Unlock the next level of electronic design with the PCBSync 8-Layer Rigid-Flex PCB, combining the structural strength of rigid boards with the space-saving versatility of flexible circuitry. Finished with a premium Immersion Silver (ImAg) surface treatment, this advanced multilayer PCB delivers superior solderability, flat surface uniformity, and excellent high-frequency performance for today’s most demanding applications.
Why Choose Our 8-Layer Rigid-Flex PCB?
Our rigid-flex PCB solution eliminates the need for multiple connectors and cables, dramatically reducing assembly weight, potential failure points, and overall system footprint. With 8 copper layers, designers gain maximum routing density and signal integrity — ideal for compact, high-performance devices.
Key Features & Specifications:
- Layers: 8-layer rigid-flex stack-up
- Surface Finish: RoHS-compliant Immersion Silver (ImAg)
- Dielectric Material: High-performance polyimide flex + FR4 rigid core
- Copper Weight: 0.5 oz – 2 oz (customizable per layer)
- Min. Trace/Space: 3/3 mil
- Board Thickness: Customizable rigid zones
- Operating Temperature: -55°C to +125°C
- IPC Class: Class II / Class III available
Applications:
Trusted across wearable technology, medical imaging devices, military-grade electronics, smartphones, and IoT modules — wherever reliability under mechanical stress is non-negotiable.
Why Immersion Silver?
Immersion Silver provides a wire-bondable, ultra-flat surface with exceptional shelf life and oxidation resistance, making it the preferred choice for fine-pitch SMD components and high-speed signal transmission.
Request a custom quote today and let PCBSync’s engineering team optimize your rigid-flex design for performance and cost-efficiency.
