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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU9CG-1FFVB1156E: Zynq UltraScale+ MPSoC FPGA with 599K Logic Cells

Product Details

The AMD XCZU9CG-1FFVB1156E is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC family. This advanced integrated circuit combines a powerful dual-core ARM Cortex-A53 processor with programmable FPGA logic, making it an ideal solution for industrial automation, embedded vision, and edge computing applications.

Built on 16nm FinFET technology, the XCZU9CG-1FFVB1156E delivers exceptional processing power with 599,550 system logic cells and a maximum PL frequency of 500MHz. Engineers and system designers choose this device for applications requiring real-time processing, flexible I/O configurations, and high-speed connectivity.


XCZU9CG-1FFVB1156E Key Features and Benefits

The Zynq UltraScale+ XCZU9CG-1FFVB1156E offers a unique combination of processing power and programmable logic resources. The heterogeneous architecture enables hardware acceleration while maintaining software flexibility, reducing development time and system complexity.

Dual ARM Cortex-A53 Processing System

The processing system integrates a dual-core 64-bit ARM Cortex-A53 application processing unit (APU) running at up to 1.2GHz. This powerful processor supports Linux and other high-level operating systems, enabling sophisticated application development. The dual-core ARM Cortex-R5F real-time processing unit (RPU) handles time-critical tasks with deterministic performance.

High-Capacity Programmable Logic

With 274,080 look-up tables (LUTs) and 2,520 DSP slices featuring 27×18 multipliers, the XCZU9CG-1FFVB1156E excels in signal processing, machine learning inference, and custom accelerator implementations. The 912 block RAMs (36Kb each) provide ample on-chip memory for data buffering and storage.


Technical Specifications Table

Parameter Specification
Manufacturer Part Number XCZU9CG-1FFVB1156E
Manufacturer AMD (formerly Xilinx)
Product Family Zynq UltraScale+ MPSoC
Device Series CG (Cost-Optimized)
System Logic Cells 599,550
Configurable Logic Blocks (CLBs) 34,260
Look-Up Tables (LUTs) 274,080
Flip-Flops 548,160
DSP Slices 2,520
Block RAM (36Kb) 912
Total Block RAM 32.1 Mb
Process Technology 16nm FinFET
Core Voltage (VCCINT) 0.85V

Processor and Memory Specifications

Parameter Specification
Application Processing Unit (APU) Dual-core ARM Cortex-A53 (64-bit)
APU Maximum Frequency 1.2 GHz
Real-Time Processing Unit (RPU) Dual-core ARM Cortex-R5F
L1 Cache (APU) 32KB Instruction / 32KB Data per core
L2 Cache (APU) 1 MB shared
On-Chip Memory 256 KB with ECC
External Memory Support DDR4, DDR3, DDR3L, LPDDR4, LPDDR3
PL Maximum Frequency 500 MHz

I/O and Connectivity Features

Parameter Specification
Package Type 1156-FCBGA (Flip-Chip BGA)
Package Dimensions 35mm × 35mm
Ball Pitch 1.0 mm
High-Performance I/O (HP) 208
High-Density I/O (HD) 120
Total User I/O 328
GTH Transceivers 24
GTH Maximum Data Rate 16.3 Gb/s
Multiplexed I/O (MIO) 78 pins
HP I/O Voltage Range 1.0V to 1.8V
HD I/O Voltage Range 1.2V to 3.3V

Operating Conditions and Environmental Specifications

Parameter Specification
Speed Grade -1 (Standard)
Temperature Grade E (Extended)
Operating Temperature Range 0°C to +100°C (Junction)
Supply Voltage 0.85V (Core)
Mounting Type Surface Mount
Package Style Tray
RoHS Compliance Yes
Lead-Free Status Lead-Free

Integrated Peripherals and Interfaces

The XCZU9CG-1FFVB1156E includes a comprehensive set of integrated peripherals within the processing system, eliminating the need for external components and reducing system cost.

Communication Interfaces

  • USB 2.0 (2× controllers supporting Host/Device/OTG)
  • Gigabit Ethernet MAC (4× Triple-Speed)
  • CAN 2.0B (2× controllers, ISO11898-1 compliant)
  • I2C (2× controllers)
  • SPI (2× controllers)
  • UART (2× controllers)

Storage Interfaces

  • NAND Flash Controller (8-bit/16-bit)
  • Quad SPI Flash Controller
  • SD/SDIO/eMMC Controller (2×)
  • SATA 3.1 (2× ports via GTR)

High-Speed Interfaces

  • PCIe Gen2 x4 (via GTR transceivers)
  • DisplayPort 1.2a (dual-lane)
  • USB 3.0 (2× ports via GTR)

XCZU9CG-1FFVB1156E Application Areas

The versatile architecture of the XCZU9CG-1FFVB1156E makes it suitable for demanding applications across multiple industries.

Industrial Automation and Control

The combination of real-time processing capabilities and programmable I/O makes this device ideal for motor control, robotics, and industrial networking applications. The deterministic response time of the Cortex-R5F RPU ensures reliable operation in safety-critical systems.

Embedded Vision and Image Processing

With 2,520 DSP slices and high-bandwidth memory interfaces, the XCZU9CG-1FFVB1156E accelerates computer vision algorithms, video analytics, and image processing pipelines. The 24 GTH transceivers support multiple high-speed camera interfaces simultaneously.

Edge Computing and AI Inference

System designers leverage the programmable logic to implement custom neural network accelerators, enabling efficient AI inference at the edge. The dual-core ARM Cortex-A53 runs the application framework while the FPGA fabric handles compute-intensive operations.

Communications and Networking

The device supports software-defined radio, 5G infrastructure, and network packet processing applications. High-speed transceivers and flexible I/O enable implementation of custom protocols and interface standards.


Development Tools and Software Support

AMD provides comprehensive development tools for the XCZU9CG-1FFVB1156E through the Vivado Design Suite. This integrated development environment supports hardware design, IP integration, and system-level debugging.

Vivado Design Suite Features

  • IP Integrator for block-based design
  • High-Level Synthesis (HLS) for C/C++ to RTL conversion
  • Integrated Logic Analyzer (ILA) for real-time debugging
  • Power analysis and optimization tools

Software Development

  • PetaLinux for embedded Linux development
  • Vitis unified software platform
  • Bare-metal and FreeRTOS support
  • Extensive driver and middleware libraries

Ordering Information and Part Number Breakdown

XCZU9CG-1FFVB1156E part number decoded:

  • XC: Xilinx Commercial
  • ZU9: Zynq UltraScale+ MPSoC, Size 9
  • CG: Cost-optimized variant (no GPU, no VCU)
  • -1: Speed Grade 1 (Standard performance)
  • FF: Flip-Chip package
  • VB: Lead-free package variant
  • 1156: 1156-ball BGA
  • E: Extended temperature range (0°C to +100°C)

Why Choose the AMD XCZU9CG-1FFVB1156E

The XCZU9CG-1FFVB1156E represents the optimal balance between performance, power consumption, and cost for mid-range embedded applications. The CG variant provides essential processing capabilities without the additional cost of GPU and video codec units found in EG and EV variants.

Engineers benefit from the extensive ecosystem of development tools, reference designs, and technical documentation available from AMD. The device’s pin compatibility with other Zynq UltraScale+ family members enables straightforward design migration as application requirements evolve.

For projects requiring a reliable, high-performance SoC with programmable logic capabilities, the XCZU9CG-1FFVB1156E delivers the features and flexibility needed for successful product development.


Related Products and Accessories

Looking for more options from the Zynq UltraScale+ family? Explore our complete selection of Xilinx FPGA devices, development boards, and accessories to find the perfect solution for your embedded design requirements.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.