Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XA3S1000-4FG456Q: High-Performance Automotive FPGA for Advanced Applications

Product Details

The XA3S1000-4FG456Q from AMD Xilinx represents a cutting-edge solution in automotive-grade field-programmable gate arrays. This Spartan-3 family FPGA combines robust performance, cost-effectiveness, and automotive qualification standards, making it ideal for mission-critical applications in modern vehicles and industrial systems.

Overview of XA3S1000-4FG456Q Automotive FPGA

The XA3S1000-4FG456Q is an automotive-qualified Xilinx FPGA designed specifically for high-volume, cost-sensitive automotive electronic applications. Built on advanced 90nm process technology, this device delivers exceptional functionality and bandwidth while maintaining the stringent quality standards required for automotive environments.

Key Features and Specifications

Parameter Specification
Family XA Spartan-3 Automotive
Logic Cells 17,280 cells
System Gates 1,000,000 (1M) gates
Process Technology 90nm
Operating Voltage 1.2V (1.14V to 1.26V)
Package Type 456-Pin Fine-pitch Ball Grid Array (F-BGA)
Temperature Range -40°C to +100°C (TJ) I-Grade
Speed Grade -4
RAM Capacity 54 KB embedded block RAM
Qualification AEC-Q100 certified
RoHS Compliance Lead-free / RoHS compliant

Technical Specifications of XA3S1000-4FG456Q

Logic and Memory Resources

The XA3S1000-4FG456Q features substantial logic resources that enable complex digital design implementations:

Resource Type Quantity
Configurable Logic Blocks (CLBs) 1,920 CLBs
Logic Cells 17,280
Distributed RAM 240 Kb
Block RAM 432 Kb (54 KB)
18×18 Multipliers 24
Digital Clock Managers (DCMs) 4
User I/O Pins Up to 333

Performance Characteristics

The XA3S1000-4FG456Q delivers impressive performance metrics suitable for demanding automotive applications:

  • Maximum Operating Frequency: Up to 263 MHz internal logic
  • Speed Grade: -4 (commercial grade performance)
  • Power Consumption: Low-power 90nm CMOS technology
  • Configuration Time: Fast SRAM-based configuration
  • I/O Performance: Supports multiple signaling standards

Applications of XA3S1000-4FG456Q in Automotive Systems

Advanced Driver Assistance Systems (ADAS)

The XA3S1000-4FG456Q excels in ADAS applications including:

  • Lane departure warning systems
  • Collision avoidance systems
  • Parking assistance
  • Adaptive cruise control processing
  • Sensor fusion algorithms

Automotive Infotainment Systems

This FPGA provides the processing power for:

  • Digital instrument clusters
  • Navigation systems
  • Multimedia processing
  • Display controllers
  • Audio/video interfaces

Vehicle Communication Networks

The device supports critical automotive networking protocols:

  • CAN (Controller Area Network) interfaces
  • FlexRay protocol implementation
  • MOST (Media Oriented Systems Transport)
  • Automotive Ethernet gateways
  • LIN (Local Interconnect Network)

Body Electronics and Lighting

Applications include:

  • LED lighting control systems
  • Body control modules
  • Powertrain control interfaces
  • Climate control systems
  • Smart headlight controllers

Why Choose XA3S1000-4FG456Q for Your Design

Automotive-Grade Reliability

The XA3S1000-4FG456Q meets rigorous automotive standards:

Qualification Details
AEC-Q100 Industry-standard automotive qualification
Temperature Grade I-Grade: -40°C to +100°C junction temperature
PPAP Support Full Production Part Approval Process documentation
Quality Assurance Extended automotive-grade testing

Cost-Effective Solution

Compared to ASICs and ASSPs, this FPGA offers:

  • Zero NRE costs – No expensive mask sets or tooling
  • Faster time-to-market – Reconfigurable architecture eliminates lengthy design cycles
  • Design flexibility – Field upgrades without hardware replacement
  • Lower risk – Avoid obsolescence issues common with fixed-function devices

Comprehensive I/O Support

The XA3S1000-4FG456Q supports extensive signaling standards:

  • LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V, 1.2V)
  • SSTL (Stub Series Terminated Logic)
  • HSTL (High-Speed Transceiver Logic)
  • Differential standards (LVDS, RSDS)
  • Bus standards (PCI, GTL, GTLP)

Design Implementation with XA3S1000-4FG456Q

Development Tools and Software Support

Engineers can leverage industry-standard tools:

  • Xilinx ISE Design Suite – Complete FPGA design flow
  • Vivado Design Suite – Advanced synthesis and implementation
  • IP Core Library – Pre-verified intellectual property blocks
  • ChipScope Pro – Real-time logic analysis
  • EDK (Embedded Development Kit) – Embedded processor support

Pin Configuration and Package Details

The 456-pin F-BGA package provides:

Package Parameter Value
Package Dimensions 23mm x 23mm
Ball Pitch 1.0mm
Total Pins 456
User I/O Up to 333 pins
Power/Ground Pins Dedicated distribution
Configuration Pins Multiple modes supported

Competitive Advantages of Spartan-3 Architecture

Enhanced Clock Management

The four Digital Clock Managers provide:

  • Frequency synthesis and multiplication
  • Phase shifting capabilities
  • Clock deskew and distribution
  • Duty cycle correction
  • Fine-grained clock control

Memory Architecture Benefits

The hierarchical memory structure offers:

  • Block RAM: Large data buffers and FIFOs
  • Distributed RAM: Small, fast lookup tables
  • Flexible allocation: Optimize for specific applications
  • Dual-port capability: Simultaneous read/write operations

Quality and Environmental Compliance

RoHS and Environmental Standards

The XA3S1000-4FG456Q meets global environmental requirements:

  • Lead-free packaging – RoHS 6/6 compliant
  • Halogen-free options – Available upon request
  • REACH compliance – European chemical regulations
  • Green manufacturing – Environmentally responsible production

Reliability Testing

Each device undergoes comprehensive testing:

  • Thermal cycling
  • High-temperature operating life
  • Temperature/humidity/bias testing
  • Electrostatic discharge (ESD) protection
  • Latch-up immunity verification

Comparison with Similar FPGA Devices

XA3S1000-4FG456Q vs Other Spartan-3 Variants

Model Logic Cells Package I/O Pins Application Focus
XA3S1000-4FG456Q 17,280 456-FBGA 333 Balanced automotive applications
XA3S500-4FT256Q 10,476 256-FTBGA 186 Compact automotive designs
XA3S1400-4FG484Q 25,344 484-FBGA 343 High-density automotive systems
XA3S50-4VQ100Q 1,584 100-VQFP 63 Entry-level automotive

Power Management and Thermal Considerations

Supply Voltage Requirements

Power Rail Voltage Range Purpose
VCCINT 1.14V – 1.26V Core logic supply
VCCAUX 2.375V – 2.625V Auxiliary circuits
VCCO 1.2V – 3.3V I/O bank supply (varies by standard)

Thermal Management

Proper thermal design ensures reliable operation:

  • Maximum junction temperature: 100°C (I-Grade)
  • Package thermal resistance: θJA varies by airflow
  • Heat sink recommendations available in datasheets
  • Thermal simulation tools supported

Getting Started with XA3S1000-4FG456Q

Evaluation and Development

Engineers can begin development using:

  • Development boards – Third-party automotive evaluation platforms
  • Reference designs – Pre-built IP cores and examples
  • Design services – Partner ecosystem support
  • Training resources – Online tutorials and documentation

Configuration and Programming

The XA3S1000-4FG456Q supports multiple configuration modes:

  • Master Serial mode
  • Slave Serial mode
  • Master SelectMAP mode
  • Slave SelectMAP mode
  • JTAG boundary-scan mode

Ordering Information and Availability

Part Number Nomenclature

XA3S1000-4FG456Q breakdown:

  • XA = Automotive qualified
  • 3S = Spartan-3 family
  • 1000 = 1 million system gates
  • -4 = Speed grade
  • FG456 = Fine-pitch BGA, 456 pins
  • Q = Q-grade or I-grade temperature range designation

Supply Chain and Distribution

The XA3S1000-4FG456Q is available through:

  • Authorized AMD Xilinx distributors
  • Global electronic component suppliers
  • Direct from manufacturer for volume orders
  • Franchise distributors with quality guarantees

Frequently Asked Questions

What makes the XA3S1000-4FG456Q automotive-qualified?

The device is AEC-Q100 certified, meeting stringent automotive reliability standards including extended temperature ranges, enhanced quality testing, and full PPAP documentation support.

Can this FPGA be reprogrammed in the field?

Yes, the XA3S1000-4FG456Q features SRAM-based configuration, allowing unlimited reprogramming for design updates without hardware replacement.

What is the typical power consumption?

Power consumption varies based on design utilization and operating frequency. The 90nm process technology provides efficient power characteristics, with detailed calculations available using Xilinx XPower tools.

Is technical support available for this device?

AMD Xilinx provides comprehensive technical support including datasheets, application notes, reference designs, and access to field application engineers.

What is the lead time for ordering?

Lead times vary by distributor and order quantity. Contact authorized distributors for current availability and delivery schedules.

Conclusion: Trusted FPGA Solution for Automotive Innovation

The XA3S1000-4FG456Q represents a proven, reliable solution for automotive electronic systems requiring programmable logic capability. With AEC-Q100 qualification, substantial logic resources, and comprehensive tool support, this FPGA enables engineers to implement sophisticated digital designs while meeting the demanding requirements of automotive applications.

Whether developing advanced driver assistance systems, infotainment platforms, or body electronics modules, the XA3S1000-4FG456Q delivers the performance, flexibility, and quality required for success in the automotive industry. Its combination of cost-effectiveness, reconfigurability, and automotive-grade reliability makes it an ideal choice for high-volume production applications.

For detailed technical specifications, design resources, and ordering information, consult with authorized AMD Xilinx distributors or visit the manufacturer’s official documentation portal.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.