Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XA3S1000-4FG456C: Automotive-Grade FPGA for Advanced Electronic Systems

Product Details

Product Overview: XA3S1000-4FG456C Automotive FPGA

The XA3S1000-4FG456C is a high-performance automotive-grade Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) XA Spartan-3 Automotive family. Specifically designed for demanding automotive electronic applications, this FPGA delivers exceptional reliability, flexibility, and performance in harsh operating environments. Whether you’re developing advanced driver assistance systems (ADAS), infotainment modules, or automotive gateway solutions, the XA3S1000-4FG456C provides the programmable logic capabilities you need.

Key Features at a Glance

The XA3S1000-4FG456C stands out in the automotive FPGA market with its impressive specifications and automotive-grade qualifications. This device combines the programmability of FPGAs with the reliability required for mission-critical automotive applications, making it an ideal alternative to custom ASICs and ASSPs.

Technical Specifications

Core FPGA Specifications

Parameter Specification
Logic Cells 17,280 cells
System Gates 1,000,000 gates (1M gates)
Distributed RAM 54 KB
Block RAM 432 Kbits
User I/O Pins Up to 333 I/O pins
Total Pins 456-pin FBGA

Performance Characteristics

Parameter Specification
Speed Grade -4 (commercial speed grade)
Maximum Frequency Up to 630 MHz
Data Transfer Rate 622+ Mb/s per I/O
Process Technology 90nm CMOS
Core Voltage 1.2V (Vccint)

Automotive Temperature Range

Grade Temperature Range Application
C-Grade 0°C to +85°C Commercial automotive applications
I-Grade -40°C to +100°C TJ Industrial automotive applications
Q-Grade -40°C to +125°C TJ Extended temperature automotive

Package Information

Parameter Details
Package Type Fine-pitch Ball Grid Array (FBGA)
Pin Count 456 pins
Package Code FG456
Mounting Type Surface Mount Technology (SMT)
Pitch Fine-pitch BGA for compact designs

Product Features and Capabilities

Advanced Programmable Logic Architecture

The XA3S1000-4FG456C features a robust programmable logic fabric that enables designers to implement complex digital functions with ease. The architecture includes:

  • 17,280 configurable logic cells for implementing custom digital logic
  • Distributed RAM resources totaling 54 KB for fast local memory
  • 432 Kbits of block RAM organized in 18-Kbit dual-port blocks
  • Advanced routing architecture for optimal signal timing and performance

Flexible I/O Capabilities

With support for multiple I/O standards, the XA3S1000-4FG456C provides maximum interface flexibility:

  • SelectIO™ technology supporting various signaling standards
  • Up to 333 user I/O pins available in the 456-pin package
  • High-speed I/O performance with data rates exceeding 622 Mb/s
  • Mixed-voltage I/O support for interfacing with various components
  • Differential signaling support for noise-immune high-speed interfaces

Clock Management and Distribution

The integrated clock management system ensures precise timing control:

  • Digital Clock Manager (DCM) resources for clock synthesis
  • Clock distribution networks for low-skew signal delivery
  • Programmable clock dividers and multipliers
  • Phase-locked loop (PLL) capabilities for frequency generation

Automotive-Grade Reliability

As part of the XA Spartan-3 Automotive family, this FPGA meets stringent automotive standards:

  • AEC-Q100 qualified for automotive reliability
  • Extended temperature operation up to +125°C junction temperature (Q-grade)
  • Automotive-grade testing and quality assurance
  • Long-term availability commitment for automotive programs

Applications and Use Cases

Automotive Electronics

The XA3S1000-4FG456C excels in various automotive applications:

Advanced Driver Assistance Systems (ADAS)

  • Sensor fusion processing
  • Camera and radar data processing
  • Object detection and classification
  • Real-time image processing

Infotainment Systems

  • Audio/video processing
  • Display controller implementation
  • User interface management
  • Multi-source media handling

Instrument Clusters

  • Digital dashboard implementations
  • Gauge rendering and animation
  • Warning system management
  • Multi-display coordination

Gateway and Network Modules

  • CAN/LIN/FlexRay protocol implementation
  • Network traffic routing
  • Protocol conversion
  • Diagnostic interfaces

Industrial Applications

Beyond automotive, this Xilinx FPGA serves industrial needs:

  • Factory automation controllers
  • Industrial communication interfaces
  • Motor control systems
  • Process monitoring equipment

Why Choose XA3S1000-4FG456C?

Advantages Over ASICs

The XA3S1000-4FG456C offers significant benefits compared to custom ASICs:

Benefit Description
No NRE Costs Eliminate expensive mask and tooling costs
Faster Time-to-Market Design and implement solutions in weeks, not months
Design Flexibility Modify designs without hardware changes
Field Upgradability Update functionality through reprogramming
Lower Risk Prototype and validate before production commitment

Cost-Effective Solution

For high-volume automotive production, the XA3S1000-4FG456C provides:

  • Competitive per-unit pricing for volume production
  • Reduced development costs versus ASIC development
  • Lower inventory costs through design flexibility
  • Multi-sourcing capability for supply chain resilience

Design Security

Built-in security features protect your intellectual property:

  • Bitstream encryption to prevent unauthorized copying
  • Configuration security to protect design data
  • Tamper-resistant architecture

Development and Design Support

Compatible Design Tools

The XA3S1000-4FG456C is supported by industry-standard development tools:

  • Xilinx ISE Design Suite for FPGA development
  • Xilinx Platform Studio (XPS) for embedded systems
  • Third-party synthesis tools including Synplify Pro
  • Simulation tools from major EDA vendors

IP Core Compatibility

Leverage pre-designed IP cores to accelerate development:

  • Xilinx LogiCORE™ IP portfolio
  • Communication protocol cores (CAN, LIN, Ethernet)
  • Digital signal processing (DSP) functions
  • Memory controllers and interfaces

Reference Designs

Access automotive-specific reference designs:

  • Automotive interface examples
  • Protocol implementation references
  • Best practice design templates
  • Timing closure guidelines

Quality and Compliance

Automotive Standards

The XA3S1000-4FG456C meets critical automotive quality standards:

  • AEC-Q100 Grade 1/2/3 qualification available
  • ISO 26262 functional safety support
  • Automotive production part approval process (PPAP) compliance
  • Zero-defect manufacturing processes

Environmental Compliance

This device adheres to environmental regulations:

  • RoHS compliant in most variants
  • REACH compliance documentation available
  • Conflict minerals reporting provided

Package and Ordering Information

Standard Part Numbers

Part Number Temperature Grade Package Status
XA3S1000-4FG456C Commercial (0°C to +85°C) 456-FBGA Active
XA3S1000-4FG456I Industrial (-40°C to +100°C) 456-FBGA Active
XA3S1000-4FG456Q Extended (-40°C to +125°C) 456-FBGA Active

Package Dimensions

The 456-pin FBGA package features:

  • Compact footprint for space-constrained designs
  • Excellent thermal performance with exposed bottom pad
  • Industry-standard pinout for layout compatibility
  • Fine-pitch construction enabling high I/O density

Thermal Characteristics

Thermal Management

Parameter Specification
Junction Temperature (C-grade) 0°C to +85°C
Junction Temperature (I-grade) -40°C to +100°C
Junction Temperature (Q-grade) -40°C to +125°C
Thermal Resistance (θJA) Varies by package and airflow
Power Dissipation Design-dependent

Recommended Operating Conditions

Parameter Min Typ Max Unit
Core Voltage (Vccint) 1.14 1.2 1.26 V
I/O Voltage (Vcco) Varies by bank 3.45 V
Auxiliary Voltage (Vccaux) 2.375 2.5 2.625 V

Design Considerations

Power Supply Requirements

The XA3S1000-4FG456C requires multiple power supply rails:

  1. Core voltage (Vccint): 1.2V for logic array
  2. I/O voltage (Vcco): Bank-dependent for I/O buffers
  3. Auxiliary voltage (Vccaux): 2.5V for auxiliary circuits
  4. Configuration voltage: As required by configuration mode

PCB Layout Guidelines

For optimal performance, follow these design practices:

  • Power supply decoupling with appropriate capacitor placement
  • Controlled impedance routing for high-speed signals
  • Thermal vias under the package for heat dissipation
  • Ground plane integrity for noise reduction

Configuration Options

The XA3S1000-4FG456C supports multiple configuration modes:

  • Master Serial mode using SPI flash memory
  • Slave Serial mode from external controller
  • JTAG boundary-scan for programming and debug
  • SelectMAP mode for faster parallel configuration

Memory Resources

Internal Memory Architecture

Memory Type Capacity Organization
Distributed RAM 54 KB Spread across CLBs
Block RAM 432 Kbits 24 blocks × 18 Kbits
Configuration Memory SRAM-based Volatile

Memory Applications

The available RAM supports various functions:

  • Data buffering in communication interfaces
  • Look-up tables (LUTs) for mathematical functions
  • FIFO implementation for data flow management
  • Packet buffers in networking applications

Competitive Advantages

Versus Alternative Solutions

Feature XA3S1000-4FG456C ASICs Microcontrollers
Development Time Weeks 12-24 months Weeks
NRE Cost None $500K-$2M+ None
Design Changes Instant Costly/Impossible Limited
Performance High Highest Lower
Flexibility Maximum None Moderate
Volume Pricing Competitive Best (>100K) Good

Support and Documentation

Available Resources

AMD provides comprehensive support materials:

  • Complete datasheets with electrical specifications
  • User guides for device architecture
  • Application notes for common implementations
  • Technical support through AMD field applications engineers
  • Online forums for community assistance

Training and Education

Access learning resources to maximize design efficiency:

  • Webinars and training courses
  • Video tutorials on design techniques
  • University program support
  • Design examples and tutorials

Conclusion: Your Reliable Automotive FPGA Solution

The XA3S1000-4FG456C represents an excellent choice for automotive and industrial applications requiring reliable, flexible programmable logic. With its automotive-grade qualification, extensive I/O capabilities, and robust feature set, this FPGA enables engineers to develop sophisticated electronic systems while maintaining cost-effectiveness and design flexibility.

Whether you’re implementing advanced control algorithms, processing sensor data, or managing complex communication protocols, the XA3S1000-4FG456C delivers the performance and reliability demanded by modern automotive electronics. Its AEC-Q100 qualification ensures it meets the stringent requirements of automotive production environments, while its programmability provides the flexibility to adapt to changing requirements throughout the product lifecycle.

For automotive designers seeking a proven, reliable FPGA solution with excellent support and long-term availability, the XA3S1000-4FG456C from AMD’s XA Spartan-3 Automotive family stands as a compelling choice.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.