Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Learn More

Our customer service ready for your PCB

Sales@PCBsync.com

Prototype Assembly

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

- Maria Rodriguez CTO

Electronic Manufacturing

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

- Ben Carter Operations Director

RO3010 2.0mm 3oz ENIG 12-Layer Macro Cell Base Station Power Amplifier Board

Product Details

The RO3010 2.0mm 3oz ENIG 12-Layer Macro Cell Base Station Power Amplifier Board is a high-performance multilayer solution specifically developed for the rigorous demands of macro cell telecommunications. Utilizing Rogers RO3010 ceramic-filled PTFE laminates, this board offers exceptional mechanical stability and consistent electrical properties across wide frequency ranges, making it an essential component for modern wireless infrastructure.

Key Features

Substrate Material: Rogers RO3010 (PTFE/Ceramic) for low dielectric loss and high thermal stability.
Layer Count: 12-layer high-density interconnect (HDI) stackup for complex RF signal routing.
Copper Weight: 3oz (105μm) finished copper thickness to support high-current power amplification.
Board Thickness: 2.0mm finished thickness for enhanced structural integrity in rack-mounted systems.
Surface Finish: Electroless Nickel Immersion Gold (ENIG) for superior solderability and oxidation resistance.
Thermal Conductivity: Optimized for efficient heat dissipation in continuous-duty power amplifiers.
Impedance Control: Tight tolerance $(\pm 5\%)$ on critical RF differential pairs.

Applications

Macro Cell Base Stations: Primary power amplification stages for 4G LTE and 5G NR networks.
Satellite Communications: Ground station power modules and RF transceivers.
Point-to-Point Microwave: High-capacity backhaul radio links.
DAS Systems: Distributed Antenna Systems for large-scale indoor and stadium coverage.

Why Choose PCBSYNC

PCBSYNC is a professional PCB fabrication, PCBA, and EMS manufacturer delivering precision-built electronics for aerospace, medical, automotive, industrial, and smart energy applications. We handle everything from rapid prototyping to mass production — including rigid, flexible, and rigid-flex PCBs, full turnkey assembly, component sourcing, AOI and X-ray inspection, and OEM/ODM support. Reliable boards. Consistent quality. From prototype to production — PCBSYNC.

For detailed technical specifications or to discuss your specific impedance requirements, please contact our engineering team or request a formal quote through our online portal.