Heavy copper PCBs aren’t your everyday circuit boards. When you’re dealing with 5 OZ copper weight, you’re stepping into territory where standard manufacturing processes just don’t cut it. PCBSYNC handles this specialized work because some applications simply demand the extra muscle.
The thing about 5 OZ heavy copper boards is they’re built for punishment. High-power applications, industrial controls, power distribution systems—these need PCBs that can handle serious current without breaking a sweat. Regular boards would overheat or fail, but heavy copper construction distributes heat better and carries more current safely.
PCBSYNC’s manufacturing process for these boards requires different equipment and expertise than standard PCB production. The etching process alone is more complex because you’re working with significantly thicker copper layers. The plating has to be precise, and the lamination process needs careful attention to prevent issues like delamination or copper pullback.
What makes heavy copper boards tricky is balancing performance with manufacturability. You need proper trace spacing to account for the increased copper thickness during etching. The aspect ratios for vias become more challenging. Heat management during assembly is different too—all that copper mass affects how the board responds to soldering temperatures.
These boards often get used in automotive applications, solar panel inverters, welding equipment, and military hardware. Anywhere you need reliable power handling in demanding environments, heavy copper makes sense. The extra cost compared to standard boards pays off in durability and performance.
PCBSYNC manages the full process from design review to final testing. They’ll flag potential issues early, like traces that won’t etch properly at 5 OZ or thermal management concerns. Getting the stackup right matters more with heavy copper, and experienced manufacturers know which materials pair well with thick copper layers for different operating temperatures and mechanical requirements.