The RO4003C 4-Layer Bluetooth 5.3 Audio Module PCB is a high-performance substrate solution designed specifically for advanced wireless communication and high-fidelity audio processing. Utilizing Rogers RO4003C hydrocarbon ceramic laminate, this board ensures superior high-frequency performance and thermal stability for engineers developing the next generation of Bluetooth 5.3 hardware.
Key Features
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Material: Rogers RO4003C (Low-loss, high-frequency laminate)
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Layer Count: 4-layer precision stack-up for optimized EMI shielding
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Board Thickness: 1.6mm for standard mechanical compatibility
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Copper Weight: 1oz (35µm) finished copper for balanced conductivity
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Surface Finish: Immersion Silver (Ag) for excellent solderability and RF conductivity
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Connectivity Standard: Optimized for Bluetooth 5.3 signal integrity
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Manufacturing Standards: IPC Class 2 compliance with rigorous AOI inspection
Applications
This specialized PCB is ideal for professional-grade audio equipment, including:
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High-fidelity wireless headphones and studio monitors
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Low-latency automotive infotainment modules
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Smart home audio distribution systems
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Industrial IoT sensors requiring stable Bluetooth 5.3 connectivity
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Advanced RF signal transceivers and wearables
Why Choose PCBSYNC
PCBSYNC is a professional PCB fabrication, PCBA, and EMS manufacturer delivering precision-built electronics for aerospace, medical, automotive, industrial, and smart energy applications. We handle everything from rapid prototyping to mass production — including rigid, flexible, and rigid-flex PCBs, full turnkey assembly, component sourcing, AOI and X-ray inspection, and OEM/ODM support. Reliable boards. Consistent quality. From prototype to production — PCBSYNC.
Contact our engineering team today for technical support or to request a formal quote for your Bluetooth 5.3 Audio Module project.
