Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XA3S1000-4FG456I: High-Performance Automotive FPGA for Industrial Applications

Product Details

Overview of XA3S1000-4FG456I Automotive Spartan-3 FPGA

The XA3S1000-4FG456I is a premium automotive-grade Field-Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) Spartan-3 family. This advanced programmable logic device delivers exceptional performance with 1 million system gates and 17,280 logic cells, making it an ideal solution for automotive electronics, industrial automation, and high-reliability applications. Built on cutting-edge 90nm CMOS technology, this Xilinx FPGA combines robust automotive qualifications with flexible programmability.

Key Specifications and Technical Features

Core Architecture Specifications

Parameter Specification
Part Number XA3S1000-4FG456I
Manufacturer AMD (Xilinx)
Product Family Spartan-3 Automotive (XA)
System Gates 1,000,000 (1M Gates)
Logic Cells 17,280
Configurable Logic Blocks (CLBs) 1,920
Process Technology 90nm CMOS
Maximum Frequency 630 MHz

Memory and I/O Configuration

Feature Value
Total RAM Bits 442,368 bits
User I/O Pins 333
Total Package Pins 456
Package Type FBGA (Fine-pitch Ball Grid Array)
Package Designation 456-BBGA / FG456
RoHS Compliance RoHS Compliant (Lead-Free)

Electrical Characteristics

Parameter Rating
Core Voltage (VCCINT) 1.2V (1.14V – 1.26V)
I/O Voltage (VCCIO) Configurable (1.2V – 3.3V)
Speed Grade -4 (Industrial Grade)
Operating Temperature Range -40°C to +100°C (TJ)
Qualification Level Automotive Grade (AEC-Q100)
Moisture Sensitivity Level MSL 3

Advanced Features and Capabilities

Programmable Logic Resources

The XA3S1000-4FG456I FPGA offers extensive programmable resources designed for complex digital designs:

  • 17,280 Logic Cells: Enables implementation of sophisticated algorithms and data processing functions
  • 1,920 CLBs: Provides flexible logic implementation with each CLB containing four slices
  • 442K Total RAM: Integrated block RAM for efficient data buffering and storage
  • Digital Clock Managers (DCMs): Advanced clock management for precise timing control
  • Dedicated Multipliers: Hardware multiplication blocks for DSP applications

Automotive-Grade Reliability

This automotive-qualified FPGA meets stringent industry standards:

  • AEC-Q100 Qualified: Meets automotive electronics council requirements
  • Extended Temperature Range: Industrial-grade operation from -40°C to +100°C
  • Enhanced ESD Protection: Robust protection against electrostatic discharge
  • Automotive Quality Standards: Designed for mission-critical automotive systems
  • Long-Term Availability: Supported lifecycle for automotive production requirements

Application Areas and Use Cases

Automotive Electronics Applications

Application Category Specific Uses
Advanced Driver Assistance Systems (ADAS) Sensor fusion, camera processing, radar signal processing
Infotainment Systems Display controllers, audio processing, connectivity interfaces
Body Electronics Lighting control, door modules, climate control systems
Instrument Clusters Digital dashboards, gauge control, CAN bus interfaces
Powertrain Control Engine management, transmission control, motor drives
Gateway Modules Network bridging, protocol conversion, data routing

Industrial and Commercial Applications

  • Industrial Automation: PLC controllers, motion control, machine vision
  • Communications Equipment: Protocol converters, network processors, data encryptors
  • Datacom Modules: High-speed serial interfaces, packet processing
  • Power Delivery Systems: Smart grid controllers, power monitoring
  • Test and Measurement: Signal generators, data acquisition systems
  • Medical Devices: Imaging equipment, diagnostic instruments

Technical Advantages Over Competing Solutions

Superior Design Flexibility

The XA3S1000-4FG456I offers significant advantages compared to traditional ASICs and microcontrollers:

  1. No NRE Costs: Eliminates expensive non-recurring engineering charges associated with ASIC development
  2. Rapid Prototyping: Allows quick design iterations and modifications
  3. Field Upgradeable: Enables firmware updates without hardware replacement
  4. Shorter Time-to-Market: Accelerates product development cycles
  5. Future-Proof Design: Accommodates evolving standards and requirements

Performance Benchmarks

Performance Metric XA3S1000-4FG456I
Logic Density 1 Million Gates
Maximum Clock Frequency 630 MHz
DSP Performance Hardware multipliers for efficient signal processing
I/O Bandwidth 333 user I/O pins with configurable standards
Power Efficiency Optimized 90nm process technology

Pin Configuration and Package Details

Package Characteristics

The FG456 package provides optimal density and routing capabilities:

  • Package Dimensions: 23mm x 23mm FBGA
  • Ball Pitch: 1.0mm fine-pitch array
  • Pin Count: 456 total pins (333 user I/O)
  • Mounting: Surface mount technology (SMT)
  • Thermal Performance: Enhanced thermal dissipation
  • PCB Design: Compatible with standard FR-4 PCB processes

I/O Standards Support

The device supports multiple I/O voltage standards:

  • LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V)
  • SSTL (Stub Series Terminated Logic)
  • HSTL (High-Speed Transceiver Logic)
  • Differential standards (LVDS, RSDS)
  • PCI, PCI-X compatible

Design and Development Resources

Software Tools and Programming

Tool Category Description
ISE Design Suite Complete FPGA design environment for synthesis and implementation
Vivado Design Suite Next-generation design tools with enhanced features
Programming Options JTAG, SelectMAP, Serial, SPI Flash configuration
Simulation Tools ModelSim, ISim for design verification
IP Cores Extensive library of pre-verified IP blocks

Development Board Options

Popular development platforms supporting XA3S1000-4FG456I:

  • Spartan-3 Starter Kit
  • Custom automotive evaluation boards
  • Third-party prototyping platforms
  • Digilent educational boards

Supply Chain and Availability

Sourcing Information

Distribution Category Details
Authorized Distributors DigiKey, Mouser, Arrow, Avnet
Lead Time Varies by distributor and quantity
Minimum Order Quantity (MOQ) Typically 1 unit for prototyping
Volume Pricing Available for production quantities
Lifecycle Status Active production with long-term automotive support

Quality and Compliance

  • Quality Management: ISO 9001 certified manufacturing
  • Environmental Compliance: RoHS, REACH compliant
  • Traceability: Full lot traceability for automotive applications
  • Reliability Testing: HTOL, TC, autoclave qualified

Comparison with Related FPGA Models

Spartan-3 Family Comparison

Model Gates CLBs User I/O Package Application Focus
XA3S1000-4FG456I 1M 1,920 333 456-BGA High-density automotive
XA3S500-4FG456I 500K 960 333 456-BGA Mid-range automotive
XA3S1500-4FG456I 1.5M 2,880 333 456-BGA Premium automotive
XC3S1000-4FG456I 1M 1,920 333 456-BGA Commercial/Industrial

Installation and Implementation Guidelines

PCB Design Considerations

When designing with the XA3S1000-4FG456I:

  1. Power Supply Design: Implement separate voltage rails for VCCINT (1.2V) and VCCIO
  2. Decoupling Capacitors: Place multiple capacitors close to power pins
  3. Thermal Management: Include adequate copper pour and thermal vias
  4. Signal Integrity: Follow high-speed design guidelines for critical signals
  5. Configuration Interface: Design JTAG or configuration memory connections

Configuration Methods

Multiple configuration options available:

  • Master Serial Mode: Using SPI Flash memory
  • Slave Serial Mode: Configured by external processor
  • JTAG Configuration: For development and debugging
  • Boundary Scan: IEEE 1149.1 JTAG support

Why Choose XA3S1000-4FG456I for Your Project

Automotive-Grade Quality Assurance

The XA prefix designates this device as automotive-qualified, meaning it has undergone rigorous testing:

  • Extended temperature cycling
  • High-temperature operating life (HTOL)
  • Accelerated moisture resistance testing
  • Electromagnetic compatibility (EMC) qualification
  • AEC-Q100 stress testing

Cost-Effective Programmable Solution

Compared to ASIC development, the XA3S1000-4FG456I provides:

  • Lower Initial Investment: No mask costs or minimum volume requirements
  • Reduced Development Risk: Design changes don’t require new silicon
  • Faster Market Entry: Weeks instead of months for design iterations
  • Volume Scalability: Competitive pricing at automotive production volumes
  • Obsolescence Protection: Long product lifecycle support

Technical Support and Documentation

Available Resources

  • Complete datasheet with electrical specifications
  • Reference designs and application notes
  • PCB layout guidelines and footprints
  • Programming and configuration guides
  • Technical support from AMD/Xilinx

Additional Information

For detailed technical specifications, programming guides, and development tools, consult the official AMD (Xilinx) documentation or contact authorized distributors.

Frequently Asked Questions

Q: What is the difference between XA and XC Spartan-3 FPGAs? A: XA-designated devices are automotive-qualified with AEC-Q100 compliance and extended temperature ranges, while XC devices are commercial/industrial grade.

Q: Can the XA3S1000-4FG456I be used in safety-critical applications? A: Yes, with proper system-level safety measures and compliance with ISO 26262 functional safety standards.

Q: What development tools are required? A: Xilinx ISE Design Suite or Vivado Design Suite for FPGA design, synthesis, and implementation.

Q: Is this device compatible with lead-free soldering? A: Yes, the device is RoHS compliant and compatible with lead-free assembly processes.

Q: What is the expected product lifecycle? A: AMD/Xilinx provides long-term support for automotive-grade devices, typically 10+ years.

Conclusion

The XA3S1000-4FG456I represents an excellent choice for engineers developing automotive electronics, industrial control systems, and other applications requiring reliable, high-performance programmable logic. With its robust automotive qualification, extensive logic resources, and flexible I/O configuration, this Xilinx FPGA delivers the perfect balance of performance, reliability, and cost-effectiveness for demanding embedded applications.

Whether you’re designing advanced driver assistance systems, industrial automation controllers, or communication infrastructure, the XA3S1000-4FG456I provides the programmable flexibility and automotive-grade quality needed for mission-critical applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.