Meta Description: Buy the AMD Xilinx XC2S200-6FGG466C FPGA from the Spartan-II family featuring 200K system gates, 5292 logic cells, 263MHz clock speed, and 456-pin BGA package. Ideal for industrial automation, telecommunications, and embedded systems.
The XC2S200-6FGG466C is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family. This programmable logic device delivers exceptional flexibility and processing power for designers seeking cost-effective solutions in digital design applications. With 200,000 system gates and advanced 0.18µm CMOS technology, the XC2S200-6FGG466C stands as a reliable choice for complex embedded systems, telecommunications equipment, and industrial automation projects.
Whether you’re developing prototypes or deploying production-ready systems, this Xilinx FPGA offers the perfect balance of performance, power efficiency, and design flexibility that modern electronic applications demand.
Key Features of the XC2S200-6FGG466C FPGA
The XC2S200-6FGG466C delivers robust digital processing capabilities through its carefully engineered architecture. This Spartan-II device provides engineers with comprehensive resources for implementing sophisticated digital designs.
High-Capacity Logic Architecture
The XC2S200-6FGG466C incorporates 5,292 logic cells organized in a 28×42 CLB (Configurable Logic Block) array, totaling 1,176 CLBs. This substantial logic capacity enables designers to implement complex algorithms, state machines, and digital signal processing functions within a single chip. Each logic cell contains look-up tables (LUTs), flip-flops, and multiplexers for maximum design flexibility.
Flexible Memory Resources
This FPGA features dual memory systems for diverse application requirements. The device includes 75,264 bits of distributed RAM for fast, localized data storage and 56 Kbits of dedicated block RAM for high-bandwidth data buffering. These memory resources support efficient implementation of FIFOs, register files, and small lookup tables directly within the FPGA fabric.
High-Speed Clock Management
Four integrated Delay-Locked Loops (DLLs) provide precise clock management capabilities. These DLLs enable clock multiplication, division, and phase shifting—essential functions for high-speed interface designs and multi-clock domain applications. The device supports clock frequencies up to 263 MHz, ensuring adequate timing margins for demanding applications.
XC2S200-6FGG466C Technical Specifications
| Parameter |
Value |
| Manufacturer |
AMD Xilinx |
| Family |
Spartan-II |
| Part Number |
XC2S200-6FGG466C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 total) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Maximum User I/O |
284 |
| Delay-Locked Loops (DLLs) |
4 |
| Maximum Frequency |
263 MHz |
| Core Voltage |
2.5V |
| Process Technology |
0.18µm CMOS |
| Speed Grade |
-6 |
| Package Type |
456-Ball Fine-Pitch BGA (FGG) |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Status |
Compliant (Pb-Free) |
Package Information and Pinout Details
456-Ball Fine-Pitch BGA Package
The XC2S200-6FGG466C utilizes a 456-ball Fine-Pitch Ball Grid Array (FGG) package designed for high-density PCB applications. This surface-mount package offers excellent thermal performance and signal integrity characteristics essential for high-speed digital designs.
I/O Capabilities
The device provides up to 284 user-configurable I/O pins supporting multiple I/O standards. These programmable I/O blocks accommodate various voltage levels and interface protocols, simplifying system integration with diverse peripheral components. Additionally, four dedicated global clock input pins enable synchronous design implementation across the entire device.
Lead-Free Compliance
The “G” designation in the FGG package code indicates Pb-free (lead-free) packaging, ensuring full compliance with RoHS directives. This environmentally responsible packaging meets modern manufacturing requirements without compromising reliability or performance.
Applications for the XC2S200-6FGG466C
The versatile architecture of the XC2S200-6FGG466C makes it suitable for numerous application domains.
Telecommunications and Networking Equipment
This FPGA excels in implementing communication protocols, data routing functions, and signal processing algorithms. Its substantial logic capacity and high-speed operation support applications including network switches, routers, and base station equipment.
Industrial Automation and Control Systems
For factory automation and process control applications, the XC2S200-6FGG466C delivers reliable real-time performance. Engineers deploy this device in motor controllers, programmable logic controllers (PLCs), and sensor interface systems where deterministic timing and flexible I/O configurations prove essential.
Medical and Scientific Instrumentation
Medical device developers appreciate the XC2S200-6FGG466C for imaging systems, patient monitoring equipment, and diagnostic instruments. Its reconfigurable nature allows field upgrades without hardware modifications—a significant advantage in regulated industries requiring long product lifecycles.
Consumer Electronics and Video Processing
The combination of high-speed operation and substantial memory resources enables implementation of video processing pipelines, display controllers, and multimedia applications. The device handles pixel processing, format conversion, and interface bridging tasks efficiently.
Aerospace and Defense Applications
Mission-critical systems benefit from the XC2S200-6FGG466C’s proven reliability and the ability to implement custom security functions. Applications include radar signal processing, secure communications, and avionics systems requiring reconfigurable hardware platforms.
Why Choose the Spartan-II XC2S200-6FGG466C?
Cost-Effective ASIC Alternative
The XC2S200-6FGG466C offers significant advantages over traditional mask-programmed ASICs. By eliminating expensive mask charges and lengthy fabrication cycles, designers achieve faster time-to-market while maintaining full design flexibility. Furthermore, field-programmable capability enables design corrections and feature additions without hardware replacement.
Proven Reliability
Spartan-II FPGAs benefit from AMD Xilinx’s extensive manufacturing experience and rigorous quality control processes. The mature 0.18µm process technology delivers consistent, reliable performance backed by comprehensive characterization data and proven field history.
Comprehensive Development Support
Designers access powerful development tools through Xilinx ISE Design Suite, which provides synthesis, implementation, and verification capabilities for efficient design workflows. Extensive documentation, reference designs, and application notes accelerate project development and reduce engineering risk.
Long-Term Availability
As an established product family, the Spartan-II series enjoys extended product lifecycle support. This longevity ensures consistent supply for production programs and maintenance requirements spanning many years.
Ordering Information
The complete ordering part number XC2S200-6FGG466C specifies the following configuration:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade (highest performance in commercial temperature range)
- FGG: 456-ball Fine-Pitch BGA package, Pb-free
- 466: Pin count designation
- C: Commercial operating temperature range (0°C to +85°C)
Related Products and Cross-References
Engineers evaluating the XC2S200-6FGG466C may also consider these related Spartan-II variants:
- XC2S200-5FGG456C: Lower speed grade option for less demanding timing requirements
- XC2S150-6FGG456C: Reduced gate count alternative for smaller designs
- XC2S200-6FG256C: Smaller 256-ball BGA package with reduced I/O count
For higher performance or increased logic density, consider upgrading to Spartan-3, Spartan-6, or the latest Spartan-7 FPGA families.
Conclusion
The AMD Xilinx XC2S200-6FGG466C represents a proven, reliable choice for engineers requiring cost-effective programmable logic solutions. Its combination of 200,000 system gates, 5,292 logic cells, flexible memory resources, and comprehensive I/O capabilities addresses diverse application requirements across telecommunications, industrial, medical, and consumer electronics markets.
With Pb-free packaging, commercial temperature range operation, and robust development tool support, the XC2S200-6FGG466C continues serving designers who prioritize reliability, flexibility, and value in their programmable logic implementations.
