The Rogers CuClad 6250 Bonding Film PCB is a premium PTFE-based bondply material engineered for high-frequency, high-performance multilayer circuit board applications. Designed for demanding RF, microwave, and millimeter-wave environments, CuClad 6250 delivers exceptional dielectric stability, low signal loss, and outstanding thermal reliability — making it the preferred choice for aerospace, defense, 5G infrastructure, and satellite communication systems.
With a dielectric constant (Dk) of 2.50 ± 0.04 and an ultra-low dissipation factor (Df) of 0.0013 at 10 GHz, Rogers CuClad 6250 ensures superior signal integrity and minimal insertion loss at high operating frequencies. Its dimensionally stable PTFE composition guarantees consistent impedance control across multilayer PCB stack-ups — critical for phase-sensitive RF and microwave designs.
CuClad 6250 bondply film provides excellent interlayer adhesion during lamination without compromising the electrical performance of adjacent circuit layers. It is fully compatible with standard PTFE lamination processes and integrates seamlessly into complex multilayer builds requiring tightly controlled dielectric properties.
Typical applications include: 5G antenna arrays, satellite communications, radar systems, aerospace electronics, microwave filters, and power amplifiers.
As one of the best Rogers PCB manufacturers in China, PCBSync offers full-service fabrication of Rogers CuClad 6250 multilayer boards. With state-of-the-art PTFE lamination capabilities, IPC-certified quality standards, and certified material traceability, PCBSync delivers precision-engineered high-frequency PCBs with fast lead times and competitive pricing — trusted by RF engineers and OEMs worldwide.
