The RO4700 12-Layer Matter Protocol IoT Hub Board is a high-performance solution for next-generation smart home infrastructure. As the industry shifts toward unified connectivity, this board provides the necessary thermal stability and low-loss dielectric properties required for Matter-enabled gateways. Built with a 1.0mm profile and 1oz finished copper weight, it offers the perfect balance of mechanical rigidity and electrical efficiency for high-density IoT deployments.
Key Features
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Substrate Material: Rogers RO4700 Series (Low-loss, thermoset resin system).
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Layer Count: 12-layer high-density interconnect (HDI) stack-up.
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Surface Finish: ENIG (Immersion Gold) for superior oxidation resistance and solderability.
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Board Thickness: Precision 1.0mm ± 10% tolerance.
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Copper Weight: 1oz finished copper for optimal current capacity and thermal dissipation.
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Signal Integrity: Optimized for 2.4GHz and Sub-GHz radio frequencies used in Matter and Thread protocols.
Applications
This 12-layer board is specifically tailored for smart home central controllers, edge computing gateways, and industrial IoT hubs. Its high-frequency capabilities make it ideal for devices managing mesh networks, including multi-protocol routers and smart energy management systems where signal interference must be minimised.
Why Choose PCBSYNC
PCBSYNC is a professional PCB fabrication, PCBA, and EMS manufacturer delivering precision-built electronics for aerospace, medical, automotive, industrial, and smart energy applications. We handle everything from rapid prototyping to mass production — including rigid, flexible, and rigid-flex PCBs, full turnkey assembly, component sourcing, AOI and X-ray inspection, and OEM/ODM support. Reliable boards. Consistent quality. From prototype to production — PCBSYNC.
For technical enquiries or to discuss your custom IoT hardware requirements, please reach out to our engineering team or request a quote today.
