The AMD XCZU9CG-L1FFVB1156I is a high-performance System-on-Chip (SoC) FPGA from the Zynq UltraScale+ MPSoC family. Designed for industrial-grade applications requiring low power consumption and extended temperature operation, this powerful component combines dual-core ARM Cortex-A53 processors with advanced programmable logic in a single 1156-pin FCBGA package. Engineers seeking reliable Xilinx FPGA solutions will find this device ideal for motor control, sensor fusion, and embedded computing applications.
XCZU9CG-L1FFVB1156I Key Features and Benefits
The XCZU9CG-L1FFVB1156I delivers exceptional processing power with 64-bit processor scalability that combines real-time control with hard and soft engines for graphics, video, waveform, and packet processing. This dual-core CG variant is specifically optimized for industrial motor control and sensor fusion applications.
Processing System (PS) Specifications
| Parameter |
Specification |
| Application Processor |
Dual ARM Cortex-A53 (64-bit) |
| Real-Time Processor |
Dual ARM Cortex-R5F |
| APU Clock Speed |
Up to 500 MHz |
| RPU Clock Speed |
Up to 500 MHz |
| On-Chip Memory |
256 KB OCM |
| External Memory |
DDR4, DDR3, DDR3L, LPDDR3, LPDDR4 |
Programmable Logic (PL) Resources
| Resource |
Value |
| System Logic Cells |
599,550 |
| CLB Flip-Flops |
548,160 |
| Look-Up Tables (LUTs) |
274,080 |
| DSP Slices |
2,520 |
| Block RAM |
32.1 Mb |
| Distributed RAM |
8.8 Mb |
| UltraRAM |
Not Available (CG variant) |
XCZU9CG-L1FFVB1156I Technical Specifications
Part Number Breakdown
Understanding the part number helps identify key characteristics:
| Code |
Meaning |
| XCZU9 |
Zynq UltraScale+ MPSoC, Device Size 9 |
| CG |
Dual-core (no GPU), Cost-optimized variant |
| L1 |
Low-power, Speed Grade -1 |
| FFV |
Flip-Chip Fine-pitch BGA |
| B1156 |
1156-ball Package |
| I |
Industrial Temperature Range |
Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCCINT) |
0.85V or 0.72V |
| I/O Voltage (HP) |
1.0V to 1.8V |
| I/O Voltage (HD) |
1.2V to 3.3V |
| Operating Temperature |
-40°C to +100°C (Tj) |
| Process Technology |
20nm FinFET |
Package Information
| Specification |
Value |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Pin Count |
1156 |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
35mm x 35mm |
| RoHS Compliant |
Yes |
High-Speed I/O and Connectivity
The XCZU9CG-L1FFVB1156I offers extensive connectivity options for complex system designs.
I/O Configuration
| I/O Type |
Maximum Available |
| High-Performance (HP) I/O |
208 |
| High-Density (HD) I/O |
120 |
| Total User I/O |
328 |
| MIO Pins |
78 |
| GTH Transceivers |
24 |
| GTH Data Rate |
Up to 16.3 Gb/s |
Integrated Peripherals
The Processing System includes a rich set of integrated peripherals:
- High-Speed Interfaces: PCIe Gen2 x4, 2x USB 3.0, SATA 3.1, DisplayPort
- Networking: 4x Tri-mode Gigabit Ethernet MAC
- General I/O: 2x USB 2.0, 2x SD/SDIO, 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI
- GPIO: 4x 32-bit GPIO banks
Target Applications for XCZU9CG-L1FFVB1156I
This industrial-grade MPSoC excels in demanding applications:
Industrial Automation
- Multi-axis motor control systems
- Industrial robotics
- PLC and industrial controllers
- Factory automation equipment
Embedded Computing
- Sensor fusion platforms
- Edge computing devices
- Machine vision systems
- Real-time data processing
Communications
- Software-defined radio (SDR)
- Wireless baseband processing
- Network packet processing
- Protocol conversion gateways
Aerospace and Defense
- Radar signal processing
- Electronic warfare systems
- Avionics computing
- Secure communications
XCZU9CG vs XCZU9EG: Which One to Choose?
| Feature |
XCZU9CG-L1FFVB1156I |
XCZU9EG-L1FFVB1156I |
| CPU Cores |
Dual Cortex-A53 |
Quad Cortex-A53 |
| GPU |
Not Available |
Mali-400 MP2 |
| Logic Cells |
599,550 |
599,550 |
| DSP Slices |
2,520 |
2,520 |
| Target Use |
Industrial/Embedded |
Graphics/Video |
| Power |
Lower |
Higher |
| Cost |
More Economical |
Premium |
Choose the XCZU9CG variant when your application does not require GPU acceleration and you want to optimize for power consumption and cost.
Development Tools and Software Support
Vivado Design Suite
AMD’s Vivado Design Suite provides comprehensive development tools including:
- IP Integrator for system-level design
- High-Level Synthesis (HLS)
- Logic simulation and analysis
- Power analysis and optimization
Vitis Platform
The Vitis unified software platform enables:
- Embedded software development
- AI/ML inference acceleration
- Hardware acceleration workflows
- Linux and RTOS support
Operating System Support
- PetaLinux (Yocto-based embedded Linux)
- FreeRTOS for real-time applications
- VxWorks support
- Bare-metal development
Ordering Information
| Part Number |
Description |
| XCZU9CG-L1FFVB1156I |
Low-power, Industrial temp, 1156-pin FCBGA |
| XCZU9CG-1FFVB1156I |
Standard, Industrial temp, 1156-pin FCBGA |
| XCZU9CG-2FFVB1156I |
Speed Grade -2, Industrial temp, 1156-pin FCBGA |
| XCZU9CG-L1FFVC900I |
Low-power, Industrial temp, 900-pin FCBGA |
Why Choose XCZU9CG-L1FFVB1156I for Your Design?
- Industrial Reliability: Extended temperature range (-40°C to +100°C) ensures operation in harsh environments
- Low Power Operation: L-variant provides reduced static power at 0.72V VCCINT option
- Processing Power: Dual ARM Cortex-A53 + Dual Cortex-R5F delivers heterogeneous computing capability
- Programmable Logic: 600K logic cells and 2,520 DSP slices enable complex algorithm implementation
- High-Speed Connectivity: 24 GTH transceivers at 16.3 Gb/s support demanding I/O requirements
- Scalable Platform: Footprint-compatible with other Zynq UltraScale+ devices for design migration
Compliance and Certifications
| Standard |
Status |
| RoHS |
Compliant |
| REACH |
Compliant |
| ECCN |
5A002.A.4 |
| HTSUS |
8542390001 |
| TARIC |
8542399000 |
Related Products
- XCZU9EG-L1FFVB1156I (Quad-core with GPU)
- XCZU7EV-L1FFVB1156I (Video codec variant)
- XCZU11EG-L1FFVC1760I (Higher capacity)
- XCZU15EG-L1FFVB1156I (Maximum PL resources)
