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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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Gemini said XC2S200-6FGG1285C: High-Performance Xilinx Spartan-II FPGA Overview

Product Details

The XC2S200-6FGG1285C is a cornerstone of the Xilinx Spartan-II family, designed to provide a cost-effective, high-volume solution for logic integration. This Field Programmable Gate Array (FPGA) bridges the gap between complex programmable logic devices (CPLDs) and high-end FPGAs by offering a rich feature set, including flexible I/O standards and on-chip block RAM.

Built on a 0.22µm/0.18µm CMOS process, the Spartan-II XC2S200 series is optimized for performance-critical applications where budget constraints are tight but logic density requirements remain high.

Key Technical Specifications of XC2S200-6FGG1285C

The XC2S200-6FGG1285C offers a significant amount of logic resources, making it suitable for digital signal processing (DSP), glue logic, and custom interface controllers. Below is a detailed breakdown of the core specifications:

Table 1: Core Architecture and Logic Density

Feature Specification
System Gates 200,000
Logic Cells 5,292
CLB Array (Rows x Cols) 28 x 42
Total Distributed RAM Bits 75,264
Total Block RAM Bits 56,320
Number of Dedicated Block RAMs 14
Maximum User I/O Up to 284 (Package Dependent)

Table 2: Electrical and Operating Conditions

Parameter Rating
Internal Supply Voltage (Vccint) 2.5V
I/O Supply Voltage (Vcco) 1.5V to 3.3V
Speed Grade -6 (Standard Performance)
Operating Temperature 0°C to +85°C (Commercial)
Package Type FGG1285 (Fine-Pitch Ball Grid Array)

Advanced Architecture and Features

The architecture of the XC2S200-6FGG1285C is derived from the Virtex series, ensuring a robust and well-documented design environment. It consists of three main elements: Configurable Logic Blocks (CLBs), Input/Output Blocks (IOBs), and Programmable Interconnect.

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1285C lies in its CLBs. Each CLB contains four logic cells organized in two slices. Each logic cell includes a 4-input Look-Up Table (LUT), carry logic, and a storage element (flip-flop). This structure allows for the efficient implementation of complex arithmetic functions and synchronous state machines.

SelectI/O Technology

One of the most powerful features of this Xilinx FPGA is its SelectI/O capability. The XC2S200-6FGG1285C supports up to 16 different high-performance I/O standards, including:

  • LVTTL and LVCMOS (3.3V, 2.5V, 1.8V, 1.5V)

  • PCI (33MHz and 66MHz)

  • GTL and GTL+

  • SSTL and HSTL

This versatility eliminates the need for external level shifters and allows the FPGA to communicate directly with various memory types and bus architectures.

Dedicated Block RAM

Unlike standard CPLDs, the XC2S200-6FGG1285C features dedicated 4,096-bit synchronous dual-port RAM blocks. These are essential for implementing:

  • Large FIFO buffers

  • Deep look-up tables

  • On-chip data storage for micro-controllers

Optimized Power Management and Design Efficiency

The XC2S200-6FGG1285C is designed for low power consumption without sacrificing speed. By utilizing a 2.5V core voltage, the device reduces power dissipation compared to older 3.3V or 5V logic families.

Delay-Locked Loops (DLLs)

To maintain high-speed signal integrity, the device includes four dedicated DLLs. These provide:

  1. Clock De-skew: Synchronizing internal clock signals with external sources.

  2. Frequency Synthesis: Multiplying or dividing clock frequencies.

  3. Phase Shifting: Adjusting clock phases for high-speed memory interfaces.

Typical Applications for XC2S200-6FGG1285C

Due to its high gate count and versatile I/O, the XC2S200-6FGG1285C is frequently found in the following sectors:

  • Telecommunications: Network interface cards, protocol converters, and base station controllers.

  • Industrial Automation: High-speed motor control, PLC expansion modules, and sensor fusion.

  • Consumer Electronics: Digital video processing, set-top boxes, and high-fidelity audio equipment.

  • Legacy System Support: Replacing obsolete ASIC components or outdated CPLDs in long-lifecycle industrial systems.

Conclusion and Design Support

The XC2S200-6FGG1285C remains a reliable choice for engineers seeking a balance between cost and capability. Its compatibility with Xilinx ISE design tools ensures a streamlined development workflow, from VHDL/Verilog synthesis to place-and-route.

When integrating this FPGA into your next project, ensure proper decoupling of the Vccint and Vcco rails and follow recommended PCB layout guidelines for high-speed differential signaling to maximize the performance of the SelectI/O banks.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.