Engineered for precision and built for performance, the PCBSync 6-Layer Rigid-Flex PCB with ENIG Finish delivers the perfect balance of flexibility and structural integrity for today’s most demanding electronics applications.
This advanced 6-layer stackup is designed to meet the rigorous requirements of aerospace, medical devices, wearables, industrial automation, and consumer electronics. By combining rigid and flexible substrates into a single unified circuit board, this solution eliminates bulky connectors and ribbon cables — reducing assembly time, minimizing failure points, and saving critical space in compact form-factor designs.
Key Features & Specifications:
- Layer Count: 6-layer hybrid construction (rigid + flex zones)
- Surface Finish: ENIG (Electroless Nickel Immersion Gold) for superior solderability, flat pad surface, and excellent oxidation resistance
- Flex Material: Polyimide (PI) substrate for outstanding thermal stability and repeated bend cycles
- Controlled Impedance: Available upon request to meet strict signal integrity requirements
- Minimum Trace/Space: 3mil/3mil
- Blind & Buried Vias: Supported for high-density interconnect (HDI) designs
- IPC Class 2 / Class 3 compliance available
The ENIG finish ensures a consistent, gold-plated surface ideal for fine-pitch SMD components and wire bonding applications. It also provides exceptional shelf life and reliable performance in high-humidity environments.
Whether you’re prototyping or scaling to full production, PCBSync delivers fast turnaround times, strict quality control (ISO 9001 certified), and dedicated engineering support throughout your project.
Ready to take your design further? Explore our full range of Rigid flex PCB solutions and request a custom quote today.
PCBSync — Precision Boards. Proven Performance.
