Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XA3S1500-4FG676: High-Performance Spartan-3 FPGA for Industrial Applications

Product Details

Overview of XA3S1500-4FG676 FPGA Technology

The XA3S1500-4FG676 represents a powerful solution in the automotive-grade FPGA market, manufactured by AMD (formerly Xilinx). This field-programmable gate array belongs to the renowned Spartan-3 family and delivers exceptional performance for cost-sensitive, high-volume applications. With 1.5 million system gates and 29,952 logic cells, this FPGA provides substantial computational power while maintaining energy efficiency and reliability in demanding environments.

Designed with 90nm CMOS process technology, the XA3S1500-4FG676 operates reliably across an extended temperature range of -40°C to +100°C, making it ideal for automotive, industrial, and telecommunications applications where environmental conditions can be harsh. The device features 487 user I/O pins in a compact 676-ball fine-pitch BGA package, offering excellent connectivity options for complex system integration.

Key Technical Specifications and Features

Core Architecture Specifications

Specification Value
Logic Cells 29,952
System Gates 1.5 Million
Block RAM 576 Kbits (72 KB)
User I/O Pins 487
Maximum Frequency 630 MHz
Core Voltage 1.2V (1.14V – 1.26V)
Process Technology 90nm CMOS
Package Type 676-FBGA (Fine-pitch Ball Grid Array)
Package Dimensions 27mm x 27mm

Performance Characteristics

Feature Description
Speed Grade -4 (High-performance grade)
Operating Temperature -40°C to +100°C (Industrial/Automotive)
I/O Voltage Standards 1.8V to 3.3V (configurable)
Programming Interface JTAG, Serial, Parallel
Configuration Memory External (Flash, PROM)
Power Consumption Optimized for low-power operation

XA3S1500-4FG676 vs Standard Spartan-3 FPGAs

Automotive-Grade Reliability

The “XA” prefix in XA3S1500-4FG676 designates this as an automotive-grade component, distinguishing it from the standard XC3S1500 commercial variants. This automotive qualification ensures:

  • Extended temperature range operation (-40°C to +100°C)
  • Enhanced reliability testing and screening
  • Compliance with automotive quality standards
  • Improved resistance to environmental stress
  • Longer operational lifespan in demanding conditions

Comparison Table: XA vs XC Series

Feature XA3S1500-4FG676 XC3S1500-4FG676
Grade Automotive Commercial
Temperature Range -40°C to +100°C 0°C to +85°C
Reliability Testing Enhanced Standard
Target Applications Automotive, Industrial Consumer Electronics
Quality Screening Automotive-grade Commercial-grade

Applications and Use Cases

Automotive Electronics

The XA3S1500-4FG676 excels in automotive applications where reliability and temperature tolerance are critical:

  • Advanced Driver Assistance Systems (ADAS): Sensor fusion, object detection, and processing
  • In-Vehicle Infotainment: Digital signal processing for audio/video systems
  • Engine Control Units: Real-time monitoring and control
  • Body Control Modules: Managing lighting, climate, and access systems
  • Vehicle Networking: CAN, LIN, and FlexRay protocol implementation

Industrial Automation

For industrial control systems, this Xilinx FPGA provides robust performance:

  • Programmable Logic Controllers (PLCs): Custom logic implementation
  • Motion Control Systems: Precise servo and stepper motor control
  • Factory Automation: Sensor integration and actuator control
  • Robotics: Real-time control algorithms
  • Process Monitoring: Data acquisition and analysis

Telecommunications and Networking

The high-speed I/O capabilities make it suitable for communication systems:

  • Broadband Access Equipment: DSL and cable modem implementations
  • Wireless Base Stations: Digital signal processing and modulation
  • Network Routers and Switches: Packet processing and routing
  • Home Networking Devices: Gateway and protocol conversion

Medical Devices

Temperature stability and reliability support medical applications:

  • Diagnostic Equipment: Signal processing and imaging
  • Patient Monitoring Systems: Real-time data acquisition
  • Laboratory Instruments: Precision control and measurement

Design and Development Resources

Programming Tools and Software

Tool Purpose Compatibility
Xilinx ISE Design Suite Legacy development environment Full support
Vivado Design Suite Modern development platform Limited support (use ISE recommended)
Platform Cable USB JTAG programming hardware Required for development
ChipScope Pro Debugging and verification Integrated with ISE

Configuration Options

The XA3S1500-4FG676 supports multiple configuration modes:

  1. JTAG Configuration: For development and testing
  2. Master Serial Mode: Using external serial Flash memory
  3. Master Parallel Mode: Fast configuration with parallel Flash
  4. Slave Serial Mode: Configuration via external controller
  5. Boundary Scan: For board-level testing

Memory and Logic Resources

Block RAM Configuration

Memory Type Quantity Total Capacity
Block SelectRAM 32 blocks 576 Kbits (72 KB)
Distributed RAM Variable From CLB resources
Configuration Memory External Flash/PROM based

Logic Cell Distribution

The 29,952 logic cells are organized into Configurable Logic Blocks (CLBs) that provide:

  • Look-Up Tables (LUTs): 4-input functions for combinatorial logic
  • Flip-Flops: Registered outputs for sequential logic
  • Arithmetic Logic: Dedicated carry chains for fast arithmetic
  • Multiplexers: Efficient data routing and selection

Power Management and Thermal Considerations

Voltage Requirements

Power Rail Voltage Range Purpose
VCCINT 1.14V – 1.26V Core logic power
VCCAUX 2.375V – 2.625V Auxiliary circuits
VCCO 1.8V – 3.3V I/O bank power (configurable)

Thermal Management

Proper thermal design ensures reliable operation:

  • Junction Temperature: Monitor to stay within -40°C to +100°C
  • Heat Dissipation: Consider heatsinks for high-utilization designs
  • Airflow Requirements: Ensure adequate ventilation in enclosures
  • Thermal Simulation: Use Xilinx Power Estimator tool for analysis

I/O Standards and Interface Support

Supported I/O Standards

The 487 user I/O pins support multiple signaling standards:

Standard Voltage Description
LVTTL 3.3V Low-voltage TTL
LVCMOS33 3.3V Low-voltage CMOS
LVCMOS25 2.5V 2.5V CMOS
LVCMOS18 1.8V 1.8V CMOS
LVDS Differential Low-voltage differential signaling
RSDS Differential Reduced swing differential signaling

High-Speed Interface Capabilities

  • DDR Memory Interface: DDR SDRAM controller support
  • LVDS Channels: Up to 154 differential pairs
  • High-Speed Serial: Data rates up to 630 Mbps per pin
  • Clock Management: 4 Digital Clock Managers (DCMs)

Package Information and Pin Configuration

676-FBGA Package Details

Parameter Specification
Package Type Fine-pitch Ball Grid Array (FBGA)
Total Pins 676
Body Size 27mm x 27mm x 2.6mm
Ball Pitch 1.0mm
Mounting Type Surface Mount
MSL Rating Level 3

Pin Functionality Distribution

  • Power and Ground: Distributed for optimal power delivery
  • User I/O: 487 configurable I/O pins
  • Configuration Pins: JTAG, MODE, and DONE signals
  • Clock Inputs: Dedicated clock pins with DCM access
  • No-Connect: Some positions reserved for larger variants

Quality and Reliability Standards

Automotive Grade Compliance

The XA3S1500-4FG676 meets stringent automotive requirements:

  • Extended temperature qualification: -40°C to +100°C operation
  • Enhanced screening procedures: 100% electrical testing
  • Reliability stress testing: Temperature cycling, HTOL, HAST
  • Long-term availability: Designed for automotive product lifecycles

Environmental and RoHS Compliance

  • RoHS Status: Not compliant (contains lead in solder balls)
  • Alternative Options: Pb-free variants may be available on request
  • Handling Precautions: ESD-sensitive device, follow proper grounding

Development and Prototyping

Getting Started with XA3S1500-4FG676

  1. Development Board Selection: Choose Spartan-3 compatible boards
  2. Tool Installation: Download and install Xilinx ISE Design Suite
  3. Initial Programming: Use Platform Cable USB for JTAG access
  4. Design Entry: Create HDL designs in Verilog or VHDL
  5. Synthesis and Implementation: Generate bitstream configuration
  6. Testing and Verification: Use ChipScope for debugging

Design Best Practices

  • Clock Domain Management: Use DCMs for clock distribution and phase adjustment
  • Power Supply Design: Implement proper decoupling and filtering
  • Thermal Analysis: Calculate power consumption early in design phase
  • I/O Planning: Assign pins based on bank voltage and signaling requirements
  • Configuration Security: Implement bitstream encryption if needed

Ordering Information and Part Number Breakdown

Part Number Decode: XA3S1500-4FG676

  • XA: Automotive-grade qualification
  • 3S: Spartan-3 family
  • 1500: 1.5 million system gates
  • -4: Speed grade (higher is faster)
  • FG676: Package type (Fine-pitch BGA, 676 pins)

Available Variants

Part Number Temperature Grade
XA3S1500-4FG676I -40°C to +100°C Industrial/Automotive
XC3S1500-4FG676I -40°C to +100°C Industrial
XC3S1500-4FG676C 0°C to +85°C Commercial

Frequently Asked Questions

What is the difference between XA and XC series Spartan-3 FPGAs?

The XA series represents automotive-grade components with enhanced reliability testing, extended temperature ranges, and compliance with automotive quality standards. The XC series encompasses commercial and industrial grades suitable for less demanding environments.

Can I use XA3S1500-4FG676 in commercial applications?

Yes, the XA3S1500-4FG676 can be used in any application, though it may be over-specified for standard commercial use. The commercial-grade XC3S1500 variants are more cost-effective for non-automotive applications.

What programming cable is required?

The Xilinx Platform Cable USB or Platform Cable USB II are recommended for JTAG programming and debugging during development. Production programming typically uses external configuration memory.

What is the typical power consumption?

Power consumption varies based on design utilization, clock frequency, and I/O activity. The Xilinx Power Estimator (XPE) tool provides accurate estimates based on specific design parameters.

Is this FPGA suitable for safety-critical applications?

While the XA grade provides enhanced reliability, safety-critical applications may require additional certification and functional safety features. Consult with AMD Xilinx for safety-critical application support.

Why Choose XA3S1500-4FG676 for Your Design

The XA3S1500-4FG676 offers an optimal balance of performance, reliability, and cost-effectiveness for automotive and industrial applications. Its proven Spartan-3 architecture, combined with automotive-grade qualification, makes it a trusted choice for systems requiring long-term availability and operation in harsh environments. With comprehensive development tool support and extensive documentation, designers can rapidly implement complex digital logic while meeting stringent automotive quality requirements.

Whether you’re developing advanced driver assistance systems, industrial control modules, or telecommunications equipment, the XA3S1500-4FG676 provides the flexibility and performance needed for demanding applications. Its combination of 1.5 million gates, 487 I/O pins, and extended temperature operation ensures reliable performance across a wide range of use cases.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.