Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

High-Performance Xilinx XC7VX330T-1FF1761I FPGA – Advanced Logic and Speed for Complex Designs

Product Details

Xilinx XC7VX330T-1FF1761I Product Description

The Xilinx XC7VX330T-1FF1761I is a powerful member of the renowned Virtex-7 FPGA family, designed for engineers and developers requiring advanced programmable logic with extraordinary speed, capacity, and flexibility. This high-end FPGA delivers superior performance for computationally demanding applications such as telecommunications, aerospace, defense, and data center accelerators.

Built on a cutting-edge 28nm process technology, the XC7VX330T integrates over 326,000 logic cells and an extensive array of DSP slices, block RAM, and ultra-fast transceivers. It supports complex algorithms and hardware acceleration with remarkable throughput and ultra-low latency. The device’s rugged industrial-grade temperature rating (-40°C to 100°C) ensures reliability in harsh deployment environments.

Key advantages of the XC7VX330T include its optimized power consumption, robust signal integrity, and ultra-high-speed serial connectivity up to 12.5 Gb/s per transceiver lane. These features make it a preferred choice for real-time data processing, high-bandwidth communication, and advanced imaging systems.

Additionally, the FPGA benefits from the rich Xilinx Vivado design suite ecosystem for seamless development, debugging, and deployment, speeding up time to market and reducing development risks.

Whether your project demands cutting-edge AI acceleration, video processing, or secure cryptography, the XC7VX330T-1FF1761I offers unmatched performance, scalability, and integrated features to meet your system requirements efficiently.

For more information and purchase options, please visit the dedicated Xilinx FPGA LINK.


Technical Specifications of Xilinx XC7VX330T-1FF1761I

Specification Details
FPGA Family Virtex-7
Model Number XC7VX330T-1FF1761I
Process Technology 28nm
Logic Cells 326,080
DSP Slices 2,020
Block RAM 19.2 Mb
I/O Pins 1,761
Transceiver Speed Up to 12.5 Gb/s
Max Clock Frequency 440 MHz
Package Type Flip-Chip Fine-Pitch Ball Grid Array (FFG)
Package Dimensions 35mm x 35mm
Temperature Range Industrial: -40°C to 100°C
Core Voltage 1.0 V
Memory Interface Supports DDR3/DDR3L/DDR4
Power Management Integrated Power Optimization

Why Choose Xilinx XC7VX330T-1FF1761I FPGA?

High Capacity and Performance

The XC7VX330T is engineered for designs requiring large logic capacity combined with high-speed DSP and memory resources, accelerating complex signal processing and compute-intensive tasks.

Advanced Connectivity

With multi-Gigabit transceivers capable of 12.5 Gb/s, this FPGA enables high-speed serial links essential for next-gen communication systems.

Robust Product and Ecosystem Support

Leveraging Xilinx’s trusted Vivado toolchain and a mature ecosystem ensures your development experience is streamlined from prototype to production.


The Xilinx XC7VX330T-1FF1761I FPGA is an ideal component for engineers focusing on scalable, energy-efficient, and high-throughput programmable logic devices. Its balance of power, versatility, and industrial-grade reliability makes it suitable for modern applications demanding uncompromised performance.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.