Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XA3S1000-4FT256I: Complete Guide to AMD Xilinx Spartan-3 FPGA Technology

Product Details

Overview of XA3S1000-4FT256I FPGA

The XA3S1000-4FT256I represents a powerful member of AMD’s (formerly Xilinx) Spartan-3 family of Field-Programmable Gate Arrays. This industrial-grade FPGA delivers exceptional performance with 1 million system gates, making it ideal for cost-sensitive applications that demand reliable programmable logic solutions. Manufactured using advanced 90nm process technology, this chip combines affordability with robust functionality for industrial, automotive, and consumer electronics applications.

Key Technical Specifications

Core Performance Parameters

Parameter Specification
Logic Cells 17,280 cells
System Gates 1,000,000 gates
Distributed RAM 120 Kbit
Block RAM 432 Kbit
Maximum Frequency 280-630 MHz
Supply Voltage 1.2V (1.14V – 1.26V)
Process Technology 90nm CMOS
Operating Temperature -40°C to +100°C (Industrial)

Package and Pin Configuration

Feature Details
Package Type FTBGA-256 (Fine-pitch Ball Grid Array)
Pin Count 256 pins
User I/O Pins 173 I/O
Mounting Style SMD/SMT Surface Mount
Package Dimensions Compact footprint design

Advanced Features and Architecture

Programmable Logic Resources

The XA3S1000-4FT256I incorporates 17,280 logic cells organized into 1,920 Configurable Logic Blocks (CLBs). This architecture provides exceptional flexibility for implementing complex digital designs, from simple glue logic to sophisticated signal processing algorithms.

Memory Capabilities

Distributed RAM: 120 Kbit of distributed memory enables efficient small memory implementations throughout the FPGA fabric.

Block RAM: 432 Kbit of dedicated block RAM provides high-density storage for data buffering, FIFO implementations, and lookup tables.

Clock Management

Built-in Digital Clock Manager (DCM) resources allow for precise clock frequency synthesis, phase shifting, and jitter reduction, essential for high-performance synchronous designs.

I/O Standards Support

The device supports multiple I/O standards including LVTTL, LVCMOS, LVDS, and differential signaling options, ensuring compatibility with various interface requirements.

Applications and Use Cases

Industrial Automation

The XA3S1000-4FT256I excels in industrial control systems, motor drives, and process automation where reliable logic control is paramount. Its industrial temperature range ensures stable operation in harsh environments.

Consumer Electronics

Perfect for broadband access equipment, digital displays, and home networking devices where cost-effectiveness meets performance requirements.

Automotive Systems

With its industrial temperature rating and robust design, this FPGA suits automotive applications including dashboard controllers, infotainment systems, and sensor interfaces.

Communication Infrastructure

Ideal for protocol conversion, data buffering, and interface bridging in telecommunications equipment and networking hardware.

Signal Processing

The substantial logic resources and memory make it suitable for digital signal processing tasks, including filtering, data compression, and real-time analysis.

Design and Integration Benefits

Cost-Effective Solution

Compared to ASICs, the XA3S1000-4FT256I eliminates high NRE costs and lengthy development cycles while providing similar functionality. Field upgradability allows design improvements without hardware replacement.

Rapid Prototyping

FPGA technology enables quick design iterations and testing, significantly reducing time-to-market for new products.

Flexibility and Scalability

Programmable architecture allows for design modifications, feature additions, and bug fixes through simple reconfiguration.

Power Efficiency

Advanced 90nm process technology delivers optimal performance per watt, crucial for battery-powered and energy-conscious applications.

Programming and Development

Configuration Methods

  • JTAG Programming: Industry-standard boundary scan interface for device programming and debugging
  • Master Serial Mode: Direct configuration from serial PROM
  • Slave Serial Mode: Configuration under external microcontroller control
  • Boundary Scan: Built-in IEEE 1149.1 JTAG support

Development Tools

Compatible with AMD Xilinx Vivado Design Suite and ISE Design Suite, providing comprehensive tools for design entry, synthesis, implementation, and verification.

IP Core Support

Access to extensive library of pre-verified IP cores including processors (MicroBlaze), communication protocols, and DSP functions.

Quality and Reliability

Industrial Grade Rating

The “-I” suffix designation indicates industrial temperature range operation (-40°C to +100°C), ensuring reliable performance across demanding environmental conditions.

Speed Grade

The “-4” speed grade indicates moderate performance characteristics, balancing power consumption with operational frequency.

RoHS Compliance

Note: This part contains lead and is RoHS non-compliant, suitable for industrial and automotive applications with appropriate exemptions.

Comparison with Related Products

Spartan-3 Family Overview

Model Logic Cells Block RAM User I/O Package Options
XC3S50 1,728 72 Kbit 124 Various
XC3S200 4,320 216 Kbit 173 Various
XC3S400 8,064 288 Kbit 264 Various
XC3S1000 17,280 432 Kbit 173-391 Multiple
XC3S1500 29,952 576 Kbit 487 Various

Alternative Options

XC3S1500-4FG456C: Higher density option with increased logic capacity for more complex designs.

Altera MAX 10 Series: Competitive FPGA offering similar capabilities from Intel (formerly Altera).

Lattice ECP3 Series: Alternative low-cost FPGA solution with comparable features.

Design Considerations

Power Supply Requirements

Requires regulated 1.2V core voltage (VCCINT) and auxiliary voltage (VCCAUX) for optimal operation. External power management IC recommended for voltage regulation.

Thermal Management

While power consumption is moderate, adequate PCB thermal design ensures reliable long-term operation. Consider thermal vias and appropriate copper plane design.

PCB Layout Guidelines

  • Use controlled impedance traces for high-speed signals
  • Implement proper power plane design with adequate decoupling
  • Follow manufacturer spacing requirements for BGA package
  • Consider signal integrity for high-frequency designs

Configuration Circuit Design

Implement proper pull-up/pull-down resistors on configuration pins and provide clean power sequencing during device startup.

Xilinx FPGA Technology Leadership

AMD Xilinx continues to lead the programmable logic industry with innovative FPGA solutions. The Spartan-3 family exemplifies the company’s commitment to delivering cost-effective, high-performance devices for mainstream applications.

Purchasing Information

Availability and Stock

Currently available through authorized distributors including DigiKey, Mouser, and other global electronics suppliers.

Package Options

Typically supplied in anti-static tray packaging, with tape and reel options available for high-volume automated assembly.

Minimum Order Quantities

Varies by distributor; typically available in single units for prototyping or volume quantities for production.

Technical Support Resources

Documentation

  • Complete datasheet with electrical specifications
  • User guides for design implementation
  • Application notes for specific use cases
  • Reference designs and example projects

Design Tools

  • Xilinx ISE Design Suite (legacy support)
  • Vivado Design Suite compatibility
  • Third-party EDA tool support
  • Simulation models and timing files

Frequently Asked Questions

What is the maximum clock speed supported?

The XA3S1000-4FT256I supports internal logic speeds up to 630 MHz, with actual achievable frequency depending on design complexity and routing.

Can this FPGA be reprogrammed in the field?

Yes, one of the key advantages of FPGA technology is the ability to reconfigure the device multiple times without hardware replacement.

What development tools are required?

AMD Xilinx ISE or Vivado Design Suite provides the complete development environment for design, synthesis, and implementation.

Is this suitable for high-volume production?

Absolutely, the Spartan-3 family was specifically designed for cost-sensitive, high-volume consumer and industrial applications.

What is the power consumption?

Actual power consumption depends on design utilization and clock frequency, typically ranging from a few hundred milliwatts to several watts under full operation.

Conclusion

The XA3S1000-4FT256I represents an excellent balance of cost, performance, and functionality in the programmable logic market. Its 1 million system gates, industrial temperature rating, and comprehensive I/O capabilities make it suitable for diverse applications across multiple industries. Whether you’re designing industrial controls, consumer electronics, or automotive systems, this FPGA provides the flexibility and reliability required for successful product development.

For engineers seeking a proven, cost-effective FPGA solution with substantial logic resources and robust industrial specifications, the XA3S1000-4FT256I delivers exceptional value and performance.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.