Product Title (for WooCommerce)
RT/duroid 6006 | 1.5mm | 1oz Copper | 3µ” Gold | 8-Layer Aerospace & Satellite Communication PCB
Short Description
High-reliability 8-layer PCB built on Rogers RT/duroid 6006 laminate with 1.5mm board thickness, 1oz copper weight, and 3µ” hard gold finish — engineered for mission-critical aerospace, satellite, and RF communication systems operating up to 40 GHz.
Full Product Description
Designed for engineers who refuse to compromise on signal integrity, the RT/duroid 6006 8-Layer Aerospace Communication PCB delivers repeatable, high-frequency performance where failure is not an option. Built on genuine Rogers RT/duroid 6006 PTFE ceramic laminate, this board is purpose-built for radar systems, satellite transponders, airborne communication arrays, and other demanding RF applications.
Why RT/duroid 6006?
RT/duroid 6006 is the industry benchmark for high-frequency circuit materials. With a tightly controlled dielectric constant of 6.15 ± 0.15 across a wide temperature range, this laminate eliminates the Dk drift that plagues standard FR-4 at microwave frequencies. The result is predictable impedance matching, minimal insertion loss, and consistent phase response — board after board, mission after mission.
Precision 8-Layer Stackup
Every layer in this stackup is engineered with purpose. The 8-layer construction supports complex routing architectures including stripline and microstrip transmission lines, dedicated ground planes for EMI shielding, and isolated power distribution — all within a compact 1.5mm total thickness. Whether you are designing a phased array feed network or a multi-channel downconverter, this stackup gives you the routing density and signal isolation that advanced RF front-ends demand.
1oz Copper & 3µ” Hard Gold Finish
The 1oz (35µm) copper weight delivers an optimal balance between current-carrying capacity and fine-line etch resolution for controlled-impedance traces. Every exposed pad is finished with 3µ” electroplated hard gold over nickel barrier, providing exceptional contact durability, wire-bondability, and corrosion resistance across the full MIL-spec operating temperature range of -55°C to +150°C. This finish meets the rigorous interconnect reliability standards required for avionics and space-grade assemblies.
Built for Mission-Critical Environments
This PCB is manufactured under aerospace-grade process controls with full traceability and lot documentation. Key performance attributes include low-loss tangent (0.0027 at 10 GHz) for minimal signal attenuation, uniform copper adhesion for long-term mechanical reliability, and a coefficient of thermal expansion closely matched to copper — reducing via and solder joint stress during thermal cycling.
Ideal Applications
This board is optimized for X-band and Ku-band radar modules, satellite communication transponders and payload electronics, airborne electronic warfare and SIGINT systems, millimeter-wave antenna feed networks, high-altitude UAV communication links, and ground-based SATCOM terminals.
Why Order from PCBSync?
PCBSync specializes in advanced RF and aerospace PCB fabrication. Every RT/duroid 6006 order ships with impedance test coupons, cross-section microsection reports on request, and full IPC Class 3 compliance. From prototype to production, we deliver the consistency and documentation your program requires.
Specifications at a Glance
| Parameter |
Value |
| Base Material |
Rogers RT/duroid 6006 |
| Layer Count |
8 |
| Board Thickness |
1.5mm |
| Copper Weight |
1oz (35µm) |
| Surface Finish |
3µ” Electroplated Hard Gold |
| Dielectric Constant |
6.15 ± 0.15 at 10 GHz |
| Dissipation Factor |
0.0027 at 10 GHz |
| Operating Temp Range |
-55°C to +150°C |
| Compliance |
IPC-6012 Class 3 / AS9100 |
Order your RT/duroid 6006 8-layer aerospace PCB today. Upload your Gerber files for an instant quote or contact our RF design support team for stackup consultation.
