The AMD XCZU9CG-2FFVB1156E is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC family, combining powerful dual-core ARM Cortex-A53 processing with industry-leading programmable logic in a single device. This advanced Xilinx FPGA delivers exceptional computational performance for demanding applications including industrial automation, motor control, sensor fusion, and embedded computing systems.
XCZU9CG-2FFVB1156E Key Features and Benefits
The XCZU9CG-2FFVB1156E integrates a feature-rich 64-bit processing system with UltraScale+ programmable logic architecture, offering unparalleled flexibility for complex embedded designs. Engineers benefit from the combination of software programmability and hardware acceleration within a single, power-efficient package.
Processing System Architecture
| Component |
Specification |
| Application Processing Unit (APU) |
Dual-core ARM Cortex-A53 MPCore with CoreSight |
| APU Clock Speed |
Up to 1.3 GHz (-2 speed grade) |
| Real-Time Processing Unit (RPU) |
Dual-core ARM Cortex-R5F with CoreSight |
| RPU Clock Speed |
Up to 533 MHz |
| Architecture |
64-bit ARMv8-A |
| L1 Cache |
32KB I-cache + 32KB D-cache per core |
| L2 Cache |
1MB shared |
Programmable Logic Resources
| Resource |
Quantity |
| System Logic Cells |
599,550 |
| CLB Flip-Flops |
274,080 |
| CLB LUTs |
274,080 |
| Distributed RAM (Kb) |
5,040 |
| Block RAM (36Kb) |
912 |
| Total Block RAM (Mb) |
32.1 |
| DSP Slices (DSP48E2) |
2,520 |
XCZU9CG-2FFVB1156E Technical Specifications
High-Speed Connectivity
| Interface |
Specification |
| GTH Transceivers |
24 channels |
| GTH Line Rate |
Up to 16.3 Gb/s |
| PS-GTR Transceivers |
4 channels (USB 3.0, SATA, DisplayPort, PCIe) |
| PCIe Support |
Gen2 x4 |
I/O Capabilities
| I/O Type |
Maximum Pins |
| High-Performance (HP) I/O |
208 |
| High-Density (HD) I/O |
120 |
| Multiplexed I/O (MIO) |
78 |
| Total Maximum User I/O |
328 |
| HP I/O Voltage Range |
1.0V to 1.8V |
| HD I/O Voltage Range |
1.2V to 3.3V |
Memory Interfaces
| Feature |
Specification |
| DDR4 Support |
Up to 2,400 Mb/s |
| DDR3/DDR3L Support |
Up to 2,133 Mb/s |
| LPDDR4 Support |
Up to 2,133 Mb/s |
| LPDDR3 Support |
Up to 2,133 Mb/s |
| Memory Interface Width |
Up to 64-bit with ECC |
XCZU9CG-2FFVB1156E Package Information
Physical Specifications
| Parameter |
Value |
| Package Type |
FFVB1156 (Flip-Chip Fine-Pitch BGA) |
| Package Dimensions |
35mm × 35mm |
| Ball Pitch |
1.0mm |
| Ball Count |
1156 |
| Mounting Type |
Surface Mount |
| Device Technology |
16nm FinFET+ |
Ordering Information
| Part Number |
Temperature Grade |
Description |
| XCZU9CG-2FFVB1156E |
Commercial (0°C to +100°C) |
Standard commercial grade |
| XCZU9CG-2FFVB1156I |
Industrial (-40°C to +100°C) |
Extended temperature range |
XCZU9CG-2FFVB1156E Peripheral Interfaces
Integrated Peripherals
| Peripheral |
Quantity/Capability |
| USB 3.0 |
2 ports |
| USB 2.0 |
2 ports |
| Gigabit Ethernet |
4 ports with IEEE 1588 support |
| SD/eMMC |
2 controllers |
| UART |
2 ports |
| CAN |
2.0B × 2 |
| I2C |
2 ports |
| SPI |
2 ports |
| GPIO |
Up to 78 MIO + EMIO |
| SATA |
3.1 support via PS-GTR |
| DisplayPort |
1.2a support via PS-GTR |
Applications for AMD XCZU9CG-2FFVB1156E MPSoC
The XCZU9CG-2FFVB1156E is optimized for cost-sensitive, power-efficient applications requiring dual-core processing capabilities. As a CG-series device, it delivers essential processing and programmable logic without the quad-core APU or GPU found in EG variants.
Industrial Applications
- Motor Control Systems: Precision multi-axis servo control with real-time feedback processing
- Sensor Fusion: Multi-sensor data aggregation for robotics and autonomous systems
- Industrial IoT Gateways: Protocol translation and edge computing
- Machine Vision: Real-time image preprocessing and analysis
- Programmable Logic Controllers (PLC): Next-generation flexible automation platforms
Communication Systems
- 5G Small Cells: Baseband processing and fronthaul interfaces
- Software-Defined Radio: Flexible RF processing platforms
- Network Acceleration: Packet processing and protocol offload
- Video Encoding/Decoding: Real-time video processing pipelines
Embedded Computing
- Edge AI Acceleration: Neural network inference with custom accelerators
- Medical Devices: Real-time patient monitoring and diagnostic equipment
- Test and Measurement: High-speed data acquisition systems
- Aerospace and Defense: Radar signal processing and electronic warfare
XCZU9CG vs XCZU9EG Comparison
| Feature |
XCZU9CG-2FFVB1156E |
XCZU9EG-2FFVB1156E |
| APU Cores |
Dual-core Cortex-A53 |
Quad-core Cortex-A53 |
| GPU |
Not included |
ARM Mali-400 MP2 |
| Logic Cells |
599,550 |
599,550 |
| DSP Slices |
2,520 |
2,520 |
| Block RAM |
912 (36Kb) |
912 (36Kb) |
| GTH Transceivers |
24 |
24 |
| Optimal Use Case |
Cost-optimized industrial |
Graphics-intensive applications |
Power and Thermal Specifications
| Parameter |
Value |
| Core Voltage (VCCINT) |
0.85V |
| Auxiliary Voltage (VCCAUX) |
1.8V |
| I/O Voltage Range |
1.0V to 3.3V |
| Typical Static Power |
Device and configuration dependent |
| Junction Temperature (Commercial) |
0°C to +100°C |
| Junction Temperature (Industrial) |
-40°C to +100°C |
Development Tools and Software Support
AMD Vivado Design Suite
The XCZU9CG-2FFVB1156E is fully supported by AMD Vivado Design Suite, providing integrated design, synthesis, implementation, and programming capabilities.
Software Development
| Tool |
Purpose |
| Vivado Design Suite |
FPGA/SoC design and implementation |
| Vitis Unified Software Platform |
Application development and acceleration |
| PetaLinux Tools |
Embedded Linux development |
| Vitis AI |
Machine learning inference optimization |
Compliance and Certifications
| Standard |
Status |
| RoHS |
Compliant |
| REACH |
Compliant |
| ECCN |
5A002.A.4 |
| USHTS |
8542390001 |
| TARIC |
8542399000 |
Why Choose the AMD XCZU9CG-2FFVB1156E?
The XCZU9CG-2FFVB1156E delivers an optimal balance of processing power, programmable logic resources, and cost efficiency for embedded applications. With dual ARM Cortex-A53 cores, extensive DSP capabilities, and high-speed serial connectivity, this MPSoC accelerates time-to-market while providing the flexibility to adapt to evolving requirements.
Key advantages include:
- Heterogeneous Computing: Combine software flexibility with hardware acceleration
- Scalable Architecture: Pin-compatible with other Zynq UltraScale+ devices for design reuse
- Power Efficiency: 16nm FinFET+ technology reduces power consumption
- Comprehensive Security: Built-in secure boot, AES-GCM encryption, and RSA authentication
- Long-Term Availability: AMD commitment to extended product lifecycles
