Unlock next-generation circuit board performance with the PCBSync 10-Layer Rigid-Flex PCB featuring a 4-Layer Flex Core — a precision-engineered interconnect solution built for demanding, space-constrained applications where reliability cannot be compromised.
Advanced Stackup for Maximum Performance This rigid-flex PCB combines 10 conductive layers with a robust 4-layer flexible core, enabling seamless signal transmission across both rigid and flex zones. The hybrid stackup minimizes signal loss, reduces electromagnetic interference (EMI), and supports high-speed data transfer — making it the go-to choice for RF modules, IoT devices, and compact medical instrumentation.
Built to Flex, Designed to Last The 4-layer flex core is manufactured using polyimide (PI) substrate, offering excellent thermal resistance, repeated bend endurance, and dimensional stability across extreme environments. Whether your design demands dynamic flexing or static bent installations, PCBSync ensures consistent electrical continuity and mechanical integrity.
Why Choose PCBSync Rigid-Flex PCBs?
- ✅ 10-layer construction with controlled impedance
- ✅ 4-layer polyimide flex core for superior bend reliability
- ✅ IPC-6013 Class 3 compliant manufacturing
- ✅ Fine-line trace capability down to 3 mil/3 mil
- ✅ Available with ENIG, HASL, or OSP surface finish
- ✅ Custom stack-up, panel size, and via options available
- ✅ UL-certified materials for safety-critical applications
Applications: Wearable technology, aerospace avionics, surgical equipment, industrial robotics, and compact consumer electronics.
Request a free DFM review or instant quote today and experience the PCBSync quality difference.
