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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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Gemini said XC2S200-6FGG1274C Xilinx Spartan-II FPGA: Technical Overview and Specifications

Product Details

The XC2S200-6FGG1274C belongs to the renowned Xilinx Spartan-II family, a series designed to provide a cost-effective alternative to high-end FPGAs while maintaining high performance. This field-programmable gate array (FPGA) is optimized for high-volume, cost-sensitive applications, offering a perfect balance between flexible logic integration and system-level features.

Whether you are designing for telecommunications, consumer electronics, or industrial control systems, the XC2S200-6FGG1274C provides the necessary gates and I/O capabilities to streamline your hardware architecture.

Key Features of the XC2S200-6FGG1274C FPGA

The Spartan-II architecture is built upon the foundation of the Virtex series, ensuring that users benefit from a proven, reliable technology. Below are the primary features that make this specific part number a standout choice for legacy and specialized designs:

  • High Logic Density: With approximately 200,000 system gates, it handles complex digital logic tasks efficiently.

  • Flexible I/O Standards: Supports multiple I/O signaling standards, including LVTTL, LVCMOS, and PCI.

  • On-Chip Block RAM: Features dedicated memory blocks to improve data processing speeds and reduce external component reliance.

  • Low Power Consumption: Designed with a 2.5V core voltage to minimize thermal output and power drain.

  • Advanced Clock Management: Includes Delay-Locked Loops (DLLs) for precise clock distribution and deskewing.

Technical Specifications Table

To help you evaluate the compatibility of the XC2S200-6FGG1274C for your specific board layout, here is a detailed breakdown of its core parameters:

Parameter Specification
Logic Cells 5,292
System Gates 200,000
CLB Array 28 x 42
Total Distributed RAM 75,264 Bits
Total Block RAM 56,384 Bits
Maximum User I/O 284
Operating Voltage 2.5V (Core) / 3.3V (I/O)
Package Type FGG1274 (Fine-Pitch BGA)
Speed Grade -6

Performance and Speed Grade Analysis

The “-6” designation in XC2S200-6FGG1274C refers to its speed grade. In Xilinx nomenclature, the speed grade indicates the timing characteristics of the internal logic and I/O. A -6 speed grade ensures high-speed switching and reliable timing closure for demanding synchronous designs.

Furthermore, the FGG1274 package utilizes a fine-pitch Ball Grid Array (BGA) format. This lead-free (FGG) packaging is essential for modern environmental compliance while providing a high density of interconnects in a compact footprint.

Package and Thermal Characteristics

Efficient thermal management is critical for FPGA longevity. The BGA packaging of the XC2S200 series is designed to dissipate heat effectively through the PCB.

Feature Details
Lead-Free Status RoHS Compliant (FGG)
Mounting Type Surface Mount (SMD/SMT)
Temperature Range 0°C to 85°C (Commercial Grade)
Interconnects Fine-Pitch BGA

Applications of Xilinx Spartan-II Series

Because of its versatility, the XC2S200-6FGG1274C is frequently utilized in various industrial and commercial sectors. Its ability to handle multiple I/O standards makes it an ideal bridge between different system components.

  1. Industrial Automation: Used in motor control, sensor data processing, and PLC expansion modules.

  2. Legacy System Support: Ideal for maintaining and upgrading existing hardware that requires Xilinx FPGA technology without a full system redesign.

  3. Data Communications: Implementing custom protocols, data buffering, and interface conversion.

  4. Consumer Electronics: Supporting video processing and high-speed bus interfaces.

Why Choose the XC2S200-6FGG1274C?

Selecting the right FPGA involves balancing cost, gate count, and I/O availability. The XC2S200-6FGG1274C stands out because it offers a significant gate count (200k) at a price point that remains competitive for production-level volumes.

Moreover, the maturity of the Spartan-II ecosystem means that development tools and IP cores are well-documented, reducing the overall time-to-market for your engineering team. By utilizing the Spartan-II architecture, you gain access to a reliable, industrial-grade solution that has been field-tested across millions of units globally.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.