The RO3003G2 6-layer 5G Radio Unit PCB is a precision-engineered circuit board specifically developed for the next generation of telecommunications hardware. As 5G infrastructure scales, the requirement for consistent electrical performance across varying temperatures becomes critical. This 1.0mm thickness board utilises Rogers RO3003G2 material to provide the low dissipation factor and stable dielectric constant ($D_k$) necessary for Sub-6GHz radio units and MIMO antenna arrays.

Key Features

• Material: Rogers RO3003G2 ceramic-filled PTFE laminate.

• Layer Count: 6-layer multilayer stackup for optimized signal routing and EMI shielding.

• Surface Finish: ENIG (Electroless Nickel Immersion Gold) for superior solderability and oxidation resistance.

• Copper Weight: 1oz (35µm) finished copper for reliable power distribution and thermal management.

• Board Thickness: 1.0mm rigid construction.

• RF Performance: Optimized for Sub-6GHz spectrum with minimal signal attenuation.

• Stability: Low coefficient of thermal expansion (CTE) on the Z-axis for reliable plated through-hole (PTH) integrity.

Applications

• 5G New Radio (NR) Sub-6GHz base stations.

• Adaptive antenna systems and Massive MIMO modules.

• Small cell backhaul equipment.

• High-speed wireless point-to-point systems.

• Advanced Driver Assistance Systems (ADAS) radar sensors.

Why Choose PCBSYNC

PCBSYNC is a professional PCB fabrication, PCBA, and EMS manufacturer delivering precision-built electronics for aerospace, medical, automotive, industrial, and smart energy applications. We handle everything from rapid prototyping to mass production — including rigid, flexible, and rigid-flex PCBs, full turnkey assembly, component sourcing, AOI and X-ray inspection, and OEM/ODM support. Reliable boards. Consistent quality. From prototype to production — PCBSYNC.

To discuss your specific project requirements or to receive a detailed technical assessment, please contact our engineering team or request a formal quote through our online portal.