Product Overview: XA3S1000-4FTG256I FPGA
The XA3S1000-4FTG256I is an automotive-grade field-programmable gate array (FPGA) from AMD (formerly Xilinx), specifically designed for demanding industrial and automotive applications. This Spartan-3A family FPGA delivers 1,000,000 system gates with exceptional reliability and performance in extreme temperature environments.
Key Features of XA3S1000-4FTG256I
The XA3S1000-4FTG256I stands out with its robust specifications tailored for harsh operating conditions:
- System Gates: 1,000,000 gates for complex digital logic implementation
- Logic Array Blocks (LABs): 17,280 configurable logic cells
- RAM Capacity: 576 Kbits of embedded block RAM
- I/O Count: 175 user I/O pins for versatile connectivity
- Package Type: 256-ball FTBGA (17mm x 17mm)
- Operating Temperature: -40°C to 125°C (Industrial/Automotive Grade)
- Supply Voltage: 1.14V to 1.26V (Core), 3.0V to 3.6V (I/O)
Technical Specifications Table
| Parameter |
Specification |
| Part Number |
XA3S1000-4FTG256I |
| Manufacturer |
AMD (Xilinx) |
| Product Family |
Spartan-3A XA Automotive |
| System Gates |
1,000,000 |
| Logic Cells |
17,280 |
| Total RAM Bits |
589,824 (576 Kbits) |
| User I/O |
175 |
| Package/Case |
256-LBGA, CSPBGA |
| Package Dimensions |
17mm x 17mm |
| Mounting Type |
Surface Mount |
| Operating Temperature |
-40°C ~ 125°C (TJ) |
| Speed Grade |
-4 |
Performance Characteristics
| Feature |
Value |
| Maximum Frequency |
326 MHz (internal) |
| Voltage – Supply (Vcc/Vdd) |
1.14V ~ 1.26V (Core) |
| Voltage – I/O |
1.14V ~ 3.6V |
| Number of Gates |
1,000,000 |
| Number of LABs/CLBs |
1,728 CLBs |
| Distributed RAM |
107,520 bits |
| Block RAM |
576 Kbits |
| Number of Logic Elements/Cells |
17,280 |
Why Choose XA3S1000-4FTG256I for Your Design?
Automotive-Grade Reliability
The XA3S1000-4FTG256I meets stringent automotive qualification standards, making it ideal for safety-critical systems. This Xilinx FPGA delivers consistent performance across extreme temperature ranges, ensuring reliable operation in automotive, industrial control, and aerospace applications.
Optimal Resource Balance
With 1 million system gates and 576 Kbits of block RAM, this FPGA provides the perfect balance between logic capacity and memory resources for mid-range applications. The 175 I/O pins offer sufficient connectivity for complex interface requirements without unnecessary overhead.
Cost-Effective Solution
The Spartan-3A architecture delivers excellent price-to-performance ratio, making the XA3S1000-4FTG256I an economical choice for volume production while maintaining professional-grade capabilities.
Application Areas
Automotive Systems
- Engine control units (ECU)
- Advanced driver-assistance systems (ADAS)
- Infotainment systems
- Body control modules
- Battery management systems
Industrial Automation
- Motor control systems
- Programmable logic controllers (PLC)
- Factory automation equipment
- Process control systems
- Sensor interface modules
Communication Infrastructure
- Protocol conversion
- Network interface cards
- Data acquisition systems
- Signal processing applications
- Embedded vision systems
Design Resources and Development Tools
Compatible Development Platforms
The XA3S1000-4FTG256I is fully supported by AMD Vivado Design Suite and ISE Design Suite, offering:
- VHDL/Verilog synthesis for design entry
- IP core library access for rapid development
- Simulation tools for verification
- Timing analysis for performance optimization
- Configuration tools for device programming
Memory and Logic Architecture
| Resource Type |
Quantity |
Details |
| CLBs (Configurable Logic Blocks) |
1,728 |
Core logic resource |
| Distributed RAM |
107,520 bits |
Integrated into CLBs |
| Block RAM (18Kb blocks) |
32 blocks |
Dedicated memory blocks |
| Total Block RAM |
576 Kbits |
High-speed embedded memory |
| DCMs (Digital Clock Managers) |
4 |
Clock synthesis and management |
Package Information: 256-FTBGA
Physical Specifications
| Characteristic |
Value |
| Package Type |
Fine-pitch Ball Grid Array |
| Total Balls |
256 |
| Body Size |
17mm x 17mm |
| Ball Pitch |
1.0mm |
| Package Height |
Approximately 1.4mm |
| Moisture Sensitivity Level |
MSL 3 |
Thermal Characteristics
- Junction Temperature (TJ): -40°C to 125°C
- Storage Temperature: -65°C to 150°C
- Thermal Resistance (θJA): Varies with airflow and PCB design
- Recommended Operating Conditions: See AMD thermal management guidelines
Power Supply Requirements
Voltage Specifications
| Power Rail |
Voltage Range |
Typical Current |
Purpose |
| VCCINT |
1.14V – 1.26V |
Design dependent |
Core logic |
| VCCAUX |
2.375V – 2.625V |
150mA typical |
Auxiliary circuits |
| VCCO |
1.14V – 3.6V |
Design dependent |
I/O banks |
Power Consumption Considerations
Power consumption varies based on:
- Clock frequency and distribution
- Logic utilization percentage
- I/O switching activity
- Temperature conditions
- Design implementation
Use AMD Power Estimator (XPE) for accurate power analysis during design phase.
Quality and Compliance Standards
Automotive Qualification
The XA3S1000-4FTG256I meets automotive industry standards:
- AEC-Q100 Grade 2 qualified
- Extended temperature range operation
- Enhanced reliability testing
- Controlled manufacturing process
- Long-term availability commitment
RoHS and Environmental Compliance
- RoHS compliant (lead-free)
- Halogen-free options available
- REACH compliant
- Conflict minerals reporting available
Programming and Configuration
Configuration Options
The XA3S1000-4FTG256I supports multiple configuration modes:
- Master Serial Mode – FPGA controls external Flash memory
- Slave Serial Mode – External processor controls configuration
- JTAG Mode – Boundary-scan configuration and debug
- Master SelectMAP – 8-bit parallel configuration (fast)
- Slave SelectMAP – Processor-controlled parallel mode
Configuration Memory Requirements
- Bitstream size: Approximately 2,818,048 bits
- Recommended Flash: SPI Flash memory (4Mb minimum)
- Configuration time: Varies by mode (typical: 20-100ms)
Comparison with Related FPGAs
Spartan-3A Family Comparison
| Part Number |
System Gates |
Logic Cells |
Block RAM |
I/O Pins |
Package Options |
| XA3S250E |
250,000 |
5,508 |
216 Kbits |
Up to 172 |
Multiple |
| XA3S700A |
700,000 |
13,248 |
360 Kbits |
Up to 372 |
Multiple |
| XA3S1000-4FTG256I |
1,000,000 |
17,280 |
576 Kbits |
175 |
256-FTBGA |
| XA3S1400A |
1,400,000 |
25,344 |
576 Kbits |
Up to 502 |
Multiple |
Ordering and Availability Information
Part Number Breakdown
XA3S1000-4FTG256I decodes as:
- XA = Automotive grade Spartan
- 3S = Spartan-3A family
- 1000 = 1,000,000 system gates
- -4 = Speed grade (-4 is commercial grade speed)
- FTG256 = 256-ball Fine-pitch BGA package
- I = Industrial temperature range (-40°C to 100°C junction temp)
Lead Time and Stock Status
Contact authorized distributors for:
- Current stock availability
- Volume pricing
- Lead time estimates
- Sample requests
- Technical support
Design Considerations and Best Practices
PCB Layout Guidelines
When designing with XA3S1000-4FTG256I:
- Power supply decoupling: Place 0.1µF capacitors near each power pin
- Ground plane: Use solid ground plane for noise immunity
- Thermal management: Ensure adequate airflow and thermal vias
- Signal integrity: Match impedance for high-speed signals
- Configuration interface: Follow AMD guidelines for configuration pins
Clocking Strategy
- Utilize 4 Digital Clock Managers (DCMs) for clock synthesis
- Support for clock multiplication, division, and phase shifting
- Low-jitter clock distribution networks
- Multiple independent clock domains
I/O Standards Support
The XA3S1000-4FTG256I supports numerous I/O standards:
- LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V, 1.2V)
- LVDS (Low Voltage Differential Signaling)
- HSTL (High Speed Transceiver Logic)
- SSTL (Stub Series Terminated Logic)
- PCI, PCI-X compatible interfaces
Frequently Asked Questions
What is the difference between XA and XC Spartan-3A parts?
XA parts are automotive-grade with extended temperature range (-40°C to 125°C TJ) and enhanced reliability screening. XC parts are commercial/industrial grade with standard temperature ranges.
Can I use the same bitstream for XA3S1000 and XC3S1000?
Yes, XA and XC parts are pin-compatible and bitstream-compatible within the same package type, allowing easy migration between commercial and automotive grades.
What development tools are required?
AMD ISE Design Suite or Vivado Design Suite (for newer designs) are required for synthesis, implementation, and bitstream generation.
What is the typical power consumption?
Power consumption varies significantly based on design. Use AMD XPower Estimator (XPE) tool with your specific design parameters for accurate estimates.
Is the XA3S1000-4FTG256I suitable for new designs?
While Spartan-3A is a mature product family, it remains suitable for cost-sensitive applications. For new designs requiring advanced features, consider newer AMD FPGA families like Artix-7 or Spartan-7.
Technical Support and Resources
Documentation
- Device Datasheet: DS529 Spartan-3A FPGA Family
- User Guide: UG331 Spartan-3 Generation Configuration
- PCB Design Guide: UG112 Spartan-3A/3AN FPGA
- Power Distribution Guide: Application notes available from AMD
Development Tools
- AMD Vivado Design Suite
- ISE WebPACK (free version)
- ChipScope Pro for debugging
- PlanAhead for I/O planning
Getting Started
- Download development tools from AMD website
- Review device datasheet and user guides
- Select appropriate evaluation board
- Start with reference designs
- Access technical support through AMD forums
Conclusion: Why XA3S1000-4FTG256I Excels
The XA3S1000-4FTG256I represents a proven, reliable FPGA solution for automotive and industrial applications requiring:
✓ Automotive-grade reliability with AEC-Q100 qualification
✓ Extended temperature operation from -40°C to 125°C
✓ Balanced resources with 1M gates and 576Kbits RAM
✓ Cost-effective pricing for volume production
✓ Mature ecosystem with extensive tool support
✓ Pin compatibility for design scalability
Whether you’re developing engine control systems, industrial automation equipment, or embedded vision applications, this Xilinx FPGA delivers the performance, reliability, and value needed for mission-critical designs.
