Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XA3S1000-4FT256Q: High-Performance Automotive FPGA for Industrial Applications

Product Details

The XA3S1000-4FT256Q represents AMD’s advanced automotive-grade FPGA solution, delivering exceptional programmable logic capabilities for mission-critical industrial and automotive systems. This extended-temperature range device combines 1 million system gates with robust performance specifications optimized for harsh environmental conditions.

Product Overview: XA3S1000-4FT256Q FPGA Specifications

The XA3S1000-4FT256Q belongs to AMD’s renowned Spartan-3A automotive FPGA family, designed specifically for applications requiring exceptional reliability across extreme temperature ranges. This programmable logic device integrates sophisticated features that make it ideal for automotive control systems, industrial automation, and safety-critical applications.

Key Technical Specifications

Specification Value Details
Logic Elements 1,000,000 system gates Maximum design capacity
I/O Count 172 user I/Os Configurable interface pins
Package Type 256-FTBGA Fine-pitch ball grid array
Operating Temperature -40°C to +125°C Extended automotive grade
Speed Grade -4 High-performance variant
Supply Voltage 1.2V (core), 3.3V (I/O) Dual voltage operation
Configuration 18 Mbit Flash Non-volatile programming

Advanced FPGA Architecture and Features

Programmable Logic Resources

The XA3S1000-4FT256Q incorporates AMD’s proven FPGA architecture, providing designers with extensive programmable resources:

Core Logic Elements:

  • 1,000,000 system gates for complex digital designs
  • Distributed RAM for flexible memory implementation
  • Dedicated multiplier blocks for DSP operations
  • Fast carry logic for arithmetic-intensive applications

Memory Architecture:

  • 72 Kbits distributed SelectRAM memory
  • 432 Kbits block RAM resources
  • Dual-port RAM capabilities
  • Configurable memory depth and width

High-Speed I/O Capabilities

I/O Feature Specification Application Benefit
Total User I/Os 172 pins Extensive connectivity options
I/O Standards Multiple supported Interface flexibility
Differential Pairs Up to 86 pairs High-speed serial communication
LVDS Support Yes Low-voltage differential signaling
Maximum Toggle Rate 622 Mb/s Fast data transmission

Industrial and Automotive Applications

Automotive Control Systems

The XA3S1000-4FT256Q excels in automotive applications requiring high reliability:

  • Advanced driver assistance systems (ADAS)
  • Engine control units (ECU) with complex algorithms
  • Vehicle networking and gateway applications
  • Safety-critical real-time control systems
  • Infotainment system processing

Industrial Automation Solutions

This Xilinx FPGA delivers robust performance for industrial environments:

  • Programmable logic controllers (PLC)
  • Motor control and drive systems
  • Industrial communication protocols
  • Factory automation equipment
  • Process control instrumentation

Performance Characteristics and Speed Grades

Speed Grade -4 Performance Benefits

Performance Metric XA3S1000-4FT256Q Competitive Advantage
Maximum Frequency Up to 300 MHz High-speed processing
Logic Delay Optimized propagation Reduced latency
Setup Time Enhanced timing margins Reliable operation
Clock Distribution Low-skew network Synchronous designs

Power Consumption Analysis

The XA3S1000-4FT256Q implements advanced power management features for efficient operation:

Static Power:

  • Low-power CMOS technology
  • Standby current optimization
  • Temperature-dependent leakage control

Dynamic Power:

  • Clock gating capabilities
  • Power-down modes
  • Selective block activation

Package Information: 256-FTBGA

Physical Dimensions and Footprint

Package Parameter Specification
Package Type 256-pin FTBGA
Body Size 17mm x 17mm
Ball Pitch 1.0mm
Package Height 1.4mm maximum
Weight Approximately 0.5g

Thermal Characteristics

Thermal Management Specifications:

  • Junction temperature range: -40°C to +125°C
  • Theta JA: 34°C/W (typical)
  • Theta JC: 8°C/W (typical)
  • Enhanced thermal dissipation design
  • Compatible with standard thermal solutions

Design and Development Support

Development Tools and Software

AMD Vivado Design Suite:

  • Comprehensive FPGA development environment
  • Advanced synthesis and optimization
  • Timing analysis and simulation tools
  • Integrated debugging capabilities
  • IP core library access

Additional Design Resources:

  • Reference designs and application notes
  • PCB layout guidelines
  • Power supply design recommendations
  • Configuration file examples
  • Technical support documentation

Programming and Configuration

Configuration Method Features Use Case
JTAG In-circuit programming Development and debugging
Master Serial Mode SPI Flash boot Production deployment
Slave Serial Mode External controller System integration
Boundary Scan IEEE 1149.1 compliant Board-level testing

Quality and Reliability Standards

Automotive Qualification

The XA3S1000-4FT256Q meets stringent automotive industry requirements:

  • AEC-Q100 qualified components
  • Extended temperature range validation
  • Enhanced moisture sensitivity level (MSL)
  • Long-term reliability testing
  • Production part approval process (PPAP) support

Manufacturing Excellence

Quality Assurance Measures:

  • 100% electrical testing at production
  • Burn-in testing for automotive grade
  • Environmental stress screening
  • Humidity and temperature cycling
  • ESD protection verification

System Integration Guidelines

Power Supply Design Recommendations

Voltage Rail Requirements:

Rail Voltage Current (Typical) Tolerance
VCCINT 1.2V 500mA ±5%
VCCAUX 2.5V 150mA ±5%
VCCO 3.3V 300mA ±5%

PCB Layout Best Practices

Critical Design Considerations:

  • Controlled impedance routing for high-speed signals
  • Adequate power plane distribution
  • Proper decoupling capacitor placement
  • Thermal via implementation under package
  • Signal integrity maintenance for differential pairs

Competitive Advantages

Why Choose XA3S1000-4FT256Q?

Technical Superiority:

  • Extended temperature automotive qualification
  • Proven reliability in harsh environments
  • Comprehensive development ecosystem
  • Flexible I/O configuration options
  • Cost-effective high-gate-count solution

Market Positioning:

  • Ideal for automotive tier-1 suppliers
  • Industrial equipment manufacturers
  • Safety-critical system designers
  • High-reliability application developers

Ordering Information and Availability

Part Number Breakdown

XA3S1000-4FT256Q Nomenclature:

  • XA: Automotive extended temperature
  • 3S: Spartan-3A FPGA family
  • 1000: 1 million system gates
  • -4: Speed grade (high performance)
  • FT256: 256-pin FTBGA package
  • Q: Automotive temperature grade qualifier

Package and Storage

Shipping and Handling:

  • Moisture sensitivity level (MSL): 3
  • Tape and reel packaging available
  • ESD protection bag packaging
  • Dry pack storage requirements
  • Baking procedures before assembly

Technical Support and Resources

Documentation Library

Available Technical Documents:

  • Complete datasheet specifications
  • User guide and reference manual
  • Application notes collection
  • Errata and design advisories
  • PCB design checklist
  • Thermal design guide

Design Services

Professional Support Options:

  • Technical application assistance
  • Design review services
  • Custom IP development
  • System optimization consulting
  • Training and workshops

Comparison with Similar FPGA Devices

Competitive Analysis Table

Feature XA3S1000-4FT256Q Standard Grade Higher Density
Temperature Range -40°C to +125°C 0°C to +85°C -40°C to +100°C
System Gates 1,000,000 1,000,000 1,500,000+
Automotive Qualified Yes (AEC-Q100) No Select models
Package Options 256-FTBGA Multiple 484-FBGA+
Cost Position Premium automotive Commercial Higher

Frequently Asked Questions

What makes the XA3S1000-4FT256Q automotive-grade?

The XA3S1000-4FT256Q achieves automotive qualification through AEC-Q100 compliance, extended temperature operation (-40°C to +125°C), enhanced reliability testing, and strict quality control processes specifically designed for automotive applications.

How does the -4 speed grade impact performance?

The -4 speed grade represents the highest performance tier, offering optimized timing characteristics, higher maximum operating frequencies, and reduced propagation delays compared to slower speed grades.

What development tools are required?

AMD’s Vivado Design Suite provides comprehensive development support, including HDL synthesis, place-and-route, timing analysis, and debugging tools. Additional third-party EDA tools are also compatible.

Can this FPGA be reprogrammed in the field?

Yes, the XA3S1000-4FT256Q supports field reprogramming through JTAG interface or serial flash configuration, enabling firmware updates and design modifications after deployment.

Conclusion

The XA3S1000-4FT256Q automotive FPGA delivers exceptional performance, reliability, and flexibility for demanding industrial and automotive applications. With 1 million system gates, extended temperature operation, and comprehensive development support, this device represents an optimal solution for safety-critical programmable logic implementations.

Whether designing advanced automotive control systems, industrial automation equipment, or mission-critical processing applications, the XA3S1000-4FT256Q provides the robust performance and reliability required for success in harsh operating environments.

For detailed technical specifications, design resources, and ordering information, consult the complete datasheet and contact AMD’s technical support team.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.