The AMD XCZU9CG-L1FFVC900I is a high-performance System on Chip (SoC) from the Zynq UltraScale+ MPSoC family, combining powerful ARM processors with advanced programmable logic. This industrial-grade FPGA delivers exceptional processing capabilities with over 599K logic cells, making it ideal for demanding embedded applications in industrial automation, communications, and edge computing systems.
XCZU9CG-L1FFVC900I Overview
The XCZU9CG-L1FFVC900I integrates a feature-rich 64-bit dual-core ARM® Cortex®-A53 application processor with dual ARM® Cortex®-R5F real-time processors. This heterogeneous processing architecture enables simultaneous high-level application processing and deterministic real-time control within a single chip solution. Built on AMD’s 16nm FinFET UltraScale+ architecture, this device delivers industry-leading performance per watt.
For more options in high-performance programmable logic devices, explore our comprehensive Xilinx FPGA product catalog.
Key Specifications and Features
Processor Subsystem (PS)
| Parameter |
Specification |
| Application Processor |
Dual-core ARM Cortex-A53 MPCore with CoreSight™ |
| Real-Time Processor |
Dual-core ARM Cortex-R5F with CoreSight™ |
| APU Clock Speed |
Up to 1.2 GHz |
| RPU Clock Speed |
Up to 500 MHz |
| L1 Cache |
32KB Instruction / 32KB Data per core |
| L2 Cache |
1MB Shared (APU) |
| Floating Point |
NEON & Single/Double Precision |
Programmable Logic (PL) Resources
| Resource |
Quantity |
| System Logic Cells |
599,550 |
| CLB Flip-Flops |
548,160 |
| Look-Up Tables (LUTs) |
274,080 |
| DSP48E2 Slices |
2,520 |
| Block RAM (36Kb) |
912 Blocks |
| Total Block RAM |
32.1 Mb |
| Distributed RAM |
8.8 Mb |
XCZU9CG-L1FFVC900I Package Information
Physical Specifications
| Parameter |
Value |
| Package Type |
900-FCBGA (Flip-Chip Fine-Pitch BGA) |
| Package Dimensions |
31mm × 31mm |
| Ball Pitch |
1.0mm |
| Ball Count |
900 |
| Mounting Type |
Surface Mount |
Environmental Ratings
| Parameter |
Rating |
| Operating Temperature |
-40°C to +100°C (TJ) |
| Temperature Grade |
Industrial (I) |
| Speed Grade |
-1LI (Low Power Industrial) |
| VCCINT Operating Voltage |
0.85V or 0.72V |
| Moisture Sensitivity Level |
Per J-STD-020 |
Connectivity and I/O Capabilities
High-Speed Interfaces
| Interface |
Specification |
| HP I/O (High-Performance) |
Up to 208 pins |
| HD I/O (High-Density) |
Up to 120 pins |
| HP I/O Voltage Range |
1.0V to 1.8V |
| HD I/O Voltage Range |
1.2V to 3.3V |
| GTH Transceivers |
24 channels |
| GTH Data Rate |
Up to 16.3 Gb/s |
| PS-GTR Transceivers |
4 channels |
| PS-GTR Data Rate |
Up to 6.0 Gb/s |
Integrated Peripheral Interfaces
The XCZU9CG-L1FFVC900I Processing System includes comprehensive peripheral connectivity:
- USB: USB 2.0 and USB 3.0 support
- Ethernet: Gigabit Ethernet MAC
- Storage: SD/SDIO, eMMC, NAND, Quad SPI
- Communication: 2× CAN 2.0B, 2× I²C, 2× SPI, 2× UART
- GPIO: Up to 78 Multiplexed I/O (MIO) pins
- PCIe: PCIe Gen2 support
- SATA: SATA 3.1 interface
- DisplayPort: Video output capability
Memory Interface Support
External Memory Controllers
| Memory Type |
Support |
| DDR4 |
Up to 2400 Mb/s |
| DDR3/DDR3L |
Supported |
| LPDDR4 |
Up to 2133 Mb/s |
| LPDDR3 |
Supported |
| Memory Width |
Up to 64-bit + ECC |
On-Chip Memory Features
The Zynq UltraScale+ architecture provides extensive on-chip memory resources:
- Block RAM: Dual-port 36Kb blocks with built-in FIFO and ECC support
- Distributed RAM: Configurable LUT-based memory
- TCM: Tightly Coupled Memory for real-time processor
- OCM: 256KB On-Chip Memory
CG Device Family Comparison
The XCZU9CG belongs to the cost-optimized CG series within the Zynq UltraScale+ MPSoC family:
| Device |
Logic Cells |
DSP Slices |
Block RAM |
Transceivers |
| XCZU2CG |
103,320 |
240 |
150 |
0 |
| XCZU3CG |
154,350 |
360 |
216 |
0 |
| XCZU4CG |
192,150 |
728 |
128 |
0 |
| XCZU5CG |
256,200 |
1,248 |
144 |
4 GTH |
| XCZU6CG |
331,620 |
1,973 |
312 |
4 GTH |
| XCZU7CG |
417,090 |
1,728 |
312 |
4 GTH |
| XCZU9CG |
599,550 |
2,520 |
912 |
24 GTH |
Part Number Decoder: XCZU9CG-L1FFVC900I
Understanding the AMD part numbering system:
| Segment |
Value |
Meaning |
| XC |
XC |
Commercial Grade |
| ZU9 |
ZU9 |
Zynq UltraScale+ Device Size |
| CG |
CG |
Cost-optimized (Dual ARM Cortex-A53, No GPU) |
| L1 |
-1LI |
Speed Grade -1, Low Power, Industrial |
| FF |
FF |
Flip-Chip Fine-Pitch BGA |
| V |
V |
Lead-Free Package |
| C900 |
C900 |
900-Ball Package Footprint |
| I |
I |
Industrial Temperature Range |
Target Applications
The XCZU9CG-L1FFVC900I is optimized for diverse industrial and commercial applications:
Industrial Automation
- Programmable Logic Controllers (PLC)
- Industrial IoT gateways
- Motor control systems
- Machine vision processing
Communications Infrastructure
- Software-defined networking (SDN)
- Network packet processing
- 5G wireless infrastructure
- Base station controllers
Aerospace and Defense
- Radar signal processing
- Secure communications
- Avionics systems
- Electronic warfare
Medical and Scientific
- Medical imaging equipment
- Laboratory instrumentation
- Data acquisition systems
- Real-time analytics
Automotive
- Advanced Driver Assistance Systems (ADAS)
- In-vehicle infotainment
- Sensor fusion platforms
- Vehicle-to-everything (V2X) communication
Development Tools and Software Support
Vivado Design Suite
AMD provides comprehensive development support through:
- Vivado Design Suite: Industry-standard FPGA development environment
- Vitis Unified Software Platform: Application development and acceleration
- PetaLinux Tools: Embedded Linux development
- Arm Development Studio: Processor software development
Operating System Support
- Linux (PetaLinux, Yocto)
- FreeRTOS
- VxWorks
- Bare-metal applications
Quality and Compliance
Certifications and Standards
| Standard |
Compliance |
| RoHS |
Compliant (Lead-Free) |
| REACH |
Compliant |
| Halogen-Free |
Available |
| Automotive |
AEC-Q100 variants available |
| Quality Management |
ISO 9001:2015 |
Export Classification
| Parameter |
Classification |
| ECCN |
3A001.a.7 |
| USHTS |
8542.39.0001 |
| TARIC |
8542399000 |
Ordering Information
| Part Number |
Description |
| XCZU9CG-L1FFVC900I |
Industrial Grade, -1LI Speed, 900-FCBGA |
| XCZU9CG-1FFVC900I |
Industrial Grade, -1 Speed, 900-FCBGA |
| XCZU9CG-2FFVC900I |
Industrial Grade, -2 Speed, 900-FCBGA |
| XCZU9CG-1FFVC900E |
Extended Grade, -1 Speed, 900-FCBGA |
Related Documents
- DS891: Zynq UltraScale+ MPSoC Data Sheet: Overview
- DS925: Zynq UltraScale+ MPSoC Data Sheet: DC and AC Switching Characteristics
- UG1085: Zynq UltraScale+ MPSoC Technical Reference Manual
- UG585: Zynq UltraScale+ MPSoC Software Developer Guide
Why Choose XCZU9CG-L1FFVC900I?
The AMD XCZU9CG-L1FFVC900I offers an exceptional balance of processing power, programmable logic resources, and power efficiency:
- Heterogeneous Processing: Dual ARM Cortex-A53 + Dual ARM Cortex-R5F architecture enables diverse workload optimization
- Massive Logic Capacity: 599K+ logic cells support complex digital designs
- DSP Performance: 2,520 DSP slices deliver high-throughput signal processing
- Industrial Reliability: Extended temperature range (-40°C to +100°C) ensures reliable operation
- Low Power Options: -1LI variant enables operation at 0.72V VCCINT for reduced power consumption
- Rich Connectivity: Comprehensive peripheral set eliminates external components
- Scalability: Pin-compatible with other Zynq UltraScale+ devices for design migration
