The RO4003C 4-Layer 5G Mobile Hotspot PCB is a specialized high-frequency solution designed to meet the rigorous demands of multi-gigabit wireless communication. By utilizing Rogers RO4003C hydrocarbon ceramic laminates, this board ensures minimal signal loss and exceptional thermal stability, making it an essential component for mobile hotspots and portable 5G infrastructure where space and performance are at a premium.
RO4003C 4-Layer 5G PCB Key Features
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Base Material: Rogers RO4003C (High-Frequency Laminate)
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Layer Count: 4-Layer stackup for optimized EMI shielding
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Board Thickness: 0.5mm ultra-slim profile for compact mobile enclosures
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Copper Weight: 1oz finished copper for balanced thermal dissipation
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Surface Finish: ENIG (Electroless Nickel Immersion Gold) for superior solderability and oxidation resistance
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Dielectric Constant (Dk): 3.38 ± 0.05 for stable RF performance
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Dissipation Factor (Df): 0.0027 @ 10GHz to minimize signal attenuation
Applications
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Telecommunications: 5G NR (New Radio) mobile hotspots and signal boosters.
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IoT Infrastructure: Smart city gateways and high-bandwidth edge computing.
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Aerospace & Defence: Compact RF identification systems and telemetry.
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Automotive: V2X (Vehicle-to-Everything) communication modules.
Why Choose PCBSYNC
PCBSYNC is a professional PCB fabrication, PCBA, and EMS manufacturer delivering precision-built electronics for aerospace, medical, automotive, industrial, and smart energy applications. We handle everything from rapid prototyping to mass production — including rigid, flexible, and rigid-flex PCBs, full turnkey assembly, component sourcing, AOI and X-ray inspection, and OEM/ODM support. Reliable boards. Consistent quality. From prototype to production — PCBSYNC.
For technical consultations regarding your specific stackup requirements or to discuss high-volume manufacturing, please contact our engineering team or request a quote directly through our portal.
