High-Performance Multilayer PCB for Aerospace, Defense, and High-Power RF Applications
Engineered for the most demanding aerospace, defense, and high-frequency environments, the RT/duroid 6035HTC 8-Layer PCB from PCBSync delivers the thermal stability, signal integrity, and mechanical reliability that mission-critical systems require. Built on Rogers Corporation’s premium ceramic-filled PTFE composite laminate, this 1.0mm, 8-layer board combines superior heat dissipation with exceptional electrical performance — making it the go-to choice for engineers designing next-generation radar arrays, satellite payloads, phased-array antennas, and high-power amplifiers.
Key Specifications
| Parameter |
Value |
| Base Material |
Rogers RT/duroid 6035HTC (ceramic-filled PTFE) |
| Layer Count |
8 Layers |
| Board Thickness |
1.0 mm |
| Copper Weight |
1 oz (35 µm) |
| Surface Finish |
ENIG (Electroless Nickel Immersion Gold) |
| Dielectric Constant (Dk) |
3.5 ± 0.05 |
| Dissipation Factor (Df) |
0.0013 @ 10 GHz |
| Thermal Conductivity |
1.44 W/m·K |
| Max Operating Temperature |
up to 280 °C |
| Z-axis CTE |
Low — excellent multilayer reliability |
Why Choose RT/duroid 6035HTC?
The 6035HTC laminate is purpose-built for high-power RF designs that generate significant heat. Its thermal conductivity is roughly 2.4× higher than standard PTFE composites, enabling smaller form factors, denser power architectures, and longer operational lifetimes without thermal compromise. The tightly controlled dielectric constant ensures repeatable phase performance across production runs — essential for phased-array antennas and beamforming networks where channel-to-channel consistency is non-negotiable.
The ENIG surface finish delivers a flat, lead-free, RoHS-compliant solderable surface ideal for fine-pitch BGA, QFN, and 0201 components. Combined with 1 oz copper on all eight layers, this stackup strikes the optimal balance between current-carrying capacity, controlled impedance, and high-frequency signal integrity.
Typical Applications
- Aerospace and satellite communication subsystems
- Military radar and electronic warfare (EW) equipment
- High-power RF and Doherty power amplifiers
- Phased-array and active antenna boards
- 5G mmWave base stations and small cells
- Avionics, missile guidance, and defense electronics
- Automotive LIDAR and ADAS modules requiring thermal headroom
Precision Manufacturing by PCBSync
Every RT/duroid 6035HTC board is fabricated in PCBSync’s IPC Class 3 / MIL-PRF-31032-aligned facility, where strict process controls govern PTFE plasma treatment, sequential lamination, and impedance verification. With each order you receive:
- Controlled impedance to ±5% (±10% standard)
- 100% AOI, flying probe, and impedance coupon testing
- Cross-section microsection reports on request
- Full IPC-A-600 Class 3 inspection and traceability
- ITAR-compliant handling available
- Lead times from 7 working days for standard orders
Order Your RT/duroid 6035HTC PCB Today
Whether you are prototyping a next-generation radar front-end or scaling a satellite communications product, PCBSync delivers Rogers RT/duroid 6035HTC PCBs with the documentation, repeatability, and high-frequency performance your engineering team demands. Upload your Gerber files for an instant quote, or contact our RF specialists for a free design-for-manufacturing (DFM) review on complex multilayer stackups.
PCBSync — your trusted partner for Rogers laminate, high-temperature, and aerospace-grade PCB manufacturing.
