Overview of XA3S1000-4FT256I FPGA
The XA3S1000-4FT256I represents a powerful member of AMD’s (formerly Xilinx) Spartan-3 family of Field-Programmable Gate Arrays. This industrial-grade FPGA delivers exceptional performance with 1 million system gates, making it ideal for cost-sensitive applications that demand reliable programmable logic solutions. Manufactured using advanced 90nm process technology, this chip combines affordability with robust functionality for industrial, automotive, and consumer electronics applications.
Key Technical Specifications
Core Performance Parameters
| Parameter |
Specification |
| Logic Cells |
17,280 cells |
| System Gates |
1,000,000 gates |
| Distributed RAM |
120 Kbit |
| Block RAM |
432 Kbit |
| Maximum Frequency |
280-630 MHz |
| Supply Voltage |
1.2V (1.14V – 1.26V) |
| Process Technology |
90nm CMOS |
| Operating Temperature |
-40°C to +100°C (Industrial) |
Package and Pin Configuration
| Feature |
Details |
| Package Type |
FTBGA-256 (Fine-pitch Ball Grid Array) |
| Pin Count |
256 pins |
| User I/O Pins |
173 I/O |
| Mounting Style |
SMD/SMT Surface Mount |
| Package Dimensions |
Compact footprint design |
Advanced Features and Architecture
Programmable Logic Resources
The XA3S1000-4FT256I incorporates 17,280 logic cells organized into 1,920 Configurable Logic Blocks (CLBs). This architecture provides exceptional flexibility for implementing complex digital designs, from simple glue logic to sophisticated signal processing algorithms.
Memory Capabilities
Distributed RAM: 120 Kbit of distributed memory enables efficient small memory implementations throughout the FPGA fabric.
Block RAM: 432 Kbit of dedicated block RAM provides high-density storage for data buffering, FIFO implementations, and lookup tables.
Clock Management
Built-in Digital Clock Manager (DCM) resources allow for precise clock frequency synthesis, phase shifting, and jitter reduction, essential for high-performance synchronous designs.
I/O Standards Support
The device supports multiple I/O standards including LVTTL, LVCMOS, LVDS, and differential signaling options, ensuring compatibility with various interface requirements.
Applications and Use Cases
Industrial Automation
The XA3S1000-4FT256I excels in industrial control systems, motor drives, and process automation where reliable logic control is paramount. Its industrial temperature range ensures stable operation in harsh environments.
Consumer Electronics
Perfect for broadband access equipment, digital displays, and home networking devices where cost-effectiveness meets performance requirements.
Automotive Systems
With its industrial temperature rating and robust design, this FPGA suits automotive applications including dashboard controllers, infotainment systems, and sensor interfaces.
Communication Infrastructure
Ideal for protocol conversion, data buffering, and interface bridging in telecommunications equipment and networking hardware.
Signal Processing
The substantial logic resources and memory make it suitable for digital signal processing tasks, including filtering, data compression, and real-time analysis.
Design and Integration Benefits
Cost-Effective Solution
Compared to ASICs, the XA3S1000-4FT256I eliminates high NRE costs and lengthy development cycles while providing similar functionality. Field upgradability allows design improvements without hardware replacement.
Rapid Prototyping
FPGA technology enables quick design iterations and testing, significantly reducing time-to-market for new products.
Flexibility and Scalability
Programmable architecture allows for design modifications, feature additions, and bug fixes through simple reconfiguration.
Power Efficiency
Advanced 90nm process technology delivers optimal performance per watt, crucial for battery-powered and energy-conscious applications.
Programming and Development
Configuration Methods
- JTAG Programming: Industry-standard boundary scan interface for device programming and debugging
- Master Serial Mode: Direct configuration from serial PROM
- Slave Serial Mode: Configuration under external microcontroller control
- Boundary Scan: Built-in IEEE 1149.1 JTAG support
Development Tools
Compatible with AMD Xilinx Vivado Design Suite and ISE Design Suite, providing comprehensive tools for design entry, synthesis, implementation, and verification.
IP Core Support
Access to extensive library of pre-verified IP cores including processors (MicroBlaze), communication protocols, and DSP functions.
Quality and Reliability
Industrial Grade Rating
The “-I” suffix designation indicates industrial temperature range operation (-40°C to +100°C), ensuring reliable performance across demanding environmental conditions.
Speed Grade
The “-4” speed grade indicates moderate performance characteristics, balancing power consumption with operational frequency.
RoHS Compliance
Note: This part contains lead and is RoHS non-compliant, suitable for industrial and automotive applications with appropriate exemptions.
Comparison with Related Products
Spartan-3 Family Overview
| Model |
Logic Cells |
Block RAM |
User I/O |
Package Options |
| XC3S50 |
1,728 |
72 Kbit |
124 |
Various |
| XC3S200 |
4,320 |
216 Kbit |
173 |
Various |
| XC3S400 |
8,064 |
288 Kbit |
264 |
Various |
| XC3S1000 |
17,280 |
432 Kbit |
173-391 |
Multiple |
| XC3S1500 |
29,952 |
576 Kbit |
487 |
Various |
Alternative Options
XC3S1500-4FG456C: Higher density option with increased logic capacity for more complex designs.
Altera MAX 10 Series: Competitive FPGA offering similar capabilities from Intel (formerly Altera).
Lattice ECP3 Series: Alternative low-cost FPGA solution with comparable features.
Design Considerations
Power Supply Requirements
Requires regulated 1.2V core voltage (VCCINT) and auxiliary voltage (VCCAUX) for optimal operation. External power management IC recommended for voltage regulation.
Thermal Management
While power consumption is moderate, adequate PCB thermal design ensures reliable long-term operation. Consider thermal vias and appropriate copper plane design.
PCB Layout Guidelines
- Use controlled impedance traces for high-speed signals
- Implement proper power plane design with adequate decoupling
- Follow manufacturer spacing requirements for BGA package
- Consider signal integrity for high-frequency designs
Configuration Circuit Design
Implement proper pull-up/pull-down resistors on configuration pins and provide clean power sequencing during device startup.
AMD Xilinx continues to lead the programmable logic industry with innovative FPGA solutions. The Spartan-3 family exemplifies the company’s commitment to delivering cost-effective, high-performance devices for mainstream applications.
Purchasing Information
Availability and Stock
Currently available through authorized distributors including DigiKey, Mouser, and other global electronics suppliers.
Package Options
Typically supplied in anti-static tray packaging, with tape and reel options available for high-volume automated assembly.
Minimum Order Quantities
Varies by distributor; typically available in single units for prototyping or volume quantities for production.
Technical Support Resources
Documentation
- Complete datasheet with electrical specifications
- User guides for design implementation
- Application notes for specific use cases
- Reference designs and example projects
Design Tools
- Xilinx ISE Design Suite (legacy support)
- Vivado Design Suite compatibility
- Third-party EDA tool support
- Simulation models and timing files
Frequently Asked Questions
What is the maximum clock speed supported?
The XA3S1000-4FT256I supports internal logic speeds up to 630 MHz, with actual achievable frequency depending on design complexity and routing.
Can this FPGA be reprogrammed in the field?
Yes, one of the key advantages of FPGA technology is the ability to reconfigure the device multiple times without hardware replacement.
What development tools are required?
AMD Xilinx ISE or Vivado Design Suite provides the complete development environment for design, synthesis, and implementation.
Is this suitable for high-volume production?
Absolutely, the Spartan-3 family was specifically designed for cost-sensitive, high-volume consumer and industrial applications.
What is the power consumption?
Actual power consumption depends on design utilization and clock frequency, typically ranging from a few hundred milliwatts to several watts under full operation.
Conclusion
The XA3S1000-4FT256I represents an excellent balance of cost, performance, and functionality in the programmable logic market. Its 1 million system gates, industrial temperature rating, and comprehensive I/O capabilities make it suitable for diverse applications across multiple industries. Whether you’re designing industrial controls, consumer electronics, or automotive systems, this FPGA provides the flexibility and reliability required for successful product development.
For engineers seeking a proven, cost-effective FPGA solution with substantial logic resources and robust industrial specifications, the XA3S1000-4FT256I delivers exceptional value and performance.