The AMD XCZU9CG-1FFVB1156I is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC CG family. This industrial-grade FPGA combines powerful ARM processing cores with advanced programmable logic, making it an ideal solution for embedded systems, industrial automation, motor control, and IoT applications.
Key Features of the XCZU9CG-1FFVB1156I Zynq UltraScale+ MPSoC
The XCZU9CG-1FFVB1156I integrates a feature-rich processing system with flexible programmable logic on a single chip. Built on 20nm process technology, this device delivers exceptional performance while maintaining low power consumption for demanding industrial environments.
Dual-Core ARM Cortex-A53 Application Processor
The processing system features a 64-bit dual-core ARM Cortex-A53 application processor running at up to 1.2GHz. This high-performance processor supports Linux and other standard operating systems, enabling software developers to leverage familiar development tools and extensive software ecosystems.
Real-Time ARM Cortex-R5F Processor
For real-time control applications, the XCZU9CG-1FFVB1156I includes a dual-core ARM Cortex-R5F processor operating at up to 500MHz. This real-time processor handles time-critical tasks with deterministic performance, essential for industrial motor control and sensor fusion applications.
XCZU9CG-1FFVB1156I Technical Specifications
| Parameter |
Specification |
| Part Number |
XCZU9CG-1FFVB1156I |
| Manufacturer |
AMD (Xilinx) |
| Family |
Zynq UltraScale+ MPSoC CG |
| System Logic Cells |
599,550 |
| CLB Flip-Flops |
548,160 |
| CLB LUTs |
274,080 |
| Block RAM |
32.1 Mb |
| DSP Slices |
2,520 |
| Process Technology |
20nm |
| Core Voltage (VCCINT) |
0.85V |
| Speed Grade |
-1 (Industrial) |
Package and Physical Specifications
| Parameter |
Specification |
| Package Type |
1156-FCBGA (Flip-Chip Ball Grid Array) |
| Package Dimensions |
35mm x 35mm |
| Ball Pitch |
1.0mm |
| Pin Count |
1156 |
| Moisture Sensitivity Level |
MSL-4 (72 hours) |
| RoHS Compliance |
RoHS3 Compliant |
| Lead-Free Status |
Lead-Free |
Operating Conditions and Temperature Range
| Parameter |
Value |
| Operating Temperature |
-40°C to +100°C |
| Temperature Grade |
Industrial (I) |
| Storage Temperature |
-65°C to +150°C |
| Junction Temperature (Tj) |
100°C Maximum |
High-Speed Connectivity and I/O Interfaces
The XCZU9CG-1FFVB1156I provides extensive connectivity options for industrial and embedded applications:
Processing System Interfaces
| Interface Type |
Description |
| USB |
USB 3.0/2.0 OTG with DRD support |
| Ethernet |
Gigabit Ethernet MAC with IEEE 1588 |
| PCIe |
PCI Express Gen2 x4 |
| SATA |
SATA 3.1 (6Gb/s) |
| SD/eMMC |
SD 3.0/eMMC 4.51 |
| CAN |
2x CAN 2.0B controllers |
| SPI |
2x SPI controllers |
| I2C |
2x I2C controllers |
| UART |
2x UART controllers |
| GPIO |
Up to 78 MIO pins |
Programmable Logic I/O
| I/O Type |
Specification |
| High-Performance (HP) I/O |
Up to 208 pins |
| High-Density (HD) I/O |
Up to 120 pins |
| HP I/O Voltage |
1.0V to 1.8V |
| HD I/O Voltage |
1.2V to 3.3V |
| GTH Transceivers |
Up to 4 channels |
| Transceiver Speed |
Up to 12.5 Gb/s |
Memory Resources and On-Chip Storage
| Memory Type |
Capacity |
| On-Chip RAM (OCM) |
256KB |
| Block RAM |
32.1 Mb (912 blocks) |
| Distributed RAM |
8.8 Mb |
| DDR4 Support |
Up to 2400 MT/s |
| LPDDR4 Support |
Up to 2133 MT/s |
Target Applications for XCZU9CG-1FFVB1156I
The Zynq UltraScale+ MPSoC CG devices like the XCZU9CG-1FFVB1156I are optimized for applications requiring both high-performance processing and real-time control capabilities:
Industrial Automation
- Industrial motor drives and servo controllers
- Programmable logic controllers (PLCs)
- Industrial robots and CNC machines
- Factory automation systems
Embedded Vision and Sensor Fusion
- Multi-sensor data fusion systems
- Industrial inspection systems
- Machine vision applications
- LiDAR and radar processing
Communications Infrastructure
- Software-defined networking (SDN)
- Network function virtualization (NFV)
- 5G small cell base stations
- Industrial Ethernet gateways
Test and Measurement
- High-speed data acquisition systems
- Protocol analyzers
- Automated test equipment (ATE)
- Oscilloscopes and signal analyzers
Development Tools and Software Support
AMD provides comprehensive development support for the XCZU9CG-1FFVB1156I through the Vivado Design Suite. This integrated development environment includes synthesis, implementation, and debugging tools optimized for Zynq UltraScale+ devices.
Software Development
| Tool/Framework |
Description |
| Vivado Design Suite |
Complete FPGA development environment |
| Vitis Platform |
Unified software development platform |
| PetaLinux |
Embedded Linux distribution |
| FreeRTOS |
Real-time operating system support |
| Bare-metal |
Standalone application development |
Part Number Decoder: XCZU9CG-1FFVB1156I
Understanding the AMD/Xilinx part number structure helps identify device specifications:
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU9 |
Zynq UltraScale+ Device Size (9) |
| CG |
CG Variant (Dual-core A53, no video codec) |
| -1 |
Speed Grade (-1, Standard) |
| FF |
Flip-Chip Package |
| VB |
Package Ball Count/Type |
| 1156 |
Total Ball Count |
| I |
Industrial Temperature (-40°C to +100°C) |
Why Choose the AMD XCZU9CG-1FFVB1156I?
The XCZU9CG-1FFVB1156I offers several advantages for industrial and embedded system designers:
Heterogeneous Processing: Combines application-class and real-time processors with programmable logic for flexible system partitioning.
Industrial Temperature Rating: Operates reliably across the full industrial temperature range from -40°C to +100°C.
Scalable Performance: The -1 speed grade provides excellent performance-per-watt for thermally constrained applications.
Rich Connectivity: Integrated high-speed interfaces including USB 3.0, PCIe, Gigabit Ethernet, and SATA eliminate external components.
Long-Term Availability: AMD’s commitment to industrial products ensures long product lifecycles for embedded designs.
Where to Buy AMD XCZU9CG-1FFVB1156I
For more information about Xilinx Zynq UltraScale+ MPSoC products and to explore our complete selection of programmable logic devices, visit our Xilinx FPGA catalog page.
Related Zynq UltraScale+ MPSoC Devices
| Part Number |
Logic Cells |
Processor |
Temperature |
| XCZU9CG-1FFVB1156E |
599,550 |
Dual A53 + Dual R5F |
Extended |
| XCZU9CG-2FFVB1156I |
599,550 |
Dual A53 + Dual R5F |
Industrial |
| XCZU9EG-1FFVB1156I |
599,550 |
Quad A53 + Dual R5F |
Industrial |
| XCZU6CG-1FFVB1156I |
341,280 |
Dual A53 + Dual R5F |
Industrial |
| XCZU15EG-1FFVB1156I |
746,550 |
Quad A53 + Dual R5F |
Industrial |
Frequently Asked Questions
What is the difference between XCZU9CG and XCZU9EG?
The XCZU9CG features a dual-core ARM Cortex-A53 processor, while the XCZU9EG includes a quad-core ARM Cortex-A53. Both share identical programmable logic resources. The CG variant is cost-optimized for applications that don’t require quad-core processing.
What temperature range does the XCZU9CG-1FFVB1156I support?
The “I” suffix indicates industrial temperature grade, supporting operation from -40°C to +100°C junction temperature. This makes it suitable for harsh industrial environments.
What development tools are required for the XCZU9CG-1FFVB1156I?
AMD Vivado Design Suite is the primary development tool for programmable logic design. For software development, the Vitis unified platform and PetaLinux tools provide a complete embedded development environment.
Is the XCZU9CG-1FFVB1156I footprint compatible with other devices?
Yes, devices in the FFVB1156 package share footprint compatibility, allowing designers to scale up or down within the Zynq UltraScale+ family without PCB redesign.
