Upgrade your electronics with the PCBSync High-Tg Rigid-Flex PCB (Tg 170°C) with ENIG — a precision-engineered circuit board solution built to perform where standard PCBs fail. Combining high glass transition temperature materials with flexible circuit technology, this board is the go-to choice for engineers and product designers who demand reliability under thermal stress.
Why Choose PCBSync High-Tg Rigid-Flex PCB?
Our High-Tg Rigid-Flex PCB features a glass transition temperature of 170°C, ensuring structural integrity and electrical stability in high-heat environments. Unlike standard FR4 boards, the Tg 170 laminate resists delamination, warping, and thermal degradation — even during lead-free soldering processes and repeated reflow cycles.
The integrated ENIG (Electroless Nickel Immersion Gold) surface finish provides a flat, oxidation-resistant, and highly solderable surface that enhances long-term reliability and supports fine-pitch component assembly. ENIG is the preferred finish for high-density interconnect (HDI) designs and BGA packages.
Key Features & Specifications:
- Glass Transition Temperature: Tg 170°C
- Surface Finish: ENIG (Electroless Nickel Immersion Gold)
- Board Type: Rigid-Flex hybrid construction
- Ideal for multilayer and complex 3D packaging designs
- Excellent dimensional stability and mechanical durability
- RoHS compliant and lead-free compatible
- Suitable for aerospace, automotive, medical devices, wearables, and military electronics
Applications: High-reliability PCBs, compact device packaging, flex-to-install assemblies, and space-constrained electronics.
Order your PCBSync High-Tg Rigid-Flex PCB with ENIG today and experience the difference precision manufacturing makes.
