The AMD XCZU9CG-1FFVC900I is an advanced System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC CG family. This industrial-grade device combines powerful dual ARM Cortex-A53 and dual ARM Cortex-R5 processors with 599K+ programmable logic cells, delivering exceptional performance for embedded systems, industrial automation, and high-speed data processing applications. Built on 20nm technology, the XCZU9CG-1FFVC900I offers a perfect balance of processing power, flexibility, and energy efficiency for demanding applications.
XCZU9CG-1FFVC900I Key Specifications Overview
| Parameter |
Value |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCZU9CG-1FFVC900I |
| Series |
Zynq® UltraScale+™ MPSoC CG |
| Product Category |
Embedded System-on-Chip (SoC) |
| Product Status |
Active |
| RoHS Status |
ROHS3 Compliant |
Processor Architecture and Performance
The XCZU9CG-1FFVC900I features a heterogeneous multi-core processing architecture designed for maximum flexibility and real-time performance.
Application Processing Unit (APU)
| Feature |
Specification |
| Core Type |
Dual ARM® Cortex®-A53 MPCore™ |
| Clock Speed |
Up to 1.2GHz |
| Architecture |
64-bit ARMv8-A |
| Debug Support |
CoreSight™ Technology |
| Extensions |
NEON, Single/Double Precision Floating Point |
| L1 Cache |
32KB Instruction / 32KB Data |
| L2 Cache |
1MB Shared |
Real-Time Processing Unit (RPU)
| Feature |
Specification |
| Core Type |
Dual ARM® Cortex™-R5F |
| Debug Support |
CoreSight™ Technology |
| Floating Point |
Single/Double Precision |
| L1 Cache |
32KB Instruction / 32KB Data |
| TCM |
Tightly Coupled Memory |
FPGA Programmable Logic Resources
The XCZU9CG-1FFVC900I provides extensive programmable logic resources based on the UltraScale architecture.
| Resource |
Quantity |
| System Logic Cells |
599,550 (599K+) |
| CLB Flip-Flops |
548,160 |
| Technology Node |
20nm |
| Operating Voltage (VCCINT) |
0.85V |
Memory and Storage Capabilities
| Memory Type |
Specification |
| On-Chip RAM |
256KB |
| Block RAM |
Integrated UltraRAM |
| Distributed RAM |
Available |
| External Memory Support |
DDR4/DDR3/DDR3L/LPDDR4 |
Connectivity and Interface Options
The XCZU9CG-1FFVC900I offers comprehensive connectivity options for diverse industrial and embedded applications.
General Connectivity
| Interface |
Support |
| UART/USART |
Yes |
| I²C |
Yes |
| SPI |
Yes |
| CANbus |
Yes |
| GPIO |
32-bit |
| Ethernet |
Yes |
| MMC/SD/SDIO |
Yes |
| EBI/EMI |
Yes |
High-Speed Connectivity
| Interface |
Specification |
| USB |
USB 2.0, USB 3.0 OTG |
| PCIe |
Gen1/Gen2 |
| Serial ATA |
SATA 3.1 |
| DisplayPort |
DisplayPort 1.2a |
| SGMII |
Supported |
| PS-GTR Transceivers |
4 Channels (up to 6.0Gb/s) |
Package and Mechanical Specifications
| Parameter |
Specification |
| Package Type |
900-FCBGA (Flip-Chip BGA) |
| Package Designation |
FFVC900 |
| Package Size |
31mm x 31mm |
| Ball Pitch |
1.0mm |
| Pin Count |
900 Pins |
| Packaging Format |
Tray |
Operating Conditions and Temperature Rating
| Parameter |
Value |
| Temperature Grade |
Industrial (I) |
| Operating Temperature |
-40°C to +100°C (TJ) |
| Speed Grade |
-1 |
| VCCINT Voltage |
0.85V (nominal) |
The industrial temperature rating makes the XCZU9CG-1FFVC900I suitable for harsh operating environments including industrial automation, outdoor deployments, and automotive-adjacent applications.
I/O Resources and SelectIO Capabilities
| I/O Type |
Description |
| HP I/O |
High-Performance I/O (1.0V to 1.8V) |
| HD I/O |
High-Density I/O (1.2V to 3.3V) |
| PS I/O |
Up to 214 Processing System I/O |
| MIO |
78 Multi-Use I/O Pins |
Speed Grade Information
The XCZU9CG is available in multiple speed grades for different performance requirements.
| Speed Grade |
Performance Level |
VCCINT |
| -3E |
Highest Performance |
0.90V |
| -2E/-2I |
High Performance |
0.85V |
| -1E/-1I |
Standard Performance |
0.85V |
| -2LE/-1LI |
Low Power |
0.85V or 0.72V |
The “-1I” designation in XCZU9CG-1FFVC900I indicates industrial temperature range with standard speed grade performance.
Target Applications
The XCZU9CG-1FFVC900I is optimized for applications requiring high processing power, real-time response, and hardware flexibility.
Industrial Applications
- Industrial automation and control systems
- Motor drives and servo controllers
- Machine vision and image processing
- Programmable logic controllers (PLCs)
- Industrial IoT gateways
Communications Infrastructure
- Software-defined radio (SDR)
- 5G wireless infrastructure
- Network packet processing
- Protocol conversion and bridging
- Edge computing nodes
Embedded Computing
- High-performance embedded systems
- Medical imaging equipment
- Test and measurement instruments
- Aerospace and defense systems
- Video processing and encoding
Development Tools and Software Support
Vivado Design Suite
AMD provides comprehensive development support through the Vivado Design Suite, offering synthesis, implementation, and debugging capabilities for the XCZU9CG-1FFVC900I.
Operating System Support
| OS Type |
Support Level |
| Linux |
Full Support (PetaLinux) |
| FreeRTOS |
Supported |
| Bare Metal |
Supported |
| Custom RTOS |
Supported |
Ordering Information
| Detail |
Information |
| Full Part Number |
XCZU9CG-1FFVC900I |
| Manufacturer |
AMD (formerly Xilinx) |
| Lead Time |
Approximately 35 weeks |
| Minimum Order |
Contact distributor |
Related Products and Alternatives
For engineers seeking Xilinx FPGA solutions, the Zynq UltraScale+ family offers multiple options across different logic densities and feature sets.
Footprint Compatible Devices
| Part Number |
Logic Cells |
Key Difference |
| XCZU6CG-1FFVC900I |
469K+ |
Lower logic density |
| XCZU9EG-1FFVC900I |
599K+ |
EG variant with GPU |
| XCZU15EG-1FFVC900I |
747K+ |
Higher logic density |
Part Number Decoder: XCZU9CG-1FFVC900I
Understanding the AMD/Xilinx part numbering convention:
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU |
Zynq UltraScale+ |
| 9 |
Device Size (9 = 599K Logic Cells) |
| CG |
CG Variant (Dual-core A53, no GPU) |
| -1 |
Speed Grade (-1 Standard) |
| FF |
Package Type (Flip-Chip Fine-pitch BGA) |
| V |
Lead-Free |
| C900 |
Package Pin Count (900 pins) |
| I |
Temperature Grade (Industrial: -40°C to +100°C) |
Why Choose the XCZU9CG-1FFVC900I?
The XCZU9CG-1FFVC900I delivers an exceptional combination of ARM processing power and FPGA flexibility in a single chip solution. Key advantages include heterogeneous computing capability with dual Cortex-A53 and dual Cortex-R5 processors working alongside 599K+ logic cells. The industrial temperature rating ensures reliable operation in demanding environments, while the comprehensive connectivity options including USB 3.0, PCIe Gen2, and Gigabit Ethernet enable seamless system integration.
The 20nm UltraScale architecture provides improved power efficiency compared to previous generations, making the XCZU9CG-1FFVC900I an ideal choice for power-conscious designs. With active production status and ROHS3 compliance, this device offers long-term availability and environmental compliance for new product developments.
Technical Documentation
For complete technical specifications, refer to the official AMD documentation:
- DS891: Zynq UltraScale+ MPSoC Data Sheet Overview
- DS925: Zynq UltraScale+ MPSoC DC and AC Switching Characteristics
- UG1085: Zynq UltraScale+ MPSoC Technical Reference Manual
- UG1075: Zynq UltraScale+ MPSoC Packaging and Pinouts
