Elevate your automotive connectivity solutions with our RO4003C 1.0mm 6-Layer V2X (Vehicle-to-Everything) Communication Board. Specifically engineered for the rigorous demands of C-V2X (Cellular V2X) and DSRC (Dedicated Short-Range Communications) applications, this PCB provides the thermal stability and signal integrity required for the next generation of autonomous and connected driving.
Available now at PCBSync, this board is the professional choice for RF engineers developing ADAS modules, telematics control units, and smart infrastructure interfaces.
Key Technical Specifications
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Substrate Material: Rogers RO4003C (Hydrocarbon/Ceramic Laminate)
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Layer Count: 6-Layer Multi-layer stackup
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Finished Thickness: 1.0mm (±10%)
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Copper Weight: 1oz Finished Copper
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Surface Finish: ENIG (Electroless Nickel Immersion Gold)
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Application: V2X, 5G Automotive, Radar, and Telematics
Engineered for Signal Integrity and Reliability
1. Premium Rogers RO4003C Material
The heart of this board is the Rogers RO4003C laminate. Unlike standard FR-4, RO4003C offers a low dielectric constant ($Dk$) of 3.38 and a low dissipation factor ($Df$) of 0.0027 at 10 GHz. This ensures minimal signal loss and phase stability across the high-frequency spectrums utilized in V2X communications, typically ranging from 5.85 GHz to 5.925 GHz.
2. Advanced 6-Layer Stackup
The 6-layer architecture is meticulously designed to optimize EMI shielding and impedance control. With a 1.0mm profile, this board maintains a compact form factor for automotive housing while providing dedicated ground and power planes. This configuration significantly reduces cross-talk and ensures a clean signal path for critical safety data transmission.
3. ENIG Surface Finish
We utilize ENIG (Electroless Nickel Immersion Gold) for the surface finish. This provides a superior, flat surface for fine-pitch SMT components and ensures excellent solderability. More importantly, the immersion gold layer offers exceptional oxidation resistance, making it ideal for the harsh, fluctuating environments found in automotive applications.
4. Precision Manufacturing for V2X Requirements
V2X technology relies on low-latency, high-reliability communication between vehicles (V2V), infrastructure (V2I), and pedestrians (V2P). Our manufacturing process at PCBSync involves strict impedance tolerance testing and high-definition imaging to ensure that every trace meets the exacting standards of automotive RF designs.
Why Choose This Board for Your Project?
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Thermal Stability: RO4003C features a low coefficient of thermal expansion (CTE), ensuring the circuit remains stable despite the extreme temperature cycles typical in vehicle engine compartments or exterior mounting.
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Standard PCB Processing: Despite its high-frequency performance, RO4003C can be processed using standard FR-4 manufacturing techniques, allowing PCBSync to offer high-performance RF boards at a competitive price point.
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Future-Proof Connectivity: Optimized for 5G-V2X protocols, this board supports the high data rates required for real-time sensor sharing and coordinated driving maneuvers.
Order Your V2X Solutions from PCBSync
At PCBSync, we bridge the gap between complex RF engineering and seamless PCB production. Our RO4003C 6-layer boards undergo rigorous AOI (Automated Optical Inspection) and electrical testing to ensure they arrive ready for your most demanding deployments.
Order today to accelerate your automotive innovation with industry-leading RF materials and precision fabrication.
