The AMD-Xilinx XCZU6CG-2FFVC900I is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC CG family. This industrial-grade device delivers exceptional processing power by combining dual ARM Cortex-A53 application processors with programmable logic in a compact 900-pin FCBGA package. Designed for demanding embedded applications, the XCZU6CG-2FFVC900I offers 469K+ logic cells, 1,973 DSP slices, and comprehensive connectivity options for industrial motor control, sensor fusion, and edge computing applications.
XCZU6CG-2FFVC900I Key Features and Benefits
The XCZU6CG-2FFVC900I stands out in the Zynq UltraScale+ portfolio as a mid-range CG device optimized for cost-sensitive industrial applications. This MPSoC integrates a powerful processing system with flexible programmable logic, enabling hardware-software co-design on a single chip.
Why Choose the XCZU6CG-2FFVC900I?
- Dual ARM Cortex-A53 MPCore processors running up to 1.3 GHz for application processing
- Dual ARM Cortex-R5 real-time processors operating at 533 MHz with hardware floating-point
- 469,446 system logic cells for custom hardware acceleration
- Industrial temperature grade (-40°C to +100°C TJ) for harsh environments
- -2 speed grade delivering optimal performance-to-power ratio
XCZU6CG-2FFVC900I Technical Specifications
Processing System (PS) Specifications
| Parameter |
Specification |
| Application Processing Unit |
Dual-core ARM Cortex-A53 MPCore with CoreSight |
| APU Speed |
Up to 1.3 GHz |
| Real-Time Processing Unit |
Dual-core ARM Cortex-R5 with CoreSight |
| RPU Speed |
Up to 533 MHz |
| L1 Cache |
32KB Instruction / 32KB Data per core |
| L2 Cache |
1MB shared with ECC |
| On-Chip Memory |
256KB with ECC |
| Floating Point |
NEON & Single/Double Precision |
Programmable Logic (PL) Specifications
| Resource |
Quantity |
| System Logic Cells |
469,446 (469K+) |
| CLB Flip-Flops |
429,000 |
| CLB LUTs |
215,000 |
| DSP48E2 Slices |
1,973 |
| Total Block RAM |
25.1 Mb |
| Max Distributed RAM |
6.9 Mb |
| Clock Management Tiles |
4 CMTs |
Package and Electrical Specifications
| Parameter |
Value |
| Part Number |
XCZU6CG-2FFVC900I |
| Package Type |
900-FCBGA (31mm x 31mm) |
| Ball Pitch |
1.0mm |
| Core Voltage (VCCINT) |
0.85V |
| Speed Grade |
-2 (Standard Performance) |
| Temperature Grade |
Industrial (-40°C to +100°C TJ) |
| Process Technology |
16nm FinFET+ |
XCZU6CG-2FFVC900I Connectivity and I/O Interfaces
High-Speed Connectivity
The XCZU6CG-2FFVC900I provides extensive high-speed connectivity options through PS-GTR transceivers and PL-side GTH transceivers:
| Interface |
Specification |
| PS-GTR Transceivers |
4x up to 6.0 Gb/s |
| GTH Transceivers |
16x up to 16.3 Gb/s |
| PCIe |
Gen1/Gen2 x4 |
| USB 3.0 |
2x SuperSpeed ports |
| SATA |
3.1 support |
| DisplayPort |
1.2a with audio |
| Gigabit Ethernet |
4x Tri-mode MACs |
General-Purpose Connectivity
| Interface |
Quantity |
| USB 2.0 |
2x (Host/Device/OTG) |
| UART |
2x |
| CAN 2.0B |
2x |
| I2C |
2x |
| SPI |
2x |
| GPIO |
4x 32-bit banks |
| SD/SDIO |
2x |
I/O Pin Configuration (FFVC900 Package)
| I/O Type |
Count |
| PS I/O (MIO + DDR) |
214 |
| High-Density (HD) I/O |
48 |
| High-Performance (HP) I/O |
156 |
| Total Package Pins |
900 |
Memory Interface Support
The XCZU6CG-2FFVC900I supports a comprehensive range of memory technologies for both high-bandwidth and storage applications:
Dynamic Memory Support
- DDR4 (x32/x64 with ECC)
- DDR3/DDR3L (x32/x64 with ECC)
- LPDDR4 (x32/x64 with ECC)
- LPDDR3 (x32/x64 with ECC)
Static Memory Support
- Quad-SPI NOR Flash (2x controllers)
- NAND Flash
- SD/eMMC cards
Security and Power Management Features
Integrated Security
The XCZU6CG-2FFVC900I includes hardware-based security features essential for industrial and embedded applications:
- AES-256 encryption/decryption
- RSA authentication
- SHA-3 hashing
- Secure Boot with authentication
- Anti-tamper capabilities
- eFUSE key storage
Power Management
- Multiple power domains (Full/Low/PL/Battery)
- Dynamic power scaling
- Low-power modes for battery-backed operation
- System Monitor for voltage and temperature monitoring
XCZU6CG-2FFVC900I Target Applications
The XCZU6CG-2FFVC900I is specifically optimized for industrial and embedded applications requiring real-time processing combined with hardware acceleration:
Industrial Automation
- Motor control systems with precision servo drives
- Industrial robotics and motion control
- Factory automation and PLC replacement
- Real-time industrial Ethernet implementations
Sensor Fusion and Processing
- Multi-sensor data aggregation
- LiDAR and radar signal processing
- Machine vision pre-processing
- Environmental monitoring systems
Edge Computing and IoT
- Edge AI inference acceleration
- IoT gateway and aggregation devices
- Predictive maintenance systems
- Smart grid controllers
Medical and Scientific Equipment
- Portable ultrasound systems
- Patient monitoring devices
- Laboratory automation
- Diagnostic imaging equipment
XCZU6CG-2FFVC900I Part Number Breakdown
Understanding the part number helps identify exact device specifications:
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU6 |
Zynq UltraScale+ size 6 |
| CG |
Dual APU, Dual RPU, General Purpose |
| -2 |
Speed grade 2 (mid-performance) |
| FF |
Flip-chip, 1.0mm ball pitch |
| V |
RoHS 6/6 compliant |
| C900 |
Package footprint C, 900 pins |
| I |
Industrial temperature grade |
Development Tools and Software Support
Design Software
- Vivado Design Suite for FPGA development
- Vitis Unified Platform for embedded software
- PetaLinux for Linux-based systems
- Vitis AI for machine learning deployment
Documentation Resources
- DS891: Zynq UltraScale+ MPSoC Overview
- UG1085: Technical Reference Manual
- UG1075: Packaging and Pinouts
- DS925: DC and AC Switching Characteristics
Related Zynq UltraScale+ MPSoC Devices
For design flexibility and migration options, consider these pin-compatible alternatives:
| Part Number |
Logic Cells |
DSP Slices |
Key Difference |
| XCZU5CG-2FFVC900I |
256K |
1,248 |
Lower density option |
| XCZU6CG-1FFVC900I |
469K |
1,973 |
Slower speed grade |
| XCZU7CG-2FFVC900I |
504K |
1,728 |
Higher logic density |
Where to Buy AMD-Xilinx XCZU6CG-2FFVC900I
The XCZU6CG-2FFVC900I is available through authorized AMD distributors worldwide. For comprehensive Xilinx FPGA product information and purchasing options, contact your preferred distributor or visit PCBSync for component sourcing assistance.
XCZU6CG-2FFVC900I Summary
The AMD-Xilinx XCZU6CG-2FFVC900I delivers an optimal balance of processing performance, programmable logic resources, and industrial reliability for demanding embedded applications. With its dual ARM Cortex-A53 application processors, dual ARM Cortex-R5 real-time processors, and 469K+ system logic cells, this Zynq UltraScale+ MPSoC enables sophisticated hardware-software designs in a single-chip solution. The industrial temperature grade, comprehensive security features, and extensive connectivity options make the XCZU6CG-2FFVC900I an ideal choice for industrial automation, sensor fusion, edge computing, and medical equipment applications.
