Achieve superior circuit performance with the PCBSync Sequential Lamination Rigid-Flex PCB with ENIG (Electroless Nickel Immersion Gold) finish. Designed for engineers and OEMs demanding the highest standards in flexible-rigid PCB technology, this advanced board combines mechanical durability with precision electrical performance.
What Is Sequential Lamination Rigid-Flex PCB?
Sequential lamination is a specialized PCB manufacturing process that builds up multiple rigid and flex layers in controlled lamination cycles. This allows for complex blind and buried via structures, tighter layer registration, and enhanced signal integrity — ideal for high-density interconnect (HDI) designs in compact devices.
Why Choose ENIG Surface Finish?
The ENIG surface finish provides a flat, oxidation-resistant gold layer over electroless nickel, ensuring:
- Excellent solderability and wire bondability
- Long shelf life and consistent pad planarity
- Ideal compatibility with fine-pitch SMD components
Key Features & Specifications
- Construction: Sequential laminated rigid-flex multi-layer
- Surface Finish: ENIG (Electroless Nickel Immersion Gold)
- Layer Count: Custom configurations available (4L to 20L+)
- Flex Material: Polyimide (PI) core
- Applications: Medical devices, aerospace systems, wearables, robotics, automotive electronics
Why PCBSync?
PCBSync specializes in advanced rigid-flex PCB manufacturing with strict IPC-6013 compliance, rapid prototyping, and full-scale production runs. Every board undergoes AOI, electrical testing, and impedance control verification before shipment.
Order your custom PCBSync Sequential Lamination Rigid-Flex PCB with ENIG today and accelerate your next-generation product design.
