Engineered for next-generation RF and high-speed digital applications, the RO4700 0.5mm 1/2oz 3μ” Gold 4-Layer High-Speed Interconnect PCB from PCBSync delivers exceptional electrical performance, signal integrity, and manufacturing precision. Built on Rogers’ premium RO4700 series laminate, this 4-layer high-frequency board is purpose-designed for engineers who refuse to compromise on insertion loss, impedance control, or long-term reliability.
Premium Rogers RO4700 High-Frequency Laminate
Rogers RO4700 (JADE) laminates are recognized industry-wide for their ultra-low dissipation factor, tightly controlled dielectric constant, and outstanding thermal stability. With Df values significantly lower than standard FR-4 — and even better than most mid-tier microwave materials — RO4700 minimizes signal loss from sub-GHz cellular bands up into mmWave frequencies. That makes it the material of choice for 5G antenna arrays, base-station infrastructure, satellite communications, automotive radar, and high-throughput backhaul systems where every fraction of a dB counts.
Optimized 4-Layer Stack-Up at 0.5mm
The 0.5mm overall board thickness paired with a balanced 4-layer construction provides the ideal platform for compact, dense designs without sacrificing signal performance. Engineers gain dedicated reference planes for controlled-impedance routing, clean power distribution, and shielded high-speed traces — essential for differential pairs running at multi-gigabit data rates. The thin profile also supports modern miniaturized assemblies, conformal mounting, and weight-sensitive aerospace and IoT designs.
1/2oz Copper for High-Density Interconnect
The 1/2oz (~17µm) copper weight enables fine-line trace geometries with tight tolerances, making this build ideal for BGA fan-outs, microvia structures, and high-pin-count packages. Reduced copper thickness also improves etch precision and impedance repeatability, ensuring your simulated values match measured results on the bench.
3μ” ENIG Gold Surface Finish
The 3 microinch immersion gold (ENIG) finish offers a flat, RoHS-compliant solderable surface with excellent shelf life and superior wire-bonding compatibility. ENIG is the preferred finish for fine-pitch components, press-fit connectors, and gold wire bonding — delivering consistent solder joints and long-term oxidation resistance critical for telecom, medical, and industrial electronics.
Key Specifications
- Material: Rogers RO4700 series high-frequency laminate
- Layer Count: 4 layers
- Board Thickness: 0.5mm (±10%)
- Copper Weight: 1/2oz inner and outer
- Surface Finish: ENIG, 3μ” gold thickness
- Min Trace/Space: 3/3 mil
- Min Drill: 0.15mm mechanical
- Impedance Control: ±10% standard (±5% on request)
- IPC Class: Class 2 standard, Class 3 available
Typical Applications
- 5G and LTE base-station antennas
- Phased-array radar and beamforming modules
- Satellite and SATCOM hardware
- Automotive ADAS and 77 GHz radar
- High-speed digital backplanes (PCIe Gen4/5, DDR5, SerDes)
- Test and measurement instrumentation
Why Order from PCBSync
PCBSync specializes in high-frequency and HDI PCB manufacturing with full Rogers material certification, in-house controlled-impedance verification (TDR tested), and IPC-A-600 inspection on every order. Our streamlined online quoting platform delivers transparent pricing, fast lead times, and free DFM feedback within hours. Whether you need a single prototype or volume production, PCBSync ensures your RO4700 boards arrive built exactly to spec — on time, every time.
Upload your Gerbers and order online today to accelerate your high-speed RF design with confidence.
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