Overview of the XA3S1500-4FG676I FPGA
The XA3S1500-4FG676I is an advanced automotive-grade Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx), specifically designed for high-reliability applications in harsh environments. This industrial-grade programmable logic device delivers exceptional performance with 1.5 million system gates, making it an ideal solution for aerospace, defense, automotive, and industrial control systems.
As part of the Spartan-3 automotive family, the XA3S1500-4FG676I combines robust design with cost-effective manufacturing, offering engineers a reliable platform for developing complex digital systems that demand both flexibility and durability.
Key Features and Specifications
Core Technical Specifications
| Specification |
Details |
| Logic Cells |
29,952 Logic Elements |
| System Gates |
1.5 Million Gates |
| I/O Pins |
487 User I/O |
| Package Type |
676-Pin Fine-Pitch Ball Grid Array (FBGA) |
| Operating Voltage |
Core: 1.2V, I/O: 1.8V to 3.3V |
| Speed Grade |
-4 (Standard Performance) |
| Technology Node |
90nm Process Technology |
| Operating Frequency |
Up to 630 MHz |
| Temperature Range |
-40°C to +100°C (Automotive Grade) |
Advanced FPGA Capabilities
| Feature |
Specification |
| Block RAM |
576 Kb Distributed RAM |
| Multipliers |
32 Dedicated 18×18 Multipliers |
| Digital Clock Managers |
4 DCMs for Advanced Clocking |
| Configuration |
JTAG, Master/Slave Serial, SelectMAP |
| Package Dimensions |
27mm x 27mm FBGA |
| RoHS Compliance |
RoHS3 Compliant |
Applications and Use Cases
Automotive and Transportation Systems
The XA3S1500-4FG676I is specifically engineered for automotive applications, making it perfect for:
- Advanced Driver Assistance Systems (ADAS)
- Engine Control Units (ECU)
- Infotainment System Controllers
- Vehicle-to-Everything (V2X) Communication
- Automotive Vision Processing
- Electric Vehicle Battery Management Systems
Industrial Control and Automation
This Xilinx FPGA excels in industrial environments:
- Programmable Logic Controllers (PLC)
- Motion Control Systems
- Industrial Robotics
- Factory Automation Equipment
- Process Control Systems
- Real-Time Monitoring Systems
Aerospace and Defense Applications
The automotive-grade qualification makes it suitable for:
- Avionics Control Systems
- Radar Signal Processing
- Communication Systems
- Navigation Equipment
- Military-Grade Electronics
- Satellite Subsystems
Communications and Networking
- 5G Base Station Equipment
- Network Routers and Switches
- Protocol Conversion
- Software-Defined Radio (SDR)
- Telecommunications Infrastructure
Technical Architecture and Performance
Logic Fabric Design
The XA3S1500-4FG676I features a sophisticated logic fabric architecture with 29,952 configurable logic cells. Each logic cell contains:
- Four-input Look-Up Tables (LUTs)
- Fast carry logic for arithmetic operations
- Distributed RAM capabilities
- Wide multiplexer functions
Memory Resources
The device provides substantial memory resources:
- Block RAM: 576 Kb of high-speed block RAM organized in 32 blocks
- Distributed RAM: Additional RAM distributed throughout the logic fabric
- FIFO Support: Built-in FIFO controller logic
DSP Capabilities
With 32 dedicated 18×18 multipliers, the XA3S1500-4FG676I delivers:
- High-performance signal processing
- Efficient implementation of DSP algorithms
- Reduced logic resource usage for arithmetic operations
- Enhanced system performance for multiply-accumulate operations
Clock Management
Four Digital Clock Managers (DCMs) provide:
- Clock frequency synthesis
- Phase shifting capabilities
- Clock distribution with minimal skew
- Support for multiple clock domains
Design and Development Tools
Compatible Development Environments
Engineers can develop for the XA3S1500-4FG676I using:
- Xilinx ISE Design Suite – Legacy development environment
- Vivado Design Suite – Modern FPGA development platform
- Third-Party EDA Tools – Compatible with major synthesis tools
Programming Methods
The FPGA supports multiple configuration options:
| Configuration Mode |
Description |
| JTAG |
Industry-standard debugging and programming |
| Master Serial |
Direct SPI flash boot configuration |
| Slave Serial |
External processor-controlled configuration |
| SelectMAP |
High-speed parallel configuration |
Package and Pinout Information
FBGA Package Details
The 676-pin Fine-Pitch Ball Grid Array (FBGA) offers:
- Ball Pitch: 1.0mm pitch for high-density mounting
- Package Size: 27mm x 27mm footprint
- Height: Low-profile design for space-constrained applications
- Mounting: Surface-mount technology (SMT) compatible
- Thermal Performance: Enhanced thermal dissipation capabilities
Pin Configuration
| Pin Category |
Count |
| User I/O Pins |
487 |
| Power Pins |
Multiple VCC/GND pairs |
| Configuration Pins |
JTAG, Mode, DONE, PROG |
| Clock Input Pins |
Dedicated global clock inputs |
Quality and Reliability Standards
Automotive Qualification
The “XA” prefix designates automotive-grade qualification:
- Extended temperature range operation
- Enhanced screening and testing procedures
- Improved long-term reliability
- Qualification to automotive industry standards
Environmental Compliance
- RoHS3 Compliant: Lead-free and halogen-free options
- REACH Compliant: Meets European chemical regulations
- Moisture Sensitivity Level: MSL 3
Performance Optimization Tips
Design Best Practices
- Clock Domain Management: Utilize DCMs for optimal clock distribution
- Resource Utilization: Balance logic cells, block RAM, and DSP blocks
- Timing Closure: Follow static timing analysis guidelines
- Power Optimization: Implement clock gating and power-aware design
- I/O Planning: Strategic pin assignment for signal integrity
Thermal Management
For reliable operation:
- Monitor junction temperature during operation
- Implement adequate heat sinking solutions
- Use thermal vias in PCB design
- Consider airflow in system enclosure design
Comparison with Related FPGAs
XA3S1500-4FG676I vs XC3S1500-4FG676I
| Feature |
XA3S1500-4FG676I |
XC3S1500-4FG676I |
| Grade |
Automotive |
Commercial |
| Temperature Range |
-40°C to +100°C |
0°C to +85°C |
| Screening |
Enhanced |
Standard |
| Reliability |
Higher |
Standard |
| Applications |
Automotive/Industrial |
General Purpose |
| Price |
Premium |
Standard |
Alternative Package Options
- XA3S1500-4FGG676I: Alternative ball grid array configuration
- XA3S1500-4FGG456I: Smaller 456-pin package option
Procurement and Availability
Ordering Information
Part Number: XA3S1500-4FG676I
- Manufacturer: AMD (Xilinx)
- Package Marking: Full part number with date code
- Lead Time: Varies by distributor
- Availability: Through authorized distributors
Quality Assurance
All units undergo:
- 100% functional testing
- Temperature cycling tests
- Visual inspection
- Electrical parameter verification
Implementation Considerations
PCB Design Requirements
When designing with the XA3S1500-4FG676I:
- Layer Stack: Recommend 6-8 layer PCB minimum
- Power Planes: Dedicated power and ground planes
- Decoupling: Multiple decoupling capacitors per power pin
- Impedance Control: Controlled impedance for high-speed signals
- Via Technology: Micro-vias for dense routing
Power Supply Design
Critical power requirements:
- Core Voltage (VCCINT): 1.2V ±5%, high current capability
- I/O Voltage (VCCO): 1.8V to 3.3V per bank
- Auxiliary Voltage (VCCAUX): 2.5V for DLL/DCM
- Power Sequencing: Follow recommended power-up sequence
Configuration and Programming
Initial Configuration
The XA3S1500-4FG676I requires:
- Bitstream generation from design tools
- Storage in configuration memory (SPI Flash, PROM)
- Configuration at power-up or on-demand
Debug and Testing
Access comprehensive debug features:
- ChipScope Pro: Internal logic analyzer
- JTAG Boundary Scan: IEEE 1149.1 compliant
- Built-in Self-Test (BIST): Manufacturing test support
Support and Documentation
Available Resources
AMD provides extensive documentation:
- Complete datasheet with electrical specifications
- User guides for Spartan-3 family
- Application notes for common designs
- Reference designs and IP cores
- Technical support through AMD forums
Community and Ecosystem
Leverage the extensive FPGA community:
- Online forums and discussion boards
- Open-source IP cores
- University programs and tutorials
- Third-party development boards
Future-Proofing Your Design
Longevity Considerations
The XA3S1500-4FG676I offers:
- Established product with proven reliability
- Wide adoption in automotive industry
- Available second-source options
- Long-term availability commitment from AMD
Migration Path
Plan for future upgrades:
- Compatible with newer Spartan families for capacity growth
- Design methodology transfers to modern Xilinx FPGAs
- IP core compatibility with current AMD portfolio
Conclusion
The XA3S1500-4FG676I represents a mature, reliable FPGA solution for demanding automotive and industrial applications. With its robust automotive qualification, extensive I/O capabilities, and proven Spartan-3 architecture, this FPGA delivers exceptional value for mission-critical designs requiring both performance and reliability.
Whether you’re developing advanced automotive systems, industrial automation equipment, or aerospace applications, the XA3S1500-4FG676I provides the perfect balance of features, performance, and reliability. Its comprehensive development tool support and extensive documentation make it an excellent choice for engineers seeking a dependable programmable logic solution.
For designers requiring automotive-grade quality with extensive logic resources, the XA3S1500-4FG676I stands as a proven solution backed by AMD’s decades of FPGA expertise and commitment to quality.
