Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

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Prototype Assembly

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

- Maria Rodriguez CTO

Electronic Manufacturing

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

- Ben Carter Operations Director

RO3003G2 1.6mm 2oz Immersion Silver 10-Layer 5G mmWave Board

Product Details

Premium High-Frequency Multilayer Board for 5G & Millimeter-Wave Applications

PCBSync’s RO3003G2 1.6mm 2oz Immersion Silver 10-Layer 5G mmWave Board is engineered for the most demanding RF and microwave applications on the market today. Built on Rogers Corporation’s industry-leading RO3003G2 ceramic-filled PTFE laminate, this 10-layer high-frequency PCB delivers exceptional electrical performance, thermal stability, and signal integrity at frequencies up to 77 GHz and beyond — making it the ideal choice for 5G mmWave infrastructure, automotive radar (76–81 GHz), advanced antenna arrays, and next-generation wireless systems.

Key Specifications

Base Material: Rogers RO3003G2 ceramic-filled PTFE composite
Board Thickness: 1.6mm (±10%)
Layer Count: 10 layers (hybrid stack-up available)
Copper Weight: 2oz (70µm) outer & inner layers
Surface Finish: Immersion Silver (ImAg)
Dielectric Constant (Dk): 3.00 ± 0.04 @ 10 GHz
Dissipation Factor (Df): 0.0010 @ 10 GHz
Thermal Coefficient of Dk: −3 ppm/°C
Operating Temperature: −55°C to +280°C
UL Rating: 94V-0

Why Choose RO3003G2?

RO3003G2 is the next-generation evolution of Rogers’ proven RO3003 series, specifically optimized for 77 GHz automotive radar and 5G mmWave applications. Its tightly controlled dielectric constant ensures repeatable phase performance across high-volume production runs, while its ultra-low loss tangent minimizes insertion loss in long transmission lines and dense antenna feed networks. Improved copper-to-substrate adhesion and refined surface profile also reduce conductor loss at high frequencies — a critical advantage for maintaining signal fidelity above 60 GHz.

Immersion Silver Surface Finish — Tailored for RF

Immersion Silver (ImAg) is the preferred finish for high-frequency PCBs. It delivers:

Lowest insertion loss of any lead-free finish at mmWave frequencies
Excellent solderability and fine-pitch component compatibility
Flat, uniform surface for precise impedance control
RoHS-compliant and ideal for high-speed digital + RF hybrid designs

10-Layer Stack-Up Advantage

The 10-layer construction enables complex routing for MIMO antenna arrays, beamforming networks, phase-shifter modules, and integrated RF + digital control designs in a single board. PCBSync supports hybrid stack-ups combining RO3003G2 with FR-4 or other Rogers laminates (RO4350B, RO4835) to balance performance with cost — letting you reserve the premium high-frequency layers exactly where they matter.

Typical Applications

5G mmWave base stations and small cells (24, 28, 39 GHz bands)
77 GHz automotive radar (ADAS, LiDAR fusion, autonomous driving)
Phased-array and beamforming antennas
Satellite communication (SATCOM) and aerospace systems
Microwave point-to-point backhaul
RF test and measurement equipment

Manufacturing Capability at PCBSync

Every RO3003G2 board is fabricated in our IPC Class 3-certified facility with controlled impedance (±5%), laser-drilled microvias, sequential lamination, and 100% AOI plus flying probe testing. We support quick-turn prototypes from 5 working days, with full DFM review included on every order at no additional cost.

Order online today and receive your custom 5G mmWave PCB built to your exact stack-up, drill, and impedance requirements. Trusted by RF engineers at leading telecom, automotive, and aerospace OEMs worldwide — PCBSync is your high-frequency manufacturing partner from prototype through volume production.