Overview of XA3S1500-4FGG676C FPGA

The XA3S1500-4FGG676C is a robust field-programmable gate array (FPGA) from AMD Xilinx’s Spartan-3 family, designed specifically for automotive and high-reliability industrial applications. This advanced semiconductor device delivers exceptional performance with 1.5 million system gates, making it an ideal solution for cost-sensitive consumer electronics, automotive systems, and industrial control applications.

As part of the automotive-grade XA Spartan-3 series, this FPGA provides enhanced reliability and extended temperature range operation, distinguishing it from standard commercial-grade components. Engineers and designers seeking a dependable Xilinx FPGA solution will find the XA3S1500-4FGG676C offers an optimal balance of performance, power efficiency, and cost-effectiveness.

Key Features and Specifications

Core Technical Specifications

Package and I/O Specifications

Memory and Resources

Product Description and Applications

What Makes XA3S1500-4FGG676C Unique

The XA3S1500-4FGG676C FPGA represents AMD Xilinx’s commitment to delivering automotive-qualified programmable logic solutions. Unlike standard commercial FPGAs, this automotive-grade device undergoes rigorous testing to meet AEC-Q100 qualification standards, ensuring reliable operation in harsh environments.

This FPGA combines the flexibility of programmable logic with the performance characteristics required for demanding real-time applications. The 90nm manufacturing process delivers an excellent balance between power consumption and processing speed, while the generous allocation of logic cells enables implementation of complex digital circuits.

Target Applications

Automotive Electronics

• Advanced Driver Assistance Systems (ADAS) – Processing sensor data for collision avoidance
• Infotainment Systems – Managing multimedia interfaces and connectivity
• Engine Control Units – Real-time control algorithms
• Body Electronics – Door modules, lighting control, and comfort systems

Industrial Automation

• Programmable Logic Controllers (PLCs) – Machine control and monitoring
• Motor Control Systems – Precision motor drive applications
• Robotics – Real-time motion control and sensor fusion
• Process Control – Data acquisition and signal processing

Communication Systems

• Broadband Access Equipment – DSL, cable modems, and fiber optic systems
• Network Infrastructure – Protocol processing and packet routing
• Wireless Base Stations – Digital signal processing
• Video Transmission – Encoding, decoding, and streaming

Consumer Electronics

• Digital Television Equipment – Video processing and standards conversion
• Display Controllers – LCD/LED panel interfaces
• Home Networking – Router and gateway applications
• Gaming Consoles – Graphics and audio processing

Technical Architecture

Spartan-3 FPGA Architecture Overview

The XA3S1500-4FGG676C utilizes the proven Spartan-3 architecture, which incorporates several advanced features inherited from Xilinx’s Virtex-II platform. This architecture provides designers with a comprehensive set of building blocks for implementing complex digital systems.

Configurable Logic Blocks (CLBs)

Each CLB contains four logic slices, with each slice featuring:

• Two 4-input Look-Up Tables (LUTs) that can implement any Boolean function
• Two flip-flops for sequential logic implementation
• Dedicated carry logic for efficient arithmetic operations
• Distributed RAM capability using LUTs as memory

Input/Output Blocks (IOBs)

The 487 user I/O pins support multiple I/O standards including:

• LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V, 1.2V)
• SSTL and HSTL for memory interfaces
• Differential signaling (LVDS, RSDS, mini-LVDS)
• 3.3V PCI compatibility

Clock Management

The XA3S1500-4FGG676C includes four Digital Clock Managers (DCMs) that provide:

• Clock frequency synthesis (multiply and divide)
• Phase shifting for timing optimization
• Clock deskew and distribution
• Dynamic reconfiguration capability

This robust clock management system enables designers to generate precise timing signals required for high-speed interfaces and synchronous system design.

Performance Characteristics

Speed and Timing

Power Consumption

The 90nm process technology employed in the XA3S1500-4FGG676C delivers efficient power characteristics:

• Static Power: Minimal quiescent current in powered state
• Dynamic Power: Proportional to switching activity and frequency
• I/O Power: Dependent on voltage standards and drive strength
• Low-Power Design: Supports power-aware design methodologies

Package Information

FBGA Package Details

The XA3S1500-4FGG676C utilizes a 676-pin Fine-pitch Ball Grid Array (FBGA) package optimized for high-density applications:

Thermal Considerations

The FGG676 package provides excellent thermal characteristics:

• Junction-to-Ambient (θJA): Optimized for forced-air cooling
• Junction-to-Case (θJC): Suitable for heatsink attachment
• Maximum Junction Temperature: 125°C for automotive grade

Design and Development Tools

Software Requirements

Designing with the XA3S1500-4FGG676C requires Xilinx development tools:

ISE Design Suite

• Synthesis: XST (Xilinx Synthesis Technology)
• Implementation: Place and Route optimization
• Simulation: Integrated simulator or third-party tools
• Programming: iMPACT configuration tool

Vivado Design Suite

Note: Spartan-3 devices are primarily supported by ISE, though migration paths exist for newer tools.

Hardware Development

Configuration and Programming

Configuration Options

The XA3S1500-4FGG676C supports multiple configuration modes:

• Master Serial Mode: FPGA controls external Flash memory
• Slave Serial Mode: External controller programs device
• JTAG Mode: Development and debugging access
• Boundary Scan: IEEE 1149.1 compliant testing

Configuration Memory Requirements

Quality and Reliability

Automotive Grade Qualification

The “XA” designation indicates automotive-qualified parts meeting stringent requirements:

• AEC-Q100 Qualified: Automotive Electronics Council standards
• Extended Temperature Range: -40°C to +125°C junction temperature
• Enhanced Reliability Testing:
  • High Temperature Operating Life (HTOL)
  • Temperature Cycling
  • Unbiased Highly Accelerated Stress Test (uHAST)
  • Electrostatic Discharge (ESD) testing

Production Testing

Each XA3S1500-4FGG676C undergoes comprehensive testing:

• Parametric testing of all I/O pins
• Full functional verification
• Speed grade validation
• Temperature characterization

Ordering Information

Part Number Breakdown

XA3S1500-4FGG676C

• XA: Automotive-qualified Spartan-3
• 3S: Spartan-3 family identifier
• 1500: 1.5 million system gates
• -4: Industrial speed grade
• FG: Fine-pitch Grid array package
• G676: 676-pin configuration
• C: Commercial temperature grade

Package Options

While the FGG676 package is featured here, the Spartan-3 1500 family offers alternative packages:

• FG456 (456-pin FBGA)
• FG676 (676-pin FBGA) – Featured variant
• Custom options available for volume orders

Comparison with Related Products

XA3S1500 Family Variants

Alternative FPGA Options

For designers evaluating options, consider these related devices:

• XC3S1000: Smaller logic capacity (1M gates)
• XC3S2000: Larger logic capacity (2M gates)
• XC3S1500L: Low-power variant
• Spartan-6 Series: Next-generation architecture

Design Considerations

Power Supply Design

The XA3S1500-4FGG676C requires multiple power rails:

Decoupling Requirements

Proper power supply decoupling is critical:

• Place bulk capacitors (10-100µF) near power entry points
• Use multiple ceramic capacitors (0.1µF, 0.01µF) distributed across device
• Follow Xilinx power distribution recommendations
• Implement low-inductance ground planes

PCB Layout Guidelines

Critical layout considerations for the FGG676 package:

• Via-in-Pad: Required for dense ball pitch
• Controlled Impedance: For high-speed signals
• Length Matching: For parallel interfaces
• Thermal Management: Adequate copper area for heat dissipation

Best Practices for Implementation

Design Optimization

Maximize performance of your XA3S1500-4FGG676C design:

1. Register All Outputs: Improve timing and reduce glitches
2. Pipeline Long Paths: Break critical paths into stages
3. Use Block RAM Efficiently: Leverage distributed and block memory
4. Clock Domain Crossing: Implement proper synchronization
5. Constraint Application: Define comprehensive timing constraints

Verification Strategy

Ensure design reliability through comprehensive verification:

• Behavioral simulation at RTL level
• Post-synthesis functional verification
• Static timing analysis for all operating conditions
• In-circuit testing with ChipScope analyzer
• Hardware validation on target board

Frequently Asked Questions

What is the difference between XA and XC Spartan-3 devices?

XA-series devices are automotive-qualified versions with enhanced reliability testing, extended temperature support, and stricter quality control compared to standard XC commercial parts.

Can I use ISE or Vivado for development?

The Spartan-3 family is primarily supported by ISE Design Suite versions 10.1 through 14.7. Vivado does not directly support Spartan-3 devices.

What configuration memory is recommended?

For the XA3S1500-4FGG676C, serial Flash memories like M25P20 (2Mbit) or larger provide adequate capacity. Platform Flash XL devices offer integrated configuration solutions.

Is the device 5V tolerant?

No, the Spartan-3 I/O is not 5V tolerant. Maximum input voltage should not exceed VCCO + 0.5V. Level shifters are required for interfacing with 5V systems.

What is the typical power consumption?

Power consumption varies significantly based on design utilization, operating frequency, and I/O activity. Use Xilinx XPower tools for accurate power estimation.

Conclusion

The XA3S1500-4FGG676C represents a mature, reliable FPGA solution for automotive and industrial applications requiring proven programmable logic technology. With 1.5 million system gates, 487 I/O pins, and automotive-grade qualification, this device delivers the performance and reliability demanded by mission-critical applications.

Whether you’re developing advanced driver assistance systems, industrial automation equipment, or communication infrastructure, the XA3S1500-4FGG676C provides a cost-effective platform with extensive development tool support and a wealth of available IP cores.

For engineers seeking a dependable FPGA with automotive credentials, comprehensive I/O capabilities, and sufficient logic resources for moderate-complexity designs, the XA3S1500-4FGG676C stands as an excellent choice in the embedded systems landscape.