Product Description
The PCBSync HDI 10-Layer Rigid-Flex PCB with Laser-Drilled Microvias delivers a powerful combination of high-density interconnect (HDI) technology and flexible circuit design in a single, compact board. Purpose-built for engineers and product designers working in aerospace, medical devices, wearable electronics, and advanced consumer technology, this rigid-flex PCB eliminates the need for bulky connectors and reduces assembly complexity without sacrificing performance.
At the core of this board’s precision engineering are laser-drilled microvias — ultra-fine, accurately positioned holes that enable tight via-in-pad designs and shorter signal paths. This directly reduces parasitic inductance and capacitance, supporting high-speed signal transmission up to 10+ Gbps. The result is superior electrical performance in RF, microwave, and high-frequency digital applications.
The 10-layer stackup provides exceptional routing density, allowing complex circuitry to fit into incredibly tight form factors. Alternating rigid and flexible zones give the board mechanical resilience while allowing it to bend, fold, or wrap around components — ideal for 3D packaging and space-constrained enclosures.
Key Features
- 10-layer HDI rigid-flex construction for maximum routing density
- Laser-drilled microvias for precise, reliable high-density interconnects
- IPC Class 3 compliant — meets the highest reliability standards
- Flex zones rated for 100,000+ bend cycles
- Controlled impedance with ±10% tolerance
- RoHS & REACH compliant materials
- Available in custom stack-up configurations to match your design spec
Whether you’re prototyping a cutting-edge wearable or scaling production of a medical-grade device, the PCBSync HDI 10-Layer Rigid-Flex PCB is the trusted solution for high-performance, space-saving circuit design.
