The AMD XCZU9CG-2FFVC900I is a cutting-edge System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC CG family. This advanced programmable logic device combines the power of dual ARM Cortex-A53 application processors with dual ARM Cortex-R5 real-time processors, integrated with over 599,000 logic cells of programmable FPGA fabric.
Designed for demanding industrial, automotive, and embedded applications, this Xilinx FPGA delivers exceptional processing performance with hardware-level flexibility for next-generation embedded systems.
Key Features of XCZU9CG-2FFVC900I Zynq UltraScale+ MPSoC
Powerful Multi-Core Processing Architecture
- Dual ARM Cortex-A53 MPCore application processors running at 1.3GHz
- Dual ARM Cortex-R5F real-time processors operating at 533MHz
- 64-bit processor scalability with advanced AArch64 architecture
- CoreSight debug and trace technology for enhanced development
High-Capacity Programmable Logic Resources
- 599K+ logic cells for complex FPGA implementations
- 34,260 Configurable Logic Blocks (CLBs)
- 274,080 CLB flip-flops for sequential logic
- 912 DSP slices for high-performance signal processing
- 2,520 Kb of Block RAM for on-chip data storage
XCZU9CG-2FFVC900I Technical Specifications
General Specifications
| Parameter |
Value |
| Part Number |
XCZU9CG-2FFVC900I |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Zynq UltraScale+ MPSoC CG |
| Device Type |
System-on-Chip (SoC) FPGA |
| Process Technology |
20nm FinFET+ |
| Speed Grade |
-2 (High Performance) |
| Temperature Grade |
Industrial (I): -40°C to +100°C |
Processing System Specifications
| Component |
Specification |
| Application Processor Unit (APU) |
Dual ARM Cortex-A53 @ 1.3GHz |
| Real-Time Processor Unit (RPU) |
Dual ARM Cortex-R5F @ 533MHz |
| On-Chip Memory (OCM) |
256KB |
| Core Voltage (VCCINT) |
0.85V |
Programmable Logic (PL) Resources
| Resource |
Quantity |
| System Logic Cells |
599,550+ |
| Configurable Logic Blocks (CLBs) |
34,260 |
| CLB Flip-Flops |
274,080 |
| CLB LUTs |
18,000 |
| DSP Slices |
912 |
| Block RAM (36Kb each) |
2,520 Kb Total |
| GTH Transceivers |
24 |
I/O and Connectivity Specifications
| Interface |
Details |
| High-Performance (HP) I/O |
208 pins |
| High-Density (HD) I/O |
120 pins |
| I/O Banks |
4 HP + 5 HD Banks |
| Peripheral Interfaces |
USB 3.0/2.0, Gigabit Ethernet, SATA 3.1 |
| Communication Protocols |
CANbus, I2C, SPI, UART, GPIO |
| Memory Interfaces |
DDR4, LPDDR4, DDR3, DDR3L |
| Storage Interfaces |
eMMC, SD/SDIO, QSPI, NAND |
Package Information
| Attribute |
Value |
| Package Type |
FFVC900 (Flip-Chip Fine-Pitch BGA) |
| Pin Count |
900-FCBGA |
| Package Dimensions |
31mm x 31mm |
| Ball Pitch |
1.0mm |
| RoHS Compliance |
Yes (Lead-Free) |
Applications for AMD XCZU9CG-2FFVC900I
The versatile architecture of the XCZU9CG-2FFVC900I makes it ideal for a wide range of high-performance embedded applications:
Industrial Automation and Control
- Precision motor control and servo drives
- Industrial robotics and machine vision
- PLC and automation controllers
Communications Infrastructure
- 5G wireless base stations
- Network packet processing
- Software-defined networking (SDN)
Edge Computing and AI/ML
- AI inference acceleration at the edge
- Real-time video analytics
- Sensor fusion and IoT gateways
Medical and Healthcare
- Medical imaging systems
- Diagnostic equipment
- Patient monitoring devices
Automotive and Aerospace
- ADAS (Advanced Driver Assistance Systems)
- Avionics and flight control systems
- Radar and LiDAR processing
Development Tools and Software Support
AMD provides comprehensive development support for the XCZU9CG-2FFVC900I through:
- Vivado Design Suite: Industry-leading FPGA development environment
- Vitis Unified Software Platform: Comprehensive embedded and acceleration development
- PetaLinux Tools: Linux development for Zynq UltraScale+ devices
- Vitis AI: AI inference development for edge deployment
Why Choose the XCZU9CG-2FFVC900I for Your Design?
The AMD XCZU9CG-2FFVC900I represents the optimal balance of processing power, programmable logic resources, and industrial-grade reliability. With its combination of high-performance ARM processors and extensive FPGA fabric, this Zynq UltraScale+ MPSoC enables designers to implement complete systems on a single chip, reducing BOM cost, power consumption, and PCB complexity.
The industrial temperature rating (-40°C to +100°C) ensures reliable operation in demanding environments, while the -2 speed grade delivers the high performance required for compute-intensive applications. The 900-FCBGA package provides a compact footprint suitable for space-constrained designs without compromising on I/O capability.
Ordering Information
| Order Code |
Speed Grade |
Temperature |
| XCZU9CG-2FFVC900I |
-2 |
Industrial (I) |
| XCZU9CG-1FFVC900I |
-1 |
Industrial (I) |
| XCZU9CG-2FFVC900E |
-2 |
Extended (E) |
Conclusion
The AMD XCZU9CG-2FFVC900I Zynq UltraScale+ MPSoC is an exceptional choice for engineers seeking a powerful, flexible, and reliable SoC FPGA solution. With its heterogeneous processing architecture combining ARM Cortex-A53 and Cortex-R5 processors with extensive programmable logic, this device enables the creation of highly integrated, high-performance embedded systems across industrial, communications, automotive, and edge AI applications.
