Overview of XA3S1500-4FGG456I Automotive FPGA
The XA3S1500-4FGG456I is an automotive-grade Field Programmable Gate Array (FPGA) from AMD’s Spartan-3 family, specifically engineered to deliver exceptional performance in harsh environmental conditions. This industrial-temperature FPGA combines 1.5 million system gates with robust design features, making it the ideal choice for automotive electronics, aerospace systems, and mission-critical industrial applications.
As part of the extended automotive Xilinx FPGA portfolio, the XA3S1500-4FGG456I offers enhanced reliability and meets stringent automotive quality standards, ensuring consistent operation across extreme temperature ranges from -40°C to 100°C.
Key Technical Specifications
Core FPGA Specifications Table
| Specification |
Value |
Details |
| Part Number |
XA3S1500-4FGG456I |
Automotive-grade variant |
| FPGA Family |
Spartan-3 |
Cost-optimized architecture |
| System Gates |
1,500,000 gates |
High logic density |
| Logic Cells |
29,952 cells |
Maximum flexibility |
| CLBs (Configurable Logic Blocks) |
3,328 CLBs |
Advanced logic resources |
| Speed Grade |
-4 |
Industrial performance |
| Operating Frequency |
630 MHz |
High-speed processing |
| Supply Voltage |
1.2V (1.14V – 1.26V) |
Low power consumption |
| Package Type |
456-FBGA |
Fine-pitch Ball Grid Array |
| Operating Temperature |
-40°C to 100°C (TJ) |
Extended industrial range |
| Manufacturing Process |
90nm technology |
Proven reliability |
Memory and I/O Configuration
| Feature |
Specification |
Application Benefit |
| Block RAM |
589,824 bits |
Efficient data storage |
| Distributed RAM |
Available |
Flexible memory options |
| I/O Pins |
333 user I/Os |
Extensive connectivity |
| I/O Standards |
Multiple LVCMOS, LVDS, LVTTL |
Versatile interfacing |
| Differential Pairs |
Available |
High-speed serial communication |
Advanced Features and Capabilities
Digital Clock Management (DCM)
The XA3S1500-4FGG456I integrates advanced Digital Clock Manager technology that provides:
- Clock frequency synthesis for flexible timing solutions
- Phase shifting capabilities for precise timing control
- Clock de-skewing to minimize timing uncertainties
- Multiple output clocks from a single source
- Low-jitter performance for signal integrity
Embedded Multipliers and DSP Resources
| DSP Feature |
Quantity |
Performance |
| 18×18 Multipliers |
32 dedicated |
Hardware multiplication |
| DSP Slices |
Optimized |
Signal processing |
| MAC Operations |
High throughput |
Mathematical operations |
Target Applications and Use Cases
Automotive Electronics
The XA3S1500-4FGG456I excels in automotive applications requiring high reliability:
- Advanced Driver Assistance Systems (ADAS) – Sensor fusion and real-time processing
- Engine Control Units (ECU) – Precise motor control algorithms
- Infotainment Systems – Multimedia processing and connectivity
- Body Electronics – Lighting control and safety systems
- Battery Management Systems – EV power management
Industrial Automation
| Application Area |
Implementation Benefits |
| Machine Vision |
Real-time image processing |
| Motion Control |
Precise servo control |
| Process Control |
Data acquisition systems |
| Robotics |
Sensor integration and control |
| Industrial Networking |
Protocol conversion |
Aerospace and Defense
The automotive-grade qualification ensures reliability for:
- Avionics systems
- Navigation equipment
- Communication systems
- Radar signal processing
- Secure data encryption
Performance Characteristics
Speed and Timing Performance
The -4 speed grade designation indicates optimized performance characteristics:
- Maximum operating frequency: 630 MHz internal logic
- Propagation delays optimized for high-speed designs
- Setup and hold times minimized for timing closure
- Clock-to-out delays suitable for synchronous systems
Power Consumption Profile
| Operating Mode |
Typical Power |
Conditions |
| Static Power |
Low |
Standby mode |
| Dynamic Power |
Application-dependent |
Activity-based |
| Core Voltage |
1.2V nominal |
Efficient operation |
| I/O Power |
Variable |
Based on standards used |
Package and Pin Configuration
456-FBGA Package Details
The Fine-pitch Ball Grid Array (FBGA) package offers:
- Compact footprint – 23mm x 23mm package size
- Excellent thermal performance – Efficient heat dissipation
- High I/O density – 456 total balls
- Industry-standard layout – Compatible with standard PCB processes
- RoHS compliant – Lead-free manufacturing
Pin Assignment Categories
| Pin Type |
Quantity |
Purpose |
| User I/O |
333 |
Application interfaces |
| Power Pins |
Multiple |
Core and I/O power |
| Ground Pins |
Multiple |
Signal and power return |
| Configuration Pins |
Dedicated |
FPGA programming |
| Clock Inputs |
Dedicated |
System timing |
Design Tools and Development Support
Xilinx ISE Design Suite
The XA3S1500-4FGG456I is fully supported by:
- ISE Design Suite – Complete design environment
- Synthesis tools – HDL compilation and optimization
- Implementation tools – Place and route engines
- Timing analysis – Static timing verification
- Power analysis – Power estimation tools
Hardware Description Language Support
| HDL Type |
Support Level |
Application |
| VHDL |
Full support |
Industry standard |
| Verilog |
Full support |
Popular alternative |
| SystemVerilog |
Supported |
Advanced features |
| Schematic Entry |
Available |
Visual design |
Quality and Reliability Standards
Automotive Qualification
The “XA” prefix indicates automotive-grade qualification:
- AEC-Q100 compliant – Automotive electronics standard
- Extended temperature range – -40°C to 100°C junction temperature
- Enhanced screening – Rigorous quality testing
- Long-term reliability – Proven in automotive environments
- Traceability – Full manufacturing documentation
Reliability Metrics
| Reliability Parameter |
Specification |
Standard |
| MTBF |
High |
Field-proven |
| Operating Life |
>10 years |
Typical automotive |
| Moisture Sensitivity |
MSL 3 |
Industry standard |
| ESD Protection |
HBM/CDM |
Robust handling |
Comparison with Standard Grade Variants
XA vs XC Series Differences
| Feature |
XA3S1500-4FGG456I |
XC3S1500-4FGG456I |
| Grade |
Automotive |
Commercial/Industrial |
| Temperature Range |
-40°C to 100°C |
0°C to 85°C (Commercial) |
| Qualification |
AEC-Q100 |
Standard |
| Screening |
Enhanced |
Standard |
| Reliability |
Automotive-grade |
Commercial-grade |
| Cost |
Premium |
Standard |
| Applications |
Automotive, Aerospace |
General industrial |
Implementation Best Practices
PCB Design Considerations
For optimal XA3S1500-4FGG456I performance:
- Power Supply Design
- Dedicated power planes for VCCINT (1.2V)
- Separate planes for VCCO (adjustable I/O voltage)
- Low-ESR decoupling capacitors near BGA balls
- Power sequencing compliance
- Signal Integrity
- Controlled impedance traces for high-speed signals
- Differential pair routing for LVDS
- Length matching for critical paths
- Ground plane continuity
- Thermal Management
- Adequate copper pour for heat spreading
- Thermal vias under package
- Airflow considerations
- Temperature monitoring circuits
Configuration Methods
| Configuration Mode |
Interface |
Application |
| Master Serial |
SPI Flash |
Stand-alone systems |
| JTAG |
Boundary scan |
Development/Debug |
| Slave Serial |
External controller |
System integration |
| SelectMAP |
Parallel interface |
Fast configuration |
Competitive Advantages
Why Choose XA3S1500-4FGG456I
- Proven Automotive Heritage – Years of field deployment in vehicles
- Cost-Effective Solution – Spartan-3 architecture optimizes price/performance
- Extensive I/O Capabilities – 333 user I/Os for complex interfacing
- Flexible Architecture – Adaptable to changing requirements
- Strong Ecosystem Support – Comprehensive tools and IP cores
- Long-Term Availability – Automotive lifecycle support
Market Position
The XA3S1500-4FGG456I occupies a unique position:
- More cost-effective than Virtex automotive FPGAs
- Higher performance than entry-level Spartan variants
- Automotive-qualified for critical applications
- Balanced logic, memory, and I/O resources
Ordering Information and Availability
Part Number Breakdown
XA3S1500-4FGG456I decoding:
- XA – Automotive-grade quality
- 3S – Spartan-3 family
- 1500 – 1.5 million system gates
- -4 – Speed grade (industrial performance)
- FGG456 – Fine-pitch BGA, 456 pins
- I – Industrial temperature range (-40°C to 100°C)
Package Marking and Identification
Each device is marked with:
- Full part number
- Date code
- Lot traceability code
- Country of origin
- Lead-free indicator
Technical Support and Resources
Documentation Available
| Document Type |
Description |
Use Case |
| Datasheet |
Complete specifications |
Design reference |
| User Guide |
Detailed architecture |
Implementation |
| Packaging Specifications |
Physical dimensions |
PCB layout |
| Application Notes |
Design examples |
Best practices |
| Errata |
Known issues |
Design verification |
Online Resources
Access comprehensive support through:
- AMD/Xilinx technical documentation portal
- Community forums and design discussions
- Reference designs and IP cores
- Training materials and webinars
- FAQs and troubleshooting guides
Environmental and Compliance
RoHS and REACH Compliance
The XA3S1500-4FGG456I meets:
- RoHS Directive – Lead-free manufacturing
- REACH Regulation – Substance restrictions
- WEEE Compliance – Waste management
- Conflict Minerals – Responsible sourcing
Conclusion
The XA3S1500-4FGG456I represents a mature, reliable FPGA solution for automotive and industrial applications demanding extended temperature operation and proven reliability. With 1.5 million gates, 333 I/Os, and comprehensive design tool support, this automotive-grade FPGA delivers the perfect balance of performance, cost, and dependability for mission-critical systems.
Whether you’re developing next-generation automotive electronics, industrial automation systems, or aerospace equipment, the XA3S1500-4FGG456I provides the programmable logic foundation for innovation with the automotive qualification your application requires.
