Engineered for high-performance RF and microwave environments, this RO3010 12-Layer Distributed Antenna System (DAS) PCB delivers the signal integrity, thermal stability, and mechanical reliability demanded by modern wireless infrastructure. Built on Rogers RO3010 ceramic-filled PTFE laminate and finished with immersion silver, this 1.8mm multilayer board is purpose-built for cellular, public safety, and in-building wireless deployments where consistent performance across wide frequency ranges is non-negotiable.
Premium Material: Rogers RO3010 High-Frequency Laminate
Rogers RO3010 is an industry-leading ceramic-PTFE composite engineered for stable electrical performance well into the Ku-band. With a high dielectric constant (Dk ≈ 10.2) and an extremely low loss tangent (Df ≈ 0.0022), RO3010 enables tight circuit miniaturization without sacrificing efficiency. Its tightly controlled Dk tolerance ensures repeatable impedance from prototype to production, making it the preferred substrate for DAS antennas, phased arrays, power amplifiers, and microwave couplers.
Core Specifications
- Base Material: Rogers RO3010 (ceramic-filled PTFE)
- Board Thickness: 1.8mm
- Layer Count: 12 layers
- Copper Weight: 3oz outer and inner layers (heavy copper)
- Surface Finish: Immersion Silver (ImAg)
- Dielectric Constant (Dk): 10.2 ±0.30
- Dissipation Factor (Df): 0.0022 @ 10 GHz
- Operating Temperature Range: −55°C to +280°C
3oz Heavy Copper for Power and Thermal Performance
The 3oz copper construction provides superior current-carrying capacity and excellent heat dissipation, allowing this PCB to support the high-power amplifiers and dense signal routing typical of DAS head-ends and remote radio units. Heavy copper traces also improve mechanical durability and reduce voltage drop across long signal paths — essential for distributed wireless networks.
Immersion Silver Finish for RF Excellence
Immersion silver (ImAg) delivers an ultra-flat, lead-free, RoHS-compliant surface ideal for high-frequency signal transmission. Compared to HASL or ENIG, ImAg offers lower insertion loss, reduced skin-effect losses at GHz frequencies, and superior fine-pitch solderability — critical advantages for DAS hardware operating from 700 MHz through 6 GHz and beyond into mmWave.
Built for Distributed Antenna Systems
This 12-layer DAS PCB is optimized for the demanding requirements of modern wireless infrastructure deployed in:
- 4G LTE and 5G NR cellular networks
- In-building wireless coverage for stadiums, airports, hospitals, and high-rises
- Public safety and first-responder communication systems (ERRCS)
- Tunnels, subways, and underground facilities
- Small cells and Remote Radio Head (RRH) installations
- Microwave backhaul and point-to-point links
The 12-layer architecture supports complex RF routing, controlled-impedance transmission lines, integrated power planes, and isolated digital control circuitry — all on a single high-density board.
Why Order from PCBSync
PCBSync manufactures Rogers RO3010 multilayer PCBs to IPC Class 2 and Class 3 standards, with rigorous impedance control, full AOI inspection, flying-probe and E-test verification, and microsection reporting available on every order. From quick-turn prototypes to volume production, our advanced high-frequency PCB capability ensures your DAS, RF, and microwave designs perform reliably in the field.
Upload your Gerber files today for an instant quote on this RO3010 1.8mm 3oz immersion silver 12-layer Distributed Antenna System PCB — engineered, tested, and shipped worldwide.
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