High-Performance Xilinx XC7Z035-3FBG676E Zynq-7000 SoC
Looking for a powerful SoC that bridges the gap between hardware flexibility and software programmability? The Xilinx XC7Z035-3FBG676E is a premium member of the Zynq®-7000 All Programmable SoC family. It integrates a dual-core ARM® Cortex™-A9 processor with high-performance 28nm programmable logic. This unique architecture delivers exceptional performance-per-watt, making it the ideal choice for data-intensive, high-bandwidth applications.
Whether you are designing for industrial automation, advanced medical imaging, or next-generation telecommunications, this SoC offers the scalability and speed your project demands.
Why Choose the XC7Z035-3FBG676E?
The “3” speed grade in the XC7Z035-3FBG676E represents the highest performance tier available for this family. This ensures ultra-fast processing speeds and minimal latency. Combined with a robust FBG676 package, this chip provides a rich array of I/Os and high-speed serial transceivers. Designers can easily implement complex algorithms, handle massive data routing, and manage real-time control systems on a single silicon footprint.
If you are sourcing reliable components for your next hardware build, exploring a premium Xilinx FPGA solution ensures long-term lifecycle support and industry-leading development tools like Vivado Design Suite.
Technical Specifications & Key Details
To help you quickly evaluate this SoC for your design, the primary hardware and architectural specifications are detailed below.
Processing System & Programmable Logic
| Parameter |
Specification Details |
| Processor Core |
Dual-core ARM® Cortex™-A9 MPCore™ with CoreSight™ |
| Maximum Frequency |
Up to 1 GHz (Speed Grade -3) |
| Logic Cells |
275K Logic Cells |
| Look-up Tables (LUTs) |
171,900 |
| DSP Slices |
900 Slices |
| Primary Cache |
32 KB I/D per core, 512 KB L2 Cache |
Memory, I/O, and Package Data
| Feature |
Capability / Dimension |
| Block RAM |
17.6 Mb |
| Maximum I/O Pins |
200 SelectIO pins |
| GXT/GTH Transceivers |
16 Transceivers (up to 12.5 Gbps) |
| Package Type |
FBG676 (Fine-Pitch Ball Grid Array, 676 Pins) |
| Operating Temperature |
0°C to 85°C (Extended Commercial) |
| Operating Voltage |
0.95V to 1.05V |
Target Applications and Use Cases
Thanks to its hybrid architecture, the XC7Z035-3FBG676E excels in markets requiring embedded intelligence joined with heavy hardware acceleration:
-
Advanced Driver Assistance Systems (ADAS): Real-time sensor fusion and computer vision processing.
-
Broadcast Camera Systems: Multi-channel video encoding, decoding, and high-definition image manipulation.
-
Wireless Basebands: High-speed digital signal processing and RF front-end control.
-
Smart Grid & Power Systems: High-precision monitoring and fast-fault protection loops.
Investing in this top-tier Zynq-7000 SoC gives your team the hardware headroom needed to future-proof your products.
