The RT/duroid 6035HTC 0.8mm 1oz Immersion Gold 6-Layer High-Temperature RF Board from PCBSync is engineered for demanding RF and microwave applications where thermal performance, signal integrity, and long-term reliability are non-negotiable. Built on Rogers Corporation’s RT/duroid 6035HTC ceramic-filled PTFE composite, this 6-layer high-frequency PCB delivers industry-leading thermal conductivity in a compact, manufacturable form factor — an ideal choice for next-generation 5G, radar, satellite, and aerospace electronics.
Material & Construction Highlights
At the core of this RF board is the RT/duroid 6035HTC laminate — a ceramic-loaded PTFE substrate purpose-built for high-power, high-temperature environments. With a dielectric constant (Dk) of 3.5 and an exceptionally low dissipation factor (Df ≈ 0.0013 at 10 GHz), it preserves signal integrity from L-band through Ka-band frequencies. Its thermal conductivity of approximately 1.44 W/m/K — significantly higher than standard PTFE laminates — efficiently dissipates heat away from active components, extending device lifespan and enabling higher power-handling capability.
The 0.8 mm overall thickness and 1 oz (35 μm) copper weight strike an optimal balance between mechanical robustness, controlled-impedance accuracy, and current-carrying capacity. The 6-layer stackup supports complex routing, integrated ground planes, and embedded signal/power distribution networks required by modern RF front-end systems.
Immersion Gold (ENIG) Surface Finish
The immersion gold (ENIG) finish provides a flat, oxidation-resistant pad surface ideal for fine-pitch BGA components, wire bonding, and reliable solderability. ENIG delivers uniform plating thickness across every pad, supports lead-free assembly, and meets RoHS and REACH compliance — making this board suitable for telecom, aerospace, defense, automotive radar, and medical-grade applications.
Key Specifications
- Material: Rogers RT/duroid 6035HTC
- Board Thickness: 0.8 mm
- Copper Weight: 1 oz (35 μm)
- Layer Count: 6
- Surface Finish: Immersion Gold (ENIG)
- Dielectric Constant (Dk): 3.5
- Dissipation Factor (Df): ~0.0013 @ 10 GHz
- Thermal Conductivity: ~1.44 W/m/K
- Compliance: RoHS, REACH, IPC-6012
Typical Applications
This high-temperature RF board is ideally suited for:
- 5G base station power amplifiers and remote radio units
- Phased-array and automotive radar (24/77/79 GHz)
- Satellite communication modules, LNBs, and ground terminals
- High-power RF combiners, dividers, and couplers
- Aerospace and defense microwave assemblies
- Industrial and medical high-frequency electronics
Why Order from PCBSync
PCBSync specializes in high-frequency, high-reliability PCB manufacturing using genuine Rogers laminates. Every RT/duroid 6035HTC order is processed by engineers experienced in mixed-dielectric stackups, controlled impedance, and tight RF tolerances. With every board you receive:
- Verified Rogers material traceability
- Controlled impedance held to ±5%
- Laser direct imaging (LDI) and AOI inspection
- 100% electrical testing
- Fast-turn prototyping through full production
- IPC Class 2 and Class 3 manufacturing options
Order Your RT/duroid 6035HTC 6-Layer RF Board Today
Upload your Gerber files and stackup specification to receive an instant quote. Whether you need a single prototype or production volumes, PCBSync delivers RT/duroid 6035HTC 6-layer immersion gold RF boards that meet your performance, thermal, and reliability targets — on time and on spec.