Overview of XA3S1500-4FG676 FPGA Technology
The XA3S1500-4FG676 represents a powerful solution in the automotive-grade FPGA market, manufactured by AMD (formerly Xilinx). This field-programmable gate array belongs to the renowned Spartan-3 family and delivers exceptional performance for cost-sensitive, high-volume applications. With 1.5 million system gates and 29,952 logic cells, this FPGA provides substantial computational power while maintaining energy efficiency and reliability in demanding environments.
Designed with 90nm CMOS process technology, the XA3S1500-4FG676 operates reliably across an extended temperature range of -40°C to +100°C, making it ideal for automotive, industrial, and telecommunications applications where environmental conditions can be harsh. The device features 487 user I/O pins in a compact 676-ball fine-pitch BGA package, offering excellent connectivity options for complex system integration.
Key Technical Specifications and Features
Core Architecture Specifications
| Specification |
Value |
| Logic Cells |
29,952 |
| System Gates |
1.5 Million |
| Block RAM |
576 Kbits (72 KB) |
| User I/O Pins |
487 |
| Maximum Frequency |
630 MHz |
| Core Voltage |
1.2V (1.14V – 1.26V) |
| Process Technology |
90nm CMOS |
| Package Type |
676-FBGA (Fine-pitch Ball Grid Array) |
| Package Dimensions |
27mm x 27mm |
Performance Characteristics
| Feature |
Description |
| Speed Grade |
-4 (High-performance grade) |
| Operating Temperature |
-40°C to +100°C (Industrial/Automotive) |
| I/O Voltage Standards |
1.8V to 3.3V (configurable) |
| Programming Interface |
JTAG, Serial, Parallel |
| Configuration Memory |
External (Flash, PROM) |
| Power Consumption |
Optimized for low-power operation |
XA3S1500-4FG676 vs Standard Spartan-3 FPGAs
Automotive-Grade Reliability
The “XA” prefix in XA3S1500-4FG676 designates this as an automotive-grade component, distinguishing it from the standard XC3S1500 commercial variants. This automotive qualification ensures:
- Extended temperature range operation (-40°C to +100°C)
- Enhanced reliability testing and screening
- Compliance with automotive quality standards
- Improved resistance to environmental stress
- Longer operational lifespan in demanding conditions
Comparison Table: XA vs XC Series
| Feature |
XA3S1500-4FG676 |
XC3S1500-4FG676 |
| Grade |
Automotive |
Commercial |
| Temperature Range |
-40°C to +100°C |
0°C to +85°C |
| Reliability Testing |
Enhanced |
Standard |
| Target Applications |
Automotive, Industrial |
Consumer Electronics |
| Quality Screening |
Automotive-grade |
Commercial-grade |
Applications and Use Cases
Automotive Electronics
The XA3S1500-4FG676 excels in automotive applications where reliability and temperature tolerance are critical:
- Advanced Driver Assistance Systems (ADAS): Sensor fusion, object detection, and processing
- In-Vehicle Infotainment: Digital signal processing for audio/video systems
- Engine Control Units: Real-time monitoring and control
- Body Control Modules: Managing lighting, climate, and access systems
- Vehicle Networking: CAN, LIN, and FlexRay protocol implementation
Industrial Automation
For industrial control systems, this Xilinx FPGA provides robust performance:
- Programmable Logic Controllers (PLCs): Custom logic implementation
- Motion Control Systems: Precise servo and stepper motor control
- Factory Automation: Sensor integration and actuator control
- Robotics: Real-time control algorithms
- Process Monitoring: Data acquisition and analysis
Telecommunications and Networking
The high-speed I/O capabilities make it suitable for communication systems:
- Broadband Access Equipment: DSL and cable modem implementations
- Wireless Base Stations: Digital signal processing and modulation
- Network Routers and Switches: Packet processing and routing
- Home Networking Devices: Gateway and protocol conversion
Medical Devices
Temperature stability and reliability support medical applications:
- Diagnostic Equipment: Signal processing and imaging
- Patient Monitoring Systems: Real-time data acquisition
- Laboratory Instruments: Precision control and measurement
Design and Development Resources
Programming Tools and Software
| Tool |
Purpose |
Compatibility |
| Xilinx ISE Design Suite |
Legacy development environment |
Full support |
| Vivado Design Suite |
Modern development platform |
Limited support (use ISE recommended) |
| Platform Cable USB |
JTAG programming hardware |
Required for development |
| ChipScope Pro |
Debugging and verification |
Integrated with ISE |
Configuration Options
The XA3S1500-4FG676 supports multiple configuration modes:
- JTAG Configuration: For development and testing
- Master Serial Mode: Using external serial Flash memory
- Master Parallel Mode: Fast configuration with parallel Flash
- Slave Serial Mode: Configuration via external controller
- Boundary Scan: For board-level testing
Memory and Logic Resources
Block RAM Configuration
| Memory Type |
Quantity |
Total Capacity |
| Block SelectRAM |
32 blocks |
576 Kbits (72 KB) |
| Distributed RAM |
Variable |
From CLB resources |
| Configuration Memory |
External |
Flash/PROM based |
Logic Cell Distribution
The 29,952 logic cells are organized into Configurable Logic Blocks (CLBs) that provide:
- Look-Up Tables (LUTs): 4-input functions for combinatorial logic
- Flip-Flops: Registered outputs for sequential logic
- Arithmetic Logic: Dedicated carry chains for fast arithmetic
- Multiplexers: Efficient data routing and selection
Power Management and Thermal Considerations
Voltage Requirements
| Power Rail |
Voltage Range |
Purpose |
| VCCINT |
1.14V – 1.26V |
Core logic power |
| VCCAUX |
2.375V – 2.625V |
Auxiliary circuits |
| VCCO |
1.8V – 3.3V |
I/O bank power (configurable) |
Thermal Management
Proper thermal design ensures reliable operation:
- Junction Temperature: Monitor to stay within -40°C to +100°C
- Heat Dissipation: Consider heatsinks for high-utilization designs
- Airflow Requirements: Ensure adequate ventilation in enclosures
- Thermal Simulation: Use Xilinx Power Estimator tool for analysis
I/O Standards and Interface Support
Supported I/O Standards
The 487 user I/O pins support multiple signaling standards:
| Standard |
Voltage |
Description |
| LVTTL |
3.3V |
Low-voltage TTL |
| LVCMOS33 |
3.3V |
Low-voltage CMOS |
| LVCMOS25 |
2.5V |
2.5V CMOS |
| LVCMOS18 |
1.8V |
1.8V CMOS |
| LVDS |
Differential |
Low-voltage differential signaling |
| RSDS |
Differential |
Reduced swing differential signaling |
High-Speed Interface Capabilities
- DDR Memory Interface: DDR SDRAM controller support
- LVDS Channels: Up to 154 differential pairs
- High-Speed Serial: Data rates up to 630 Mbps per pin
- Clock Management: 4 Digital Clock Managers (DCMs)
Package Information and Pin Configuration
676-FBGA Package Details
| Parameter |
Specification |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| Total Pins |
676 |
| Body Size |
27mm x 27mm x 2.6mm |
| Ball Pitch |
1.0mm |
| Mounting Type |
Surface Mount |
| MSL Rating |
Level 3 |
Pin Functionality Distribution
- Power and Ground: Distributed for optimal power delivery
- User I/O: 487 configurable I/O pins
- Configuration Pins: JTAG, MODE, and DONE signals
- Clock Inputs: Dedicated clock pins with DCM access
- No-Connect: Some positions reserved for larger variants
Quality and Reliability Standards
Automotive Grade Compliance
The XA3S1500-4FG676 meets stringent automotive requirements:
- Extended temperature qualification: -40°C to +100°C operation
- Enhanced screening procedures: 100% electrical testing
- Reliability stress testing: Temperature cycling, HTOL, HAST
- Long-term availability: Designed for automotive product lifecycles
Environmental and RoHS Compliance
- RoHS Status: Not compliant (contains lead in solder balls)
- Alternative Options: Pb-free variants may be available on request
- Handling Precautions: ESD-sensitive device, follow proper grounding
Development and Prototyping
Getting Started with XA3S1500-4FG676
- Development Board Selection: Choose Spartan-3 compatible boards
- Tool Installation: Download and install Xilinx ISE Design Suite
- Initial Programming: Use Platform Cable USB for JTAG access
- Design Entry: Create HDL designs in Verilog or VHDL
- Synthesis and Implementation: Generate bitstream configuration
- Testing and Verification: Use ChipScope for debugging
Design Best Practices
- Clock Domain Management: Use DCMs for clock distribution and phase adjustment
- Power Supply Design: Implement proper decoupling and filtering
- Thermal Analysis: Calculate power consumption early in design phase
- I/O Planning: Assign pins based on bank voltage and signaling requirements
- Configuration Security: Implement bitstream encryption if needed
Ordering Information and Part Number Breakdown
Part Number Decode: XA3S1500-4FG676
- XA: Automotive-grade qualification
- 3S: Spartan-3 family
- 1500: 1.5 million system gates
- -4: Speed grade (higher is faster)
- FG676: Package type (Fine-pitch BGA, 676 pins)
Available Variants
| Part Number |
Temperature |
Grade |
| XA3S1500-4FG676I |
-40°C to +100°C |
Industrial/Automotive |
| XC3S1500-4FG676I |
-40°C to +100°C |
Industrial |
| XC3S1500-4FG676C |
0°C to +85°C |
Commercial |
Frequently Asked Questions
What is the difference between XA and XC series Spartan-3 FPGAs?
The XA series represents automotive-grade components with enhanced reliability testing, extended temperature ranges, and compliance with automotive quality standards. The XC series encompasses commercial and industrial grades suitable for less demanding environments.
Can I use XA3S1500-4FG676 in commercial applications?
Yes, the XA3S1500-4FG676 can be used in any application, though it may be over-specified for standard commercial use. The commercial-grade XC3S1500 variants are more cost-effective for non-automotive applications.
What programming cable is required?
The Xilinx Platform Cable USB or Platform Cable USB II are recommended for JTAG programming and debugging during development. Production programming typically uses external configuration memory.
What is the typical power consumption?
Power consumption varies based on design utilization, clock frequency, and I/O activity. The Xilinx Power Estimator (XPE) tool provides accurate estimates based on specific design parameters.
Is this FPGA suitable for safety-critical applications?
While the XA grade provides enhanced reliability, safety-critical applications may require additional certification and functional safety features. Consult with AMD Xilinx for safety-critical application support.
Why Choose XA3S1500-4FG676 for Your Design
The XA3S1500-4FG676 offers an optimal balance of performance, reliability, and cost-effectiveness for automotive and industrial applications. Its proven Spartan-3 architecture, combined with automotive-grade qualification, makes it a trusted choice for systems requiring long-term availability and operation in harsh environments. With comprehensive development tool support and extensive documentation, designers can rapidly implement complex digital logic while meeting stringent automotive quality requirements.
Whether you’re developing advanced driver assistance systems, industrial control modules, or telecommunications equipment, the XA3S1500-4FG676 provides the flexibility and performance needed for demanding applications. Its combination of 1.5 million gates, 487 I/O pins, and extended temperature operation ensures reliable performance across a wide range of use cases.