The PCBSync 16-Layer Rigid-Flex PCB with ENEPIG Surface Finish delivers unmatched performance for complex, space-constrained electronic applications. Engineered for industries where reliability is non-negotiable, this advanced board integrates both rigid and flexible zones into a single, seamless assembly — eliminating connectors, reducing weight, and improving overall signal integrity.
Why Choose PCBSync 16-Layer Rigid-Flex PCB?
Designed for high-density interconnect (HDI) applications, this 16-layer configuration supports demanding layouts with fine-pitch components, blind vias, and controlled impedance traces. Whether you’re developing aerospace avionics, medical wearables, military electronics, or next-generation consumer devices, this board meets IPC-6013 Class 3 standards for the most rigorous environments.
ENEPIG Surface Finish — Superior Solderability & Longevity
The Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) surface treatment provides exceptional wire bondability, lead-free soldering compatibility, and outstanding shelf life. ENEPIG prevents the “black pad” syndrome common with ENIG finishes, ensuring every joint maintains long-term mechanical and electrical reliability.
Key Specifications & Features:
- Layers: 16 (Rigid-Flex Hybrid Construction)
- Surface Finish: ENEPIG (RoHS Compliant)
- Min. Trace/Space: 3mil/3mil
- Dielectric Material: Polyimide flex core + FR4 rigid
- Operating Temperature: -55°C to +125°C
- Applications: Medical devices, aerospace, robotics, wearables
Fast Turnaround. Certified Quality.
PCBSync delivers precision-manufactured rigid-flex PCBs with ISO 9001 and IPC-A-600 certifications, quick-turn prototyping, and scalable production runs.
Request a quote today and experience the PCBSync difference in every layer.