
Package Marking
The device is marked with:
- Part number
- Date code
- Lot traceability code
- Country of origin
- RoHS compliance indicator
Environmental Compliance
RoHS and Green Standards
- RoHS-6 Compliant: Lead-free (Pb-free)
- Halogen-Free: Upon request
- REACH Compliant: EU chemical regulation
- Conflict Minerals: Compliant with Dodd-Frank Act
Storage and Handling
Moisture Sensitivity Level (MSL)
- MSL Rating: MSL 3 (168 hours at 30°C/60% RH after bag opening)
- Baking: 24 hours at 125°C if floor life exceeded
- Storage: Store in original moisture barrier bag with desiccant
ESD Precautions
- HBM Rating: Class 1C (>1000V)
- CDM Rating: Class C2 (>500V)
- Handling: Use ESD-safe workstations and wrist straps
Support and Documentation
Essential Documentation
- Device Datasheet: DS557 Spartan-3A FPGA Family
- User Guide: UG331 Spartan-3A FPGA User Guide
- Packaging Specifications: Package drawings and dimensions
- PCN (Product Change Notifications): Manufacturing updates
- Application Notes: Design best practices and implementation guides
Technical Support Resources
- Xilinx Forums: Community support and discussions
- Technical Support: Direct contact with AMD Xilinx engineers
- Training: Online courses and webinars
- Reference Designs: Example projects and starter kits
Advantages of XA3S1500-4FGG676I
Why Choose This FPGA?
Reliability: Automotive-grade qualification ensures operation in harsh environments with extended temperature ranges and enhanced testing.
Flexibility: 1.5 million system gates and 487 I/O pins provide ample resources for complex designs while maintaining cost-effectiveness.
Proven Technology: Spartan-3A architecture has been deployed in millions of units across automotive, industrial, and aerospace applications.
Development Ecosystem: Mature tools, extensive IP libraries, and comprehensive documentation accelerate development cycles.
Cost-Effectiveness: Balanced performance at competitive pricing for high-volume industrial and automotive applications.
Common Design Patterns
High-Speed Interface Implementation
The XA3S1500-4FGG676I excels at:
- DDR/DDR2 Memory Controllers: Up to 200 MHz operation
- Gigabit Ethernet: MAC implementations with external PHY
- PCIe Endpoints: Using FPGA logic for PCIe bridge functions
- LVDS Communication: High-speed point-to-point links
Embedded Processing
Integrate the MicroBlaze soft processor for:
- System control and management
- Communication protocol handling
- User interface processing
- Real-time operating system (RTOS) support
Summary
The XA3S1500-4FGG676I represents an excellent choice for industrial and automotive applications requiring reliable, cost-effective FPGA solutions. With 1.5 million system gates, 487 I/O pins, and automotive-grade qualification supporting -40°C to +125°C operation, this device delivers robust performance for mission-critical systems.
Whether you’re developing motor control systems, automotive ECUs, aerospace avionics, or industrial automation solutions, the XA3S1500-4FGG676I provides the resources, reliability, and flexibility needed for successful product deployment.
Key Takeaways
✓ 1.5M system gates with 29,952 logic cells for complex designs
✓ Automotive-grade (XA) qualification for harsh environments
✓ -40°C to +125°C extended temperature range
✓ 676-pin FBGA compact package with 487 user I/O
✓ 576 Kbits Block RAM for embedded memory applications
✓ 90nm technology for balanced power and performance
✓ Proven Spartan-3A architecture with extensive ecosystem support
