Precision-Engineered RF Circuit Board for Demanding High-Frequency Applications
The PCBSync RO4700 6-Layer RF PCB delivers exceptional high-frequency performance for engineers and designers working at the cutting edge of wireless communication, radar systems, and advanced digital infrastructure. Built on Rogers RO4700 series laminate with a tightly controlled 1.2mm board thickness, this stackup is purpose-built to maintain signal integrity where standard FR-4 falls short.
Why Rogers RO4700?
Rogers RO4700 is a glass-reinforced hydrocarbon/ceramic laminate engineered for consistent dielectric properties across a wide frequency range. With a low and stable dissipation factor, this material minimizes insertion loss in RF transmission lines — making it ideal for antenna feeds, power amplifiers, filters, and millimeter-wave front-end modules. Unlike PTFE-based substrates, RO4700 processes using standard FR-4 fabrication methods, reducing lead times and manufacturing complexity without sacrificing RF performance.
Stackup and Construction
This 6-layer design provides dedicated signal, ground, and power planes in a balanced configuration optimized for controlled impedance routing. The 1.2mm finished thickness fits standard enclosure and connector profiles while supporting dense, high-layer-count routing for mixed digital-RF architectures.
Heavy 3oz (105µm) copper on designated layers ensures low DC resistance for power distribution networks and high-current RF paths. Thicker copper also improves thermal dissipation — a critical advantage in power amplifier and base station designs where heat management directly impacts reliability and service life.
ENIG Surface Finish
Electroless Nickel Immersion Gold (ENIG) provides a flat, oxidation-resistant solderable surface that excels in fine-pitch BGA and QFN assembly. ENIG delivers consistent coplanarity for reliable solder joints across dense component arrays, and its corrosion resistance ensures long shelf life and dependable performance in harsh operating environments. For RF applications, ENIG also offers predictable surface conductivity at pad interfaces, supporting clean impedance transitions at component landings.
Target Applications
This PCB is engineered to serve high-performance sectors including 5G mmWave infrastructure and small-cell base stations, automotive radar modules (77 GHz ADAS/autonomous driving), satellite communication terminals and phased-array antennas, software-defined radio (SDR) platforms, aerospace and defense RF subsystems, as well as IoT gateway devices operating in sub-6 GHz and millimeter-wave bands.
PCBSync Quality and Capabilities
Every board ships with full electrical testing, impedance verification, and IPC Class 2/3 inspection. PCBSync’s advanced fabrication process supports tight tolerances on trace width, dielectric thickness, and via registration — critical parameters for maintaining target impedance across multi-gigahertz signal paths.
Specifications at a Glance
- Material: Rogers RO4700 series laminate
- Layer Count: 6 layers
- Board Thickness: 1.2mm finished
- Copper Weight: 3oz (105µm)
- Surface Finish: ENIG (Electroless Nickel Immersion Gold)
- Application Class: High-speed digital and RF/microwave
Order with Confidence
PCBSync combines advanced materials expertise with production-grade manufacturing to deliver RF PCBs that perform from prototype through volume. Upload your Gerber files, specify your impedance requirements, and let our engineering team handle the rest.
